{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,21]],"date-time":"2025-11-21T18:50:31Z","timestamp":1763751031421,"version":"3.45.0"},"reference-count":28,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"7","license":[{"start":{"date-parts":[[2025,7,1]],"date-time":"2025-07-01T00:00:00Z","timestamp":1751328000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,7,1]],"date-time":"2025-07-01T00:00:00Z","timestamp":1751328000000},"content-version":"am","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,7,1]],"date-time":"2025-07-01T00:00:00Z","timestamp":1751328000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,7,1]],"date-time":"2025-07-01T00:00:00Z","timestamp":1751328000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"Rapid-HI (Heterogeneous Integration) Design Institute"},{"name":"NSF Future of Semiconductors (FuSe) Grant","award":["2235414"],"award-info":[{"award-number":["2235414"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst."],"published-print":{"date-parts":[[2025,7]]},"DOI":"10.1109\/tcad.2024.3522878","type":"journal-article","created":{"date-parts":[[2024,12,25]],"date-time":"2024-12-25T14:29:32Z","timestamp":1735136972000},"page":"2439-2450","source":"Crossref","is-referenced-by-count":0,"title":["Real-Time 3-D Thermal Simulation of Advanced Packages via Generative Adversarial Networks"],"prefix":"10.1109","volume":"44","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-5900-6445","authenticated-orcid":false,"given":"Seunghyun","family":"Hwang","sequence":"first","affiliation":[{"name":"Elmore Family School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0009-0008-1268-2332","authenticated-orcid":false,"given":"Michael Joseph","family":"Smith","sequence":"additional","affiliation":[{"name":"School of Mechanical Engineering, Purdue University, West Lafayette, IN, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Vinicius C.","family":"Do Nascimento","sequence":"additional","affiliation":[{"name":"Elmore Family School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2610-3502","authenticated-orcid":false,"given":"Qiang","family":"Qiu","sequence":"additional","affiliation":[{"name":"Elmore Family School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0009-0000-8930-856X","authenticated-orcid":false,"given":"Cheng-Kok","family":"Koh","sequence":"additional","affiliation":[{"name":"Elmore Family School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-0462-1130","authenticated-orcid":false,"given":"Ganesh","family":"Subbarayan","sequence":"additional","affiliation":[{"name":"School of Mechanical Engineering, Purdue University, West Lafayette, IN, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-4080-2716","authenticated-orcid":false,"given":"Dan","family":"Jiao","sequence":"additional","affiliation":[{"name":"Elmore Family School of Electrical and Computer Engineering, Purdue University, West Lafayette, IN, USA"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"volume-title":"Microelectronics and Advanced Packaging Technologies Roadmap","year":"2024","key":"ref1"},{"doi-asserted-by":"publisher","key":"ref2","DOI":"10.1016\/j.microrel.2010.09.031"},{"doi-asserted-by":"publisher","key":"ref3","DOI":"10.23919\/DATE56975.2023.10137172"},{"doi-asserted-by":"publisher","key":"ref4","DOI":"10.1109\/ICCAD.2004.1382591"},{"volume-title":"ABAQUS\/Standard User\u2019s Manual, Version 6.9","year":"2009","author":"Smith","key":"ref5"},{"year":"2024","author":"Smith","article-title":"The development of finite element and neural network based tools for early-stage thermal-mechanical design of semiconductor packages","key":"ref6"},{"doi-asserted-by":"publisher","key":"ref7","DOI":"10.1016\/0893-6080(89)90020-8"},{"doi-asserted-by":"publisher","key":"ref8","DOI":"10.1002\/cnm.1640100303"},{"doi-asserted-by":"publisher","key":"ref9","DOI":"10.1109\/72.712178"},{"doi-asserted-by":"publisher","key":"ref10","DOI":"10.1016\/j.jcp.2018.10.045"},{"doi-asserted-by":"publisher","key":"ref11","DOI":"10.1109\/TPWRS.2022.3162473"},{"doi-asserted-by":"publisher","key":"ref12","DOI":"10.1109\/AP-S\/INC-USNC-URSI52054.2024.10686397"},{"key":"ref13","article-title":"Conditional generative adversarial nets","author":"Mirza","year":"2014","journal-title":"arXiv:1411.1784"},{"doi-asserted-by":"publisher","key":"ref14","DOI":"10.1109\/EPEPS58208.2023.10314947"},{"doi-asserted-by":"publisher","key":"ref15","DOI":"10.1109\/JMMCT.2021.3106539"},{"doi-asserted-by":"publisher","key":"ref16","DOI":"10.1109\/ASP-DAC52403.2022.9712583"},{"doi-asserted-by":"publisher","key":"ref17","DOI":"10.1109\/DAC56929.2023.10247998"},{"key":"ref18","article-title":"A composable autoencoder-based iterative algorithm for accelerating numerical simulations","author":"Ranade","year":"2021","journal-title":"arXiv:2110.03780"},{"doi-asserted-by":"publisher","key":"ref19","DOI":"10.1109\/MLCAD55463.2022.9900086"},{"key":"ref20","first-page":"690","article-title":"Thermal and IR drop analysis using convolutional encoder-decoder networks","volume-title":"Proc. 26th Asia South Pacific Design Autom. Conf. (ASP-DAC)","author":"Chhabria"},{"doi-asserted-by":"publisher","key":"ref21","DOI":"10.23919\/SEMI-THERM50369.2020.9142855"},{"doi-asserted-by":"publisher","key":"ref22","DOI":"10.1109\/ITherm55368.2023.10177600"},{"doi-asserted-by":"publisher","key":"ref23","DOI":"10.1090\/S0025-5718-00-01281-3"},{"doi-asserted-by":"publisher","key":"ref24","DOI":"10.1109\/CVPR.2017.632"},{"doi-asserted-by":"publisher","key":"ref25","DOI":"10.1109\/ICCV.2017.244"},{"doi-asserted-by":"publisher","key":"ref26","DOI":"10.1109\/CVPR.2018.00916"},{"doi-asserted-by":"publisher","key":"ref27","DOI":"10.1007\/978-3-319-24574-4_28"},{"key":"ref28","article-title":"Instance normalization: The missing ingredient for fast stylization","author":"Ulyanov","year":"2016","journal-title":"arXiv:1607.08022"}],"container-title":["IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"],"original-title":[],"link":[{"URL":"https:\/\/ieeexplore.ieee.org\/ielam\/43\/11044910\/10816122-aam.pdf","content-type":"application\/pdf","content-version":"am","intended-application":"syndication"},{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/43\/11044910\/10816122.pdf?arnumber=10816122","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,11,21]],"date-time":"2025-11-21T18:43:13Z","timestamp":1763750593000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10816122\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,7]]},"references-count":28,"journal-issue":{"issue":"7"},"URL":"https:\/\/doi.org\/10.1109\/tcad.2024.3522878","relation":{},"ISSN":["0278-0070","1937-4151"],"issn-type":[{"type":"print","value":"0278-0070"},{"type":"electronic","value":"1937-4151"}],"subject":[],"published":{"date-parts":[[2025,7]]}}}