{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,31]],"date-time":"2026-03-31T07:41:52Z","timestamp":1774942912909,"version":"3.50.1"},"reference-count":55,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"8","license":[{"start":{"date-parts":[[2025,8,1]],"date-time":"2025-08-01T00:00:00Z","timestamp":1754006400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,8,1]],"date-time":"2025-08-01T00:00:00Z","timestamp":1754006400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,8,1]],"date-time":"2025-08-01T00:00:00Z","timestamp":1754006400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Science Foundation of China","doi-asserted-by":"publisher","award":["62141404"],"award-info":[{"award-number":["62141404"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Science Foundation of China","doi-asserted-by":"publisher","award":["62125401"],"award-info":[{"award-number":["62125401"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Science Foundation of China","doi-asserted-by":"publisher","award":["62034007"],"award-info":[{"award-number":["62034007"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100004826","name":"Natural Science Foundation of Beijing, China","doi-asserted-by":"publisher","award":["Z230002"],"award-info":[{"award-number":["Z230002"]}],"id":[{"id":"10.13039\/501100004826","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100013314","name":"Higher Education Discipline Innovation Project","doi-asserted-by":"publisher","award":["B18001"],"award-info":[{"award-number":["B18001"]}],"id":[{"id":"10.13039\/501100013314","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst."],"published-print":{"date-parts":[[2025,8]]},"DOI":"10.1109\/tcad.2025.3529805","type":"journal-article","created":{"date-parts":[[2025,1,14]],"date-time":"2025-01-14T14:52:55Z","timestamp":1736866375000},"page":"3126-3139","source":"Crossref","is-referenced-by-count":29,"title":["LayoutCopilot: An LLM-Powered Multiagent Collaborative Framework for Interactive Analog Layout Design"],"prefix":"10.1109","volume":"44","author":[{"ORCID":"https:\/\/orcid.org\/0009-0001-0131-6694","authenticated-orcid":false,"given":"Bingyang","family":"Liu","sequence":"first","affiliation":[{"name":"School of Electronics Engineering and Computer Science, Peking University, Beijing, China"}]},{"ORCID":"https:\/\/orcid.org\/0009-0004-2763-545X","authenticated-orcid":false,"given":"Haoyi","family":"Zhang","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Peking University, Beijing, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6201-6110","authenticated-orcid":false,"given":"Xiaohan","family":"Gao","sequence":"additional","affiliation":[{"name":"School of Computer Science and the School of Integrated Circuits, Peking University, Beijing, China"}]},{"given":"Zichen","family":"Kong","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Peking University, Beijing, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2181-9042","authenticated-orcid":false,"given":"Xiyuan","family":"Tang","sequence":"additional","affiliation":[{"name":"Institute for Artificial Intelligence and the School of Integrated Circuits, and the Beijing Advanced Innovation Center for Integrated Circuits, Peking University, Beijing, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0977-2774","authenticated-orcid":false,"given":"Yibo","family":"Lin","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits and the Beijing Advanced Innovation Center for Integrated Circuits, Peking University, Beijing, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7514-0767","authenticated-orcid":false,"given":"Runsheng","family":"Wang","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits and the Beijing Advanced Innovation Center for Integrated Circuits, Peking University, Beijing, China"}]},{"given":"Ru","family":"Huang","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits and the Beijing Advanced Innovation Center for Integrated Circuits, Peking University, Beijing, China"}]}],"member":"263","reference":[{"key":"ref1","volume-title":"Virtuoso Layout Suite","year":"2023"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/4.391116"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.1996.510537"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.1990.129880"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2010.5654239"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1145\/3036669.3036678"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.1993.580090"},{"key":"ref8","first-page":"1","article-title":"Simultaneous analog placement and routing with current flow and current density considerations","volume-title":"Proc. 50th Annu. Design Autom. Conf.","author":"Ou"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1016\/j.vlsi.2016.05.008"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1145\/3299902.3309751"},{"key":"ref11","first-page":"1","article-title":"Coupling-aware length-ratio-matching routing for capacitor arrays in analog integrated circuits","volume-title":"Proc. 50th Annu. Design Autom. Conf.","author":"Ho"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ISVLSI49217.2020.00015"},{"key":"ref13","first-page":"1","article-title":"A customized graph neural network model for guiding analog IC placement","volume-title":"Proc. 39th Int. Conf. Comput.-Aided Design","author":"Li"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS45731.2020.9181148"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1145\/3316781.3323471"},{"issue":"2","key":"ref16","doi-asserted-by":"crossref","first-page":"8","DOI":"10.1109\/MDAT.2020.3042177","article-title":"ALIGN: A system for automating analog layout","volume":"38","author":"Dhar","year":"2021","journal-title":"IEEE Design Test"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1145\/3569052.3578916"},{"key":"ref18","first-page":"1","article-title":"MAGICAL: Toward fully automated analog IC layout leveraging human and machine intelligence: Invited paper","volume-title":"Proc. IEEE\/ACM Int. Conf. Comput.