{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,6,25]],"date-time":"2025-06-25T04:06:01Z","timestamp":1750824361264,"version":"3.41.0"},"reference-count":24,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"7","license":[{"start":{"date-parts":[[2025,7,1]],"date-time":"2025-07-01T00:00:00Z","timestamp":1751328000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,7,1]],"date-time":"2025-07-01T00:00:00Z","timestamp":1751328000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,7,1]],"date-time":"2025-07-01T00:00:00Z","timestamp":1751328000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100020950","name":"National Science and Technology Council (NSTC) of Taiwan","doi-asserted-by":"publisher","award":["113-2640-E-007-001"],"award-info":[{"award-number":["113-2640-E-007-001"]}],"id":[{"id":"10.13039\/501100020950","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001695","name":"Power Semiconductor Manufacturing Corporation","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100001695","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst."],"published-print":{"date-parts":[[2025,7]]},"DOI":"10.1109\/tcad.2024.3524473","type":"journal-article","created":{"date-parts":[[2024,12,31]],"date-time":"2024-12-31T19:33:46Z","timestamp":1735673626000},"page":"2451-2460","source":"Crossref","is-referenced-by-count":0,"title":["Connectivity-Agnostic Built-In Self-Repair of Interconnects in a Chiplet IC"],"prefix":"10.1109","volume":"44","author":[{"given":"Chi","family":"Lai","sequence":"first","affiliation":[{"name":"Electrical Engineering Department, National Tsing Hua University, Hsinchu, Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3721-987X","authenticated-orcid":false,"given":"Shi-Yu","family":"Huang","sequence":"additional","affiliation":[{"name":"Electrical Engineering Department, National Tsing Hua University, Hsinchu, Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/vts52500.2021.9794149"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2008.4681638"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2009.2034408"},{"key":"ref4","first-page":"166","article-title":"Die-to-die interconnect redundancy: Architecture and design issues in 3D-IC","volume-title":"Proc. IEEE Design, Autom., Test Eur.","author":"Hsieh"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2012.2198475"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/DATE.2012.6176602"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/IOLTS.2012.6313847"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1145\/2463209.2488824"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/VTS.2013.6548905"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2015.2432131"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2014.2343156"},{"key":"ref12","first-page":"1291","article-title":"Thermal-aware TSV repair for electromigration in 3D ICs","volume-title":"Proc. Design Autom. Test Eur. Conf.","author":"Wang"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2017.2681703"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2018.2824284"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2018.2876906"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/itc-asia53059.2021.9808672"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/IOLTS.2013.6604053"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2014.2316093"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/ats.2015.21"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/VTS56346.2023.10140006"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1049\/el.2012.0286"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/ETS56758.2023.10174179"},{"key":"ref23","first-page":"1","article-title":"Small-bridging-fault-aware built-in-self-repair for cycle-based interconnects in a chiplet IC using adjusted pulse-vanishing test","volume-title":"Proc. IEEE Int. Test Conf.","author":"Lai"},{"volume-title":"EDA Cloud Cell-Based Flow","key":"ref24"}],"container-title":["IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/43\/11044910\/10818735.pdf?arnumber=10818735","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,6,24]],"date-time":"2025-06-24T06:13:05Z","timestamp":1750745585000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10818735\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,7]]},"references-count":24,"journal-issue":{"issue":"7"},"URL":"https:\/\/doi.org\/10.1109\/tcad.2024.3524473","relation":{},"ISSN":["0278-0070","1937-4151"],"issn-type":[{"type":"print","value":"0278-0070"},{"type":"electronic","value":"1937-4151"}],"subject":[],"published":{"date-parts":[[2025,7]]}}}