{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,7]],"date-time":"2026-01-07T07:47:02Z","timestamp":1767772022362,"version":"3.37.3"},"reference-count":22,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"4","license":[{"start":{"date-parts":[[2023,4,1]],"date-time":"2023-04-01T00:00:00Z","timestamp":1680307200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2023,4,1]],"date-time":"2023-04-01T00:00:00Z","timestamp":1680307200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,4,1]],"date-time":"2023-04-01T00:00:00Z","timestamp":1680307200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100012166","name":"National Key Research and Development Program of China","doi-asserted-by":"publisher","award":["2019YFB2205005"],"award-info":[{"award-number":["2019YFB2205005"]}],"id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst."],"published-print":{"date-parts":[[2023,4]]},"DOI":"10.1109\/tcad.2022.3193875","type":"journal-article","created":{"date-parts":[[2022,7,26]],"date-time":"2022-07-26T19:33:42Z","timestamp":1658864022000},"page":"1346-1350","source":"Crossref","is-referenced-by-count":2,"title":["Equiprobability-Based Local Response Surface Method for High-Sigma Yield Estimation With Both High Accuracy and Efficiency"],"prefix":"10.1109","volume":"42","author":[{"given":"Xiang","family":"Liu","sequence":"first","affiliation":[{"name":"Department of Micro\/Nano-Electronics, Shanghai Jiao Tong University, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Pengpeng","family":"Ren","sequence":"additional","affiliation":[{"name":"Department of Micro\/Nano-Electronics, Shanghai Jiao Tong University, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7046-3455","authenticated-orcid":false,"given":"Haibao","family":"Chen","sequence":"additional","affiliation":[{"name":"Department of Micro\/Nano-Electronics, Shanghai Jiao Tong University, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1138-804X","authenticated-orcid":false,"given":"Zhigang","family":"Ji","sequence":"additional","affiliation":[{"name":"Department of Micro\/Nano-Electronics, Shanghai Jiao Tong University, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-2492-8124","authenticated-orcid":false,"given":"Junhua","family":"Liu","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Peking University, Beijing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7514-0767","authenticated-orcid":false,"given":"Runsheng","family":"Wang","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Peking University, Beijing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4987-6428","authenticated-orcid":false,"given":"Jianfu","family":"Zhang","sequence":"additional","affiliation":[{"name":"School of Engineering, Liverpool John Moores University, Liverpool, U.K."}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ru","family":"Huang","sequence":"additional","affiliation":[{"name":"Department of Micro\/Nano-Electronics, Shanghai Jiao Tong University, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1016\/j.vlsi.2007.09.001"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/tvlsi.2014.2336851"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1007\/s11432-019-2643-5"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1145\/1146909.1146930"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/tcad.2013.2292504"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/iccad.2008.4681593"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2010.5456940"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/isqed.2010.5450410"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/tcad.2015.2404895"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/iccad.2014.7001370"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/tcad.2012.2209884"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.23919\/date.2018.8342002"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/tvlsi.2016.2601606"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1145\/2872334.2872360"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.23919\/date.2019.8714879"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/date.2007.364490"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/vlsi.2008.54"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/irps.2014.6860671"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/43.273749"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/tvlsi.2017.2753139"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1007\/978-0-8176-8292-7"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/iscas.2017.8050316"}],"container-title":["IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/43\/10077488\/09840897.pdf?arnumber=9840897","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,2,1]],"date-time":"2024-02-01T08:52:07Z","timestamp":1706777527000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9840897\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,4]]},"references-count":22,"journal-issue":{"issue":"4"},"URL":"https:\/\/doi.org\/10.1109\/tcad.2022.3193875","relation":{},"ISSN":["0278-0070","1937-4151"],"issn-type":[{"type":"print","value":"0278-0070"},{"type":"electronic","value":"1937-4151"}],"subject":[],"published":{"date-parts":[[2023,4]]}}}