{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,8,18]],"date-time":"2026-08-18T00:27:39Z","timestamp":1787012859832,"version":"build-2736575974"},"reference-count":37,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"10","license":[{"start":{"date-parts":[[2025,10,1]],"date-time":"2025-10-01T00:00:00Z","timestamp":1759276800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,10,1]],"date-time":"2025-10-01T00:00:00Z","timestamp":1759276800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,10,1]],"date-time":"2025-10-01T00:00:00Z","timestamp":1759276800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"Major Key Project of PCL","award":["PCL2023A03"],"award-info":[{"award-number":["PCL2023A03"]}]},{"DOI":"10.13039\/501100003392","name":"Natural Science Foundation of Fujian Province","doi-asserted-by":"publisher","award":["2024J09045"],"award-info":[{"award-number":["2024J09045"]}],"id":[{"id":"10.13039\/501100003392","id-type":"DOI","asserted-by":"publisher"}]},{"name":"National Key Research and Development Program of China","award":["2023YFA1011302"],"award-info":[{"award-number":["2023YFA1011302"]}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62174033"],"award-info":[{"award-number":["62174033"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62376099"],"award-info":[{"award-number":["62376099"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003453","name":"Natural Science Foundation of Guangdong Province","doi-asserted-by":"publisher","award":["2024A1515010989"],"award-info":[{"award-number":["2024A1515010989"]}],"id":[{"id":"10.13039\/501100003453","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst."],"published-print":{"date-parts":[[2025,10]]},"DOI":"10.1109\/tcad.2025.3549355","type":"journal-article","created":{"date-parts":[[2025,3,7]],"date-time":"2025-03-07T13:39:44Z","timestamp":1741354784000},"page":"3948-3961","source":"Crossref","is-referenced-by-count":2,"title":["iCTS: Iterative and Hierarchical Clock Tree Synthesis With Skew-Latency-Load Tree"],"prefix":"10.1109","volume":"44","author":[{"ORCID":"https:\/\/orcid.org\/0009-0008-2916-0493","authenticated-orcid":false,"given":"Weiguo","family":"Li","sequence":"first","affiliation":[{"name":"School of Software Engineering, South China University of Technology, Guangzhou, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Zhipeng","family":"Huang","sequence":"additional","affiliation":[{"name":"Beijing Institute of Open Source Chip, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6406-4810","authenticated-orcid":false,"given":"Bei","family":"Yu","sequence":"additional","affiliation":[{"name":"Department of Computer Science and Engineering, The Chinese University of Hong Kong, Shatin, SAR, Hong Kong"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-8698-0024","authenticated-orcid":false,"given":"Wenxing","family":"Zhu","sequence":"additional","affiliation":[{"name":"Center for Discrete Mathematics and Theoretical Computer Science, Fuzhou University, Fuzhou, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4769-1526","authenticated-orcid":false,"given":"Jian","family":"Chen","sequence":"additional","affiliation":[{"name":"School of Software Engineering, South China University of Technology, Guangzhou, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8533-2247","authenticated-orcid":false,"given":"Zhixue","family":"He","sequence":"additional","affiliation":[{"name":"Pengcheng Laboratory, Shenzhen, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7145-9391","authenticated-orcid":false,"given":"Xingquan","family":"Li","sequence":"additional","affiliation":[{"name":"Pengcheng Laboratory, Shenzhen, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/4.293111"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1145\/2209291.2209306"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1145\/640000.640042"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2012.6187528"},{"key":"ref5","volume-title":"Innovus.","year":"2023"},{"key":"ref6","volume-title":"Circuits, Interconnections, and Packaging for VLSI","author":"Bakoglu","year":"1990"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/82.204128"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1145\/293625.293628"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1145\/567270.567271"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2018.2889756"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2007.907068"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1137\/13094791X"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2004.1283704"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2004.825875"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1145\/1123008.1123038"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1145\/1837274.1837297"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1145\/1837274.1837296"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1145\/1391469.1391588"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/iccd.2005.17"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/ICM.2008.5393823"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/ISQED.2006.39"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1145\/640000.640010"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/ICCD.2014.6974686"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2016.2539926"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2018.2888958"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2019.2894653"},{"key":"ref27","first-page":"337292","article-title":"Test challenges for deep sub-micron technologies","volume-title":"Proc. DAC","author":"Cheng"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1063\/1.1697872"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1007\/978-0-387-93820-2"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2004.825861"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1145\/3649329.3658243"},{"key":"ref32","volume-title":"OpenROAD.","year":"2019"},{"key":"ref33","volume-title":"ISCAS\u201989 benchmarks circuits.","year":"1989"},{"key":"ref34","volume-title":"OpenLane CI designs.","year":"2023"},{"key":"ref35","volume-title":"OpenCores: Open source IP-cores.","year":"2023"},{"key":"ref36","volume-title":"Synopsys inc. design compiler.","year":"2023"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/ASP-DAC58780.2024.10473983"}],"container-title":["IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/43\/11155107\/10916748.pdf?arnumber=10916748","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,9,30]],"date-time":"2025-09-30T13:24:21Z","timestamp":1759238661000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10916748\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,10]]},"references-count":37,"journal-issue":{"issue":"10"},"URL":"https:\/\/doi.org\/10.1109\/tcad.2025.3549355","relation":{},"ISSN":["0278-0070","1937-4151"],"issn-type":[{"value":"0278-0070","type":"print"},{"value":"1937-4151","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025,10]]}}}