{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,24]],"date-time":"2026-06-24T15:56:13Z","timestamp":1782316573218,"version":"3.54.5"},"reference-count":44,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"7","license":[{"start":{"date-parts":[[2023,7,1]],"date-time":"2023-07-01T00:00:00Z","timestamp":1688169600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2023,7,1]],"date-time":"2023-07-01T00:00:00Z","timestamp":1688169600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,7,1]],"date-time":"2023-07-01T00:00:00Z","timestamp":1688169600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100018058","name":"SK Hynix Inc","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100018058","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst."],"published-print":{"date-parts":[[2023,7]]},"DOI":"10.1109\/tcad.2022.3220711","type":"journal-article","created":{"date-parts":[[2022,11,8]],"date-time":"2022-11-08T20:36:05Z","timestamp":1667939765000},"page":"2377-2390","source":"Crossref","is-referenced-by-count":10,"title":["TRUST: Through-Silicon via Repair Using Switch Matrix Topology"],"prefix":"10.1109","volume":"42","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-6868-0829","authenticated-orcid":false,"given":"Hayoung","family":"Lee","sequence":"first","affiliation":[{"name":"Department of Electrical and Electronic Engineering, Yonsei University, Seoul, South Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Seung Ho","family":"Shin","sequence":"additional","affiliation":[{"name":"Department of Electrical and Electronic Engineering, Yonsei University, Seoul, South Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Younwoo","family":"Yoo","sequence":"additional","affiliation":[{"name":"Department of Electrical and Electronic Engineering, Yonsei University, Seoul, South Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7093-2095","authenticated-orcid":false,"given":"Sungho","family":"Kang","sequence":"additional","affiliation":[{"name":"Department of Electrical and Electronic Engineering, Yonsei University, Seoul, South Korea"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2018.2876906"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2016.2606499"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2016.2558514"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/TR.2015.2410274"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2019.2946243"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2019.2920999"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2019.2927485"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/TR.2017.2778301"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2008.2005988"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2010.2062830"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2012.2228742"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2013.2288637"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2011.2107924"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2018.2818725"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TEST.2013.6651893"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIT.2012.6242474"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2021.3076141"},{"key":"ref39","year":"2019","journal-title":"Memory testing MBIST BIRA & BISR | an insight into algorithms and self repair mechanism"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2020.2995094"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2005.864128"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2014.2343156"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1145\/2463209.2488824"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2020.3025169"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TETC.2020.2969237"},{"key":"ref26","doi-asserted-by":"crossref","first-page":"34","DOI":"10.1109\/TVLSI.2005.863189","article-title":"Efficient built-in redundancy analysis for embedded memories with 2-D redundancy","volume":"14","author":"lu","year":"2006","journal-title":"IEEE Trans Very Large Scale Integr (VLSI) Syst"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2009.2013921"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2017.2775586"},{"key":"ref42","year":"2018","journal-title":"Expanding the Boundaries of the AI Revolution An In-Depth Study of High Bandwidth Memory"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1109\/MDAT.2016.2624283"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2017.2681703"},{"key":"ref44","doi-asserted-by":"publisher","DOI":"10.1016\/j.vlsi.2017.02.002"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2016.2543260"},{"key":"ref43","article-title":"PDK 45nm open cell library","year":"2011","journal-title":"SILVACO"},{"key":"ref28","doi-asserted-by":"crossref","first-page":"34","DOI":"10.1109\/TVLSI.2005.863189","article-title":"Efficient built-in redundancy analysis for embedded memories with 2-D redundancy","volume":"14","author":"lu","year":"2006","journal-title":"IEEE Trans Very Large Scale Integr (VLSI) Syst"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.1985.294737"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2010.2044846"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2012.06.021"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/IITC.2013.6615583"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2009.2034408"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2013.04.003"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/MDAT.2016.2624283"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2010.5490883"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2006.873612"},{"key":"ref40","author":"aho","year":"1974","journal-title":"The Design and Analysis of Computer Algorithms"}],"container-title":["IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/43\/10155504\/09941345.pdf?arnumber=9941345","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,7,10]],"date-time":"2023-07-10T19:20:31Z","timestamp":1689016831000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9941345\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,7]]},"references-count":44,"journal-issue":{"issue":"7"},"URL":"https:\/\/doi.org\/10.1109\/tcad.2022.3220711","relation":{},"ISSN":["0278-0070","1937-4151"],"issn-type":[{"value":"0278-0070","type":"print"},{"value":"1937-4151","type":"electronic"}],"subject":[],"published":{"date-parts":[[2023,7]]}}}