{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,27]],"date-time":"2026-06-27T19:43:41Z","timestamp":1782589421912,"version":"3.54.5"},"reference-count":22,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"5","license":[{"start":{"date-parts":[[2024,5,1]],"date-time":"2024-05-01T00:00:00Z","timestamp":1714521600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2024,5,1]],"date-time":"2024-05-01T00:00:00Z","timestamp":1714521600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,5,1]],"date-time":"2024-05-01T00:00:00Z","timestamp":1714521600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"NSFC","doi-asserted-by":"publisher","award":["62141213"],"award-info":[{"award-number":["62141213"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"NSFC","doi-asserted-by":"publisher","award":["62072177"],"award-info":[{"award-number":["62072177"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100013102","name":"Shanghai Science and Technology Project","doi-asserted-by":"publisher","award":["22QA1403300"],"award-info":[{"award-number":["22QA1403300"]}],"id":[{"id":"10.13039\/501100013102","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst."],"published-print":{"date-parts":[[2024,5]]},"DOI":"10.1109\/tcad.2023.3342606","type":"journal-article","created":{"date-parts":[[2023,12,13]],"date-time":"2023-12-13T19:34:08Z","timestamp":1702496048000},"page":"1618-1622","source":"Crossref","is-referenced-by-count":5,"title":["Revisiting TRIM on High-Density Flash-Based Hybrid Storage Systems"],"prefix":"10.1109","volume":"43","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-3769-1007","authenticated-orcid":false,"given":"Longfei","family":"Luo","sequence":"first","affiliation":[{"name":"Software\/Hardware Co-Design Engineering Research Center, Ministry of Education, and the School of Computer Science and Technology, East China Normal University, Shanghai, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Dingcui","family":"Yu","sequence":"additional","affiliation":[{"name":"Software\/Hardware Co-Design Engineering Research Center, Ministry of Education, and the School of Computer Science and Technology, East China Normal University, Shanghai, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0000-0407-4494","authenticated-orcid":false,"given":"Hang","family":"Li","sequence":"additional","affiliation":[{"name":"Software\/Hardware Co-Design Engineering Research Center, Ministry of Education, and the School of Computer Science and Technology, East China Normal University, Shanghai, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0006-3822-3551","authenticated-orcid":false,"given":"Yunpeng","family":"Song","sequence":"additional","affiliation":[{"name":"Software\/Hardware Co-Design Engineering Research Center, Ministry of Education, and the School of Computer Science and Technology, East China Normal University, Shanghai, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yina","family":"Lv","sequence":"additional","affiliation":[{"name":"Department of Computer Science, City University of Hong Kong, Hong Kong, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5605-5631","authenticated-orcid":false,"given":"Edwin H.-M.","family":"Sha","sequence":"additional","affiliation":[{"name":"Software\/Hardware Co-Design Engineering Research Center, Ministry of Education, and the School of Computer Science and Technology, East China Normal University, Shanghai, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9977-529X","authenticated-orcid":false,"given":"Liang","family":"Shi","sequence":"additional","affiliation":[{"name":"Software\/Hardware Co-Design Engineering Research Center, Ministry of Education, and the School of Computer Science and Technology, East China Normal University, Shanghai, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/gcce.2014.7031128"},{"key":"ref2","first-page":"422","article-title":"Performance analysis of SSD write using TRIM in NTFS and EXT4","volume-title":"Proc. IEEE ICCIT","author":"Kim"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/icce.2017.7889381"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2013.218"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ICCD53106.2021.00020"},{"key":"ref6","first-page":"25","article-title":"Ext4: The next generation of Ext2\/3 filesystem","volume-title":"Proc. LSF","author":"Cao"},{"key":"ref7","first-page":"14","article-title":"FlashVM: Virtual memory management on flash","volume-title":"Proc. USENIX ATC","author":"Saxena"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2020.3027656"},{"key":"ref9","first-page":"273","article-title":"F2fs: A new file system for flash storage","volume-title":"Proc. USENIX FAST","volume":"15","author":"Lee"},{"key":"ref10","volume-title":"Intel 670p","year":"2021"},{"key":"ref11","volume-title":"Micron crucial P1","year":"2018"},{"key":"ref12","volume-title":"How pseudo-SLC mode can make 3D NAND flash more reliable","year":"2019"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/MASCOTS.2019.00025"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2015.2393299"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ICCD53106.2021.00046"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2016.2538182"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1145\/2038642.2038694"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.14257\/astl.2016.135.16"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2017.2693281"},{"key":"ref20","volume-title":"Flexible I\/O tester","year":"2022"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1145\/1995896.1995912"},{"key":"ref22","volume-title":"FileBench","author":"McDougall","year":"2005"}],"container-title":["IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/43\/10506737\/10359162.pdf?arnumber=10359162","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,5,3]],"date-time":"2024-05-03T18:42:01Z","timestamp":1714761721000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10359162\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,5]]},"references-count":22,"journal-issue":{"issue":"5"},"URL":"https:\/\/doi.org\/10.1109\/tcad.2023.3342606","relation":{},"ISSN":["0278-0070","1937-4151"],"issn-type":[{"value":"0278-0070","type":"print"},{"value":"1937-4151","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024,5]]}}}