-Aided Design (ICCAD)","author":"Xu"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/MDAT.2020.3024153"},{"key":"ref20","first-page":"1","article-title":"MAGICAL 1.0: An open-source fully-automated AMS layout synthesis framework verified with a 40-nm 1GS\/s \u03c3\u03b4 ADC","volume-title":"Proc. IEEE Custom Integr. Circuits Conf. (CICC)","author":"Chen"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/DAC18074.2021.9586234"},{"issue":"3","key":"ref22","doi-asserted-by":"crossref","first-page":"698","DOI":"10.1109\/TCAD.2022.3190234","article-title":"Interactive analog layout editing with instant placement and routing legalization","volume":"42","author":"Gao","year":"2023","journal-title":"IEEE Trans. Comput.-Aided Design Integr. Circuits Syst."},{"key":"ref23","first-page":"1877","article-title":"Language models are few-shot learners","volume-title":"Proc. 34th Int. Conf. Neural Inf. Process. Syst.","author":"Brown"},{"key":"ref24","article-title":"LLaMA: Open and efficient foundation language models","author":"Touvron","year":"2023","journal-title":"arXiv:2302.13971"},{"key":"ref25","article-title":"Llama 2: Open foundation and fine-tuned chat models","author":"Touvron","year":"2023","journal-title":"arXiv:2307.09288"},{"key":"ref26","article-title":"GPT-4 technical report","volume-title":"arXiv:2303.08774","author":"Achiam","year":"2024"},{"key":"ref27","volume-title":"Claude 2","year":"2023"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/ICVD.2005.88"},{"key":"ref29","first-page":"9459","article-title":"Retrieval-augmented generation for knowledge-intensive NLP tasks","volume-title":"Proc. 34th Int. Conf. Neural Inf. Process. Syst.","author":"Lewis"},{"key":"ref30","article-title":"AutoGen: Enabling next-gen LLM applications via multi-agent conversation","author":"Wu","year":"2023","journal-title":"arXiv:2308.08155"},{"key":"ref31","article-title":"LLM harmony: Multi-agent communication for problem solving","author":"Rasal","year":"2024","journal-title":"arXiv:2401.01312"},{"key":"ref32","article-title":"MetaGPT: Meta programming for a multi-agent collaborative framework","author":"Hong","year":"2023","journal-title":"arXiv:2308.00352"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/LAD62341.2024.10691788"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1145\/3643681"},{"key":"ref35","article-title":"RTLLM: An open-source benchmark for design RTL generation with large language model","author":"Lu","year":"2023","journal-title":"arXiv:2308.05345"},{"key":"ref36","first-page":"1","article-title":"Invited paper: VerilogEval: Evaluating large language models for verilog code generation","volume-title":"Proc. IEEE\/ACM Int. Conf. Comput. Aided Design (ICCAD)","author":"Liu"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1145\/3649329.3657353"},{"key":"ref38","article-title":"ChipNeMo: Domain-adapted LLMs for chip design","author":"Liu","year":"2024","journal-title":"arXiv:2311.00176"},{"key":"ref39","article-title":"ChatEDA: A large language model powered autonomous agent for EDA","author":"He","year":"2024","journal-title":"arXiv:2308.10204"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1145\/3649329.3657361"},{"key":"ref41","article-title":"A systematic survey of prompt engineering in large language models: Techniques and applications","author":"Sahoo","year":"2024","journal-title":"arXiv:2402.07927"},{"key":"ref42","doi-asserted-by":"publisher","DOI":"10.18653\/v1\/2024.emnlp-main.64"},{"key":"ref43","first-page":"24824","article-title":"Chain-of-thought prompting elicits reasoning in large language models","volume-title":"Proc. 36th Int. Conf. Neural Inf. Process. Syst.","volume":"35","author":"Wei"},{"key":"ref44","article-title":"Least-to-most prompting enables complex reasoning in large language models","author":"Zhou","year":"2022","journal-title":"arXiv:2205.10625"},{"key":"ref45","first-page":"46534","article-title":"Self-refine: Iterative refinement with self-feedback","volume-title":"Proc. 37th Int. Conf. Neural Inf. Process. Syst.","volume":"36","author":"Madaan"},{"key":"ref46","doi-asserted-by":"publisher","DOI":"10.1609\/aaai.v38i16.29710"},{"key":"ref47","doi-asserted-by":"publisher","DOI":"10.1007\/s11432-024-4222-0"},{"key":"ref48","first-page":"51991","article-title":"Camel: Communicative agents for \u2019mind\u2019 exploration of large scale language model society","volume-title":"Proc. 37th Int. Conf. Neural Inf. Process. Syst.","author":"Li"},{"key":"ref49","article-title":"Multi-agent collaboration: Harnessing the power of intelligent LLM agents","author":"Talebirad","year":"2023","journal-title":"arXiv:2306.03314"},{"key":"ref50","article-title":"Autogen: Enabling next-gen LLM applications via multi-agent conversation framework","author":"Wu","year":"2023","journal-title":"arXiv:2308.08155"},{"key":"ref51","article-title":"AgentVerse: Facilitating multi-agent collaboration and exploring emergent behaviors in agents","author":"Chen","year":"2023","journal-title":"arXiv:2308.10848"},{"key":"ref52","article-title":"MetaGPT: Meta programming for multi-agent collaborative framework","author":"Hong","year":"2023","journal-title":"arXiv:2308.00352"},{"key":"ref53","volume-title":"Design of Analog CMOS Integrated Circuits","author":"Razavi","year":"2001"},{"key":"ref54","doi-asserted-by":"publisher","DOI":"10.1007\/978-1-4757-4501-6"},{"key":"ref55","volume-title":"Introducing the Next Generation of Claude","year":"2024"}],"container-title":["IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/43\/11085011\/10841395.pdf?arnumber=10841395","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,7,21]],"date-time":"2025-07-21T18:08:45Z","timestamp":1753121325000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10841395\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,8]]},"references-count":55,"journal-issue":{"issue":"8"},"URL":"https:\/\/doi.org\/10.1109\/tcad.2025.3529805","relation":{},"ISSN":["0278-0070","1937-4151"],"issn-type":[{"value":"0278-0070","type":"print"},{"value":"1937-4151","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025,8]]}}}