{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,8,5]],"date-time":"2026-08-05T18:01:41Z","timestamp":1785952901619,"version":"3.56.0"},"reference-count":66,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"8","license":[{"start":{"date-parts":[[2025,8,1]],"date-time":"2025-08-01T00:00:00Z","timestamp":1754006400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,8,1]],"date-time":"2025-08-01T00:00:00Z","timestamp":1754006400000},"content-version":"am","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,8,1]],"date-time":"2025-08-01T00:00:00Z","timestamp":1754006400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,8,1]],"date-time":"2025-08-01T00:00:00Z","timestamp":1754006400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"CoCoSys, one of seven centers in JUMP 2.0, a Semiconductor Research Corporation (SRC) Program sponsored by DARPA"},{"DOI":"10.13039\/100000015","name":"U.S. Department of Energy","doi-asserted-by":"crossref","award":["DE-AC05-00OR22725"],"award-info":[{"award-number":["DE-AC05-00OR22725"]}],"id":[{"id":"10.13039\/100000015","id-type":"DOI","asserted-by":"crossref"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst."],"published-print":{"date-parts":[[2025,8]]},"DOI":"10.1109\/tcad.2025.3531348","type":"journal-article","created":{"date-parts":[[2025,1,17]],"date-time":"2025-01-17T13:36:47Z","timestamp":1737121007000},"page":"3208-3221","source":"Crossref","is-referenced-by-count":8,"title":["HISIM: Analytical Performance Modeling and Design Space Exploration of 2.5D\/3D Integration for AI Computing"],"prefix":"10.1109","volume":"44","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-5249-0705","authenticated-orcid":false,"given":"Zhenyu","family":"Wang","sequence":"first","affiliation":[{"name":"School of Electrical, Computer, and Energy Engineering, Arizona State University, Tempe, AZ, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0006-3688-6941","authenticated-orcid":false,"given":"Pragnya Sudershan","family":"Nalla","sequence":"additional","affiliation":[{"name":"Department of Electrical and Computer Engineering, University of Minnesota, Minneapolis, MN, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jingbo","family":"Sun","sequence":"additional","affiliation":[{"name":"School of Electrical, Computer, and Energy Engineering, Arizona State University, Tempe, AZ, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8679-9842","authenticated-orcid":false,"given":"A. Alper","family":"Goksoy","sequence":"additional","affiliation":[{"name":"Department of Electrical and Computer Engineering, University of Wisconsin-Madison, Madison, WI, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9294-1603","authenticated-orcid":false,"given":"Sumit K.","family":"Mandal","sequence":"additional","affiliation":[{"name":"Department of Computer Science and Automation, Indian Institute of Science, Bengaluru, India"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-4551-7789","authenticated-orcid":false,"given":"Jae-Sun","family":"Seo","sequence":"additional","affiliation":[{"name":"Department of Electrical and Computer Engineering, Cornell Tech, New York, NY, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3273-0724","authenticated-orcid":false,"given":"Vidya A.","family":"Chhabria","sequence":"additional","affiliation":[{"name":"School of Electrical, Computer, and Energy Engineering, Arizona State University, Tempe, AZ, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7411-8923","authenticated-orcid":false,"given":"Jeff","family":"Zhang","sequence":"additional","affiliation":[{"name":"School of Electrical, Computer, and Energy Engineering, Arizona State University, Tempe, AZ, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9859-7778","authenticated-orcid":false,"given":"Chaitali","family":"Chakrabarti","sequence":"additional","affiliation":[{"name":"School of Electrical, Computer, and Energy Engineering, Arizona State University, Tempe, AZ, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5045-5535","authenticated-orcid":false,"given":"Umit Y.","family":"Ogras","sequence":"additional","affiliation":[{"name":"Department of Electrical and Computer Engineering, University of Wisconsin-Madison, Madison, WI, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6968-1180","authenticated-orcid":false,"given":"Yu","family":"Cao","sequence":"additional","affiliation":[{"name":"Department of Electrical and Computer Engineering, University of Minnesota, Minneapolis, MN, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1038\/s41586-021-04362-w"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/MCAS.2024.3349669"},{"key":"ref3","article-title":"An image is worth \u00d7 words: Transformers for image recognition at scale","author":"Dosovitskiy","year":"2020","journal-title":"arXiv:2010.11929"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1609\/aaai.v38i7.28560"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1145\/3476999"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.23919\/DATE56975.2023.10137076"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JETCAS.2022.3169899"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/A-SSCC58667.2023.10347978"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1145\/3007787.3001139"},{"key":"ref10","volume-title":"Heterogeneous integration roadmap 2020 