{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,10,7]],"date-time":"2026-10-07T16:36:53Z","timestamp":1791391013790,"version":"4.3.3"},"reference-count":46,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"9","license":[{"start":{"date-parts":[[2025,9,1]],"date-time":"2025-09-01T00:00:00Z","timestamp":1756684800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,9,1]],"date-time":"2025-09-01T00:00:00Z","timestamp":1756684800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,9,1]],"date-time":"2025-09-01T00:00:00Z","timestamp":1756684800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"University Synergy Innovation Program of Anhui Province","award":["GXXT-2022-080"],"award-info":[{"award-number":["GXXT-2022-080"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst."],"published-print":{"date-parts":[[2025,9]]},"DOI":"10.1109\/tcad.2025.3541010","type":"journal-article","created":{"date-parts":[[2025,2,11]],"date-time":"2025-02-11T13:26:25Z","timestamp":1739280385000},"page":"3581-3591","source":"Crossref","is-referenced-by-count":10,"title":["Reconfigurable Radiation-Hardened SRAM Cell Design for Different Radiation Environments"],"prefix":"10.1109","volume":"44","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-9596-8142","authenticated-orcid":false,"given":"Na","family":"Bai","sequence":"first","affiliation":[{"name":"School of Integrated Circuits, Anhui University, Hefei, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0007-3961-8069","authenticated-orcid":false,"given":"Fudong","family":"Wang","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Anhui University, Hefei, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-0861-1802","authenticated-orcid":false,"given":"Yaohua","family":"Xu","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Anhui University, Hefei, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Shaowei","family":"Wang","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Anhui University, Hefei, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8305-604X","authenticated-orcid":false,"given":"Xiaoqing","family":"Wen","sequence":"additional","affiliation":[{"name":"School of Computer Science and Systems Engineering, Kyushu Institute of Technology, Fukuoka, Japan"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/tencon58879.2023.10322466"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/tcsi.2020.3018328"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/iscas48785.2022.9937314"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/latw.2015.7102522"},{"key":"ref5","first-page":"1001","article-title":"An improvised voter architecture for TMR with reduced area overhead","volume-title":"Proc. 3rd Int. Conf. Intell. Comput. Instrum. Control Technol. (ICICICT)","author":"Deepa"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ahs.2015.7231165"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/eeei.2014.7005796"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/iciea58696.2023.10241793"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/irps45951.2020.9128910"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1007\/s10470-020-01786-8"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ted.2023.3346372"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2009.2032090"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2017.2788439"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/vlsi-soc54400.2022.9939638"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/nbis.2010.86"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/sbcci.2013.6644856"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1587\/elex.9.140"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/tdmr.2023.3346752"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/irps.2018.8353691"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.3390\/electronics13132551"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1002\/cta.3889"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/radecs55911.2022.10412365"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/tdmr.2022.3175324"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2015.11.009"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/cstic.2016.7464080"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/lascas60203.2024.10506174"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/tcsi.2022.3147675"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2015.11.009"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/ted.2019.2942493"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1016\/j.mejo.2020.104843"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/tcsi.2018.2872507"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/iceice.2011.5777312"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/tns.2023.3247174"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1016\/j.mejo.2012.05.014"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/ted.2021.3067855"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2009.2032698"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1016\/j.mejo.2023.105954"},{"key":"ref38","volume-title":"Digital Integrated Circuits: A Design Perspective","author":"Rabaey","year":"2003"},{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1109\/vlsi-soc57769.2023.10321888"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1109\/23.488777"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1109\/tvlsi.2018.2879341"},{"key":"ref42","doi-asserted-by":"publisher","DOI":"10.1109\/tns.2016.2634604"},{"key":"ref43","doi-asserted-by":"publisher","DOI":"10.1109\/icccnt56998.2023.10307771"},{"key":"ref44","doi-asserted-by":"publisher","DOI":"10.1109\/iceca52323.2021.9676022"},{"key":"ref45","doi-asserted-by":"publisher","DOI":"10.1109\/uksim.2011.108"},{"key":"ref46","doi-asserted-by":"publisher","DOI":"10.1109\/inocon50539.2020.9298431"}],"container-title":["IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/43\/11133574\/10879546.pdf?arnumber=10879546","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,11,21]],"date-time":"2025-11-21T18:43:17Z","timestamp":1763750597000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10879546\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,9]]},"references-count":46,"journal-issue":{"issue":"9"},"URL":"https:\/\/doi.org\/10.1109\/tcad.2025.3541010","relation":{},"ISSN":["0278-0070","1937-4151"],"issn-type":[{"value":"0278-0070","type":"print"},{"value":"1937-4151","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025,9]]}}}