{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,24]],"date-time":"2026-03-24T09:06:19Z","timestamp":1774343179178,"version":"3.50.1"},"reference-count":7,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"4","license":[{"start":{"date-parts":[[2026,4,1]],"date-time":"2026-04-01T00:00:00Z","timestamp":1775001600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2026,4,1]],"date-time":"2026-04-01T00:00:00Z","timestamp":1775001600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,4,1]],"date-time":"2026-04-01T00:00:00Z","timestamp":1775001600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"Institute of Information & communications Technology Planning & Evaluation (IITP) under the artificial intelligence semiconductor support program to nurture the best talents","award":["IITP-2025-RS-2023-00253914"],"award-info":[{"award-number":["IITP-2025-RS-2023-00253914"]}]},{"name":"Korea government (MSIT). This work was supported by Institute of Information & Communications Technology Planning & Evaluation"},{"name":"Korea government","award":["RS-2023-00222609"],"award-info":[{"award-number":["RS-2023-00222609"]}]},{"name":"Thermal Modeling and Heat Dissipation Architecture Development for AI Heterogeneous Integrated Packages"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst."],"published-print":{"date-parts":[[2026,4]]},"DOI":"10.1109\/tcad.2025.3607129","type":"journal-article","created":{"date-parts":[[2025,9,8]],"date-time":"2025-09-08T17:45:57Z","timestamp":1757353557000},"page":"1782-1786","source":"Crossref","is-referenced-by-count":0,"title":["Comprehensive PDN Methodology for DRAM: Early PDN and Iterative PDN"],"prefix":"10.1109","volume":"45","author":[{"ORCID":"https:\/\/orcid.org\/0009-0002-9345-1574","authenticated-orcid":false,"given":"Jinhoon","family":"Hyun","sequence":"first","affiliation":[{"name":"SK Hynix, Incheon, South Korea"}]},{"ORCID":"https:\/\/orcid.org\/0009-0003-5032-4054","authenticated-orcid":false,"given":"Inchul","family":"Jeong","sequence":"additional","affiliation":[{"name":"SK Hynix, Incheon, South Korea"}]},{"given":"Shinho","family":"Chu","sequence":"additional","affiliation":[{"name":"SK Hynix, Incheon, South Korea"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-1073-1304","authenticated-orcid":false,"given":"Jaemyung","family":"Lim","sequence":"additional","affiliation":[{"name":"Department of Electronics Engineering, Hanyang University, Seoul, South Korea"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2016.198"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2021.3132554"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/tcad.2024.3509796"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1145\/3673653"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1007\/978-0-387-71601-5"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/EPEPS.2018.8534278"},{"key":"ref7","volume-title":"Jivaro Pro","year":"2024"}],"container-title":["IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/43\/11450487\/11153455.pdf?arnumber=11153455","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,3,24]],"date-time":"2026-03-24T05:32:48Z","timestamp":1774330368000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11153455\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,4]]},"references-count":7,"journal-issue":{"issue":"4"},"URL":"https:\/\/doi.org\/10.1109\/tcad.2025.3607129","relation":{},"ISSN":["0278-0070","1937-4151"],"issn-type":[{"value":"0278-0070","type":"print"},{"value":"1937-4151","type":"electronic"}],"subject":[],"published":{"date-parts":[[2026,4]]}}}