edition.","year":"2020"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/cicc51472.2021.9431555"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2960207"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2960488"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2013.2279052"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2011.5898576"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ectc.2016.201"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2011.5898527"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/ectc.2016.350"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/ectc.2016.63"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2611497"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TADVP.2005.853271"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2007.373897"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2012.6248847"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/ICEP-IAAC.2015.7111128"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM19573.2019.8993637"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM45625.2022.10019406"},{"key":"ref27","first-page":"SC2","article-title":"Heterogeneous system partitioning and the 3D interconnect technology landscape","volume-title":"Proc. Symp. VLSI Technol. Circuits","author":"Beyne"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM13553.2020.9372120"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/ISOCC.2016.7799847"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2018.2789723"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2017.2729466"},{"key":"ref32","volume-title":"Booksim 2.0 User\u2019s Guide","author":"Jiang","year":"2010"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1145\/3472754"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM13553.2020.9372091"},{"key":"ref35","first-page":"1","article-title":"Big-little Chiplets for in-memory acceleration of DNNs: A scalable heterogeneous architecture","volume-title":"Proc. 41st IEEE\/ACM Int. Conf. Comput.-Aided Design","author":"Krishnan"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2018.8310173"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1145\/3352460.3358302"},{"key":"ref38","volume-title":"AIB 2.0 Specification","year":"2019"},{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2022.3207195"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.1994.367660"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2021.114412"},{"key":"ref42","doi-asserted-by":"publisher","DOI":"10.1109\/IEMT.2000.910714"},{"key":"ref43","doi-asserted-by":"publisher","DOI":"10.1109\/MM.2007.59"},{"key":"ref44","doi-asserted-by":"publisher","DOI":"10.1109\/LSSC.2024.3375110"},{"key":"ref45","doi-asserted-by":"publisher","DOI":"10.1109\/ISCA.2016.12"},{"key":"ref46","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2021.3111857"},{"key":"ref47","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM19573.2019.8993641"},{"key":"ref48","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2021.3097035"},{"key":"ref49","doi-asserted-by":"publisher","DOI":"10.1109\/AICAS51828.2021.9458501"},{"key":"ref50","article-title":"Very deep convolutional networks for large-scale image recognition","author":"Simonyan","year":"2015","journal-title":"arXiv:1409.1556"},{"key":"ref51","article-title":"MobileNets: Efficient convolutional neural networks for mobile vision applications","author":"Howard","year":"2017","journal-title":"arXiv:1704.04861"},{"key":"ref52","article-title":"Scale-Sim: Systolic CNN accelerator simulator","author":"Samajdar","year":"2018","journal-title":"arXiv:1811.02883"},{"key":"ref53","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2006.91"},{"key":"ref54","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2010.2101892"},{"key":"ref55","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2008.2010691"},{"key":"ref56","doi-asserted-by":"publisher","DOI":"10.1109\/LES.2015.2402197"},{"key":"ref57","volume-title":"Aib-phy-hardware RTL source codes.","year":"2019"},{"key":"ref58","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2023.3343457"},{"key":"ref59","doi-asserted-by":"publisher","DOI":"10.1145\/1127908.1127915"},{"key":"ref60","doi-asserted-by":"publisher","DOI":"10.1109\/STHERM.2009.4810784"},{"key":"ref61","doi-asserted-by":"publisher","DOI":"10.1109\/EPTC.2009.5416563"},{"key":"ref62","doi-asserted-by":"publisher","DOI":"10.1109\/ICEPT.2010.5582840"},{"key":"ref63","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3036341"},{"key":"ref64","doi-asserted-by":"publisher","DOI":"10.1109\/TCS.1975.1084079"},{"key":"ref65","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2010.5419789"},{"key":"ref66","doi-asserted-by":"publisher","DOI":"10.1109\/ASP-DAC58780.2024.10473875"}],"container-title":["IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"],"original-title":[],"link":[{"URL":"https:\/\/ieeexplore.ieee.org\/ielam\/43\/11085011\/10844846-aam.pdf","content-type":"application\/pdf","content-version":"am","intended-application":"syndication"},{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/43\/11085011\/10844846.pdf?arnumber=10844846","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,7,19]],"date-time":"2025-07-19T04:49:00Z","timestamp":1752900540000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10844846\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,8]]},"references-count":66,"journal-issue":{"issue":"8"},"URL":"https:\/\/doi.org\/10.1109\/tcad.2025.3531348","relation":{},"ISSN":["0278-0070","1937-4151"],"issn-type":[{"value":"0278-0070","type":"print"},{"value":"1937-4151","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025,8]]}}}