{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,6]],"date-time":"2026-02-06T23:07:11Z","timestamp":1770419231566,"version":"3.49.0"},"reference-count":35,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"4","license":[{"start":{"date-parts":[[2025,4,1]],"date-time":"2025-04-01T00:00:00Z","timestamp":1743465600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,4,1]],"date-time":"2025-04-01T00:00:00Z","timestamp":1743465600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,4,1]],"date-time":"2025-04-01T00:00:00Z","timestamp":1743465600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100012166","name":"National Key Research and Development Program of China","doi-asserted-by":"publisher","award":["2020YFA0711900"],"award-info":[{"award-number":["2020YFA0711900"]}],"id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100012166","name":"National Key Research and Development Program of China","doi-asserted-by":"publisher","award":["2020YFA0711904"],"award-info":[{"award-number":["2020YFA0711904"]}],"id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China (NSFC) Research","doi-asserted-by":"publisher","award":["62474051"],"award-info":[{"award-number":["62474051"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China (NSFC) Research","doi-asserted-by":"publisher","award":["62141407"],"award-info":[{"award-number":["62141407"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China (NSFC) Research","doi-asserted-by":"publisher","award":["62474050"],"award-info":[{"award-number":["62474050"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China (NSFC) Research","doi-asserted-by":"publisher","award":["62304052"],"award-info":[{"award-number":["62304052"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst."],"published-print":{"date-parts":[[2025,4]]},"DOI":"10.1109\/tcad.2024.3473829","type":"journal-article","created":{"date-parts":[[2024,10,3]],"date-time":"2024-10-03T17:22:07Z","timestamp":1727976127000},"page":"1489-1502","source":"Crossref","is-referenced-by-count":3,"title":["pPIRW: An Efficient and Accurate Precalculation Path Integral Random Walk Solver for Steady-State Thermal Simulation With Robin Boundary Conditions"],"prefix":"10.1109","volume":"44","author":[{"ORCID":"https:\/\/orcid.org\/0009-0002-2201-8378","authenticated-orcid":false,"given":"Zhixuan","family":"Dong","sequence":"first","affiliation":[{"name":"Microelectronics Department, State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai, China"}]},{"given":"Longlong","family":"Yang","sequence":"additional","affiliation":[{"name":"Microelectronics Department, State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai, China"}]},{"given":"Cuiyang","family":"Ding","sequence":"additional","affiliation":[{"name":"Microelectronics Department, State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-8936-3945","authenticated-orcid":false,"given":"Changhao","family":"Yan","sequence":"additional","affiliation":[{"name":"Microelectronics Department, State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7315-3150","authenticated-orcid":false,"given":"Zhaori","family":"Bi","sequence":"additional","affiliation":[{"name":"Microelectronics Department, State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6101-675X","authenticated-orcid":false,"given":"Sheng-Guo","family":"Wang","sequence":"additional","affiliation":[{"name":"Department of Engineering Technology, University of North Carolina at Charlotte, Charlotte, NC, USA"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-2648-5232","authenticated-orcid":false,"given":"Dian","family":"Zhou","sequence":"additional","affiliation":[{"name":"Microelectronics Department, State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-8097-4053","authenticated-orcid":false,"given":"Xuan","family":"Zeng","sequence":"additional","affiliation":[{"name":"Microelectronics Department, State Key Laboratory of Integrated Chips and Systems, Fudan University, Shanghai, China"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1007\/978-0-387-76534-1_14"},{"key":"ref2","volume-title":"Ansys.","year":"2018"},{"key":"ref3","volume-title":"COMSOL.","year":"2022"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1145\/3309544"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.7873\/DATE.2015.0328"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2021.3079166"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1145\/980152.980157"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2010.5653749"},{"key":"ref9","first-page":"1","article-title":"Compact transient thermal model for 3D ICs with liquid cooling via enhanced heat transfer cavity geometries","volume-title":"Proc. 16th Int. Workshop Thermal Investigations ICs Syst. (THERMINIC)","author":"Sridhar"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2021.3074613"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/MLCAD55463.2022.9900086"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-030-77977-1_36"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/DAC56929.2023.10247998"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1002\/(SICI)1097-0207(19970215)40:3<387::AID-NME69>3.0.CO;2-D"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1090\/S0025-5718-1950-0038138-X"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/SISPAD.2000.871212"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ASICON.2009.5351279"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2006.243773"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/CADCG.2009.5246852"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2014.6742996"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2002.1004232"},{"key":"ref22","first-page":"1","article-title":"A high-precision stochastic solver for steady-state thermal analysis with fourier heat transfer robin boundary conditions","volume-title":"Proc. 41st ACM\/IEEE Int. Conf. Comput.-Aided Design (ICCAD)","author":"Yang"},{"key":"ref23","volume-title":"Reflecting Brownian Motion, Boundary Local Time and the Neumann Problem","author":"Hsu","year":"1984"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1007\/BF01217746"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.4310\/CMS.2017.v15.n1.a11"},{"key":"ref26","volume-title":"Monte Carlo Methods in Boundary Value Problems","volume":"274","author":"Sabelfeld","year":"1991"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/MDAT.2020.2982629"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2018.2878168"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2009.2026357"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2011.2162348"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2019.2896776"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1137\/1106035"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1016\/j.jcp.2022.111862"},{"key":"ref34","volume-title":"Eigen C++ template library","year":"2021"},{"key":"ref35","first-page":"72","article-title":"The PARSEC benchmark suite: Characterization and architectural implications","volume-title":"Proc. 17th Int. Conf. Parallel Archit. Compilation Techn.","author":"Bienia"}],"container-title":["IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/43\/10934961\/10704731.pdf?arnumber=10704731","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,3,24]],"date-time":"2025-03-24T18:24:49Z","timestamp":1742840689000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10704731\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,4]]},"references-count":35,"journal-issue":{"issue":"4"},"URL":"https:\/\/doi.org\/10.1109\/tcad.2024.3473829","relation":{},"ISSN":["0278-0070","1937-4151"],"issn-type":[{"value":"0278-0070","type":"print"},{"value":"1937-4151","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025,4]]}}}