{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,11,24]],"date-time":"2025-11-24T19:58:16Z","timestamp":1764014296279,"version":"3.45.0"},"reference-count":21,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"12","license":[{"start":{"date-parts":[[2025,12,1]],"date-time":"2025-12-01T00:00:00Z","timestamp":1764547200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,12,1]],"date-time":"2025-12-01T00:00:00Z","timestamp":1764547200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,12,1]],"date-time":"2025-12-01T00:00:00Z","timestamp":1764547200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"National Key Research and Development Program of China","award":["2023YFB4403502"],"award-info":[{"award-number":["2023YFB4403502"]}]},{"DOI":"10.13039\/501100001809","name":"NSFC","doi-asserted-by":"publisher","award":["62274106"],"award-info":[{"award-number":["62274106"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst."],"published-print":{"date-parts":[[2025,12]]},"DOI":"10.1109\/tcad.2025.3568777","type":"journal-article","created":{"date-parts":[[2025,5,9]],"date-time":"2025-05-09T14:00:28Z","timestamp":1746799228000},"page":"4740-4751","source":"Crossref","is-referenced-by-count":0,"title":["An Ultraspeed Middle Voltage and Timing Analyzer With Near-SPICE Accuracy for Charge-Recycling Buses"],"prefix":"10.1109","volume":"44","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-5436-0066","authenticated-orcid":false,"given":"Xiangyu","family":"Ran","sequence":"first","affiliation":[{"name":"Department of Micro-Nano Electronics, Shanghai Jiao Tong University, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9954-9025","authenticated-orcid":false,"given":"Chuxiong","family":"Lin","sequence":"additional","affiliation":[{"name":"Department of Micro-Nano Electronics, Shanghai Jiao Tong University, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-0736-5697","authenticated-orcid":false,"given":"Yuxuan","family":"Qin","sequence":"additional","affiliation":[{"name":"Department of Micro-Nano Electronics, Shanghai Jiao Tong University, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9147-3756","authenticated-orcid":false,"given":"Jieyu","family":"Li","sequence":"additional","affiliation":[{"name":"Department of Micro-Nano Electronics, Shanghai Jiao Tong University, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0009-0003-5556-9616","authenticated-orcid":false,"given":"Ling","family":"Yang","sequence":"additional","affiliation":[{"name":"Battery Management System and Optical Communication Products Department of China Technical Group, Analog Devices, Beijing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7753-644X","authenticated-orcid":false,"given":"Weifeng","family":"He","sequence":"additional","affiliation":[{"name":"Department of Micro-Nano Electronics, Shanghai Jiao Tong University, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/5.920580"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2016.7417954"},{"key":"ref3","first-page":"369","article-title":"Low swing signaling using a dynamic diode-connected driver","volume-title":"Proc. 27th Eur. Solid-State Circuits Conf.","author":"Ferretti"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2008.2004549"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2005.857351"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2005.862351"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2009.4977310"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2008.2002682"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2012.2185835"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2013.6487727"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2774276"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC19947.2020.9063158"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2007.910807"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2009.2036761"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2010.5433993"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2014.2381637"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2782082"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42614.2022.9731653"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/4.375962"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2013.6487787"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2003.821549"}],"container-title":["IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/43\/11263962\/10994426.pdf?arnumber=10994426","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,11,24]],"date-time":"2025-11-24T19:00:26Z","timestamp":1764010826000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10994426\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,12]]},"references-count":21,"journal-issue":{"issue":"12"},"URL":"https:\/\/doi.org\/10.1109\/tcad.2025.3568777","relation":{},"ISSN":["0278-0070","1937-4151"],"issn-type":[{"type":"print","value":"0278-0070"},{"type":"electronic","value":"1937-4151"}],"subject":[],"published":{"date-parts":[[2025,12]]}}}