{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,21]],"date-time":"2026-05-21T20:14:22Z","timestamp":1779394462033,"version":"3.53.1"},"reference-count":38,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"6","license":[{"start":{"date-parts":[[2026,6,1]],"date-time":"2026-06-01T00:00:00Z","timestamp":1780272000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2026,6,1]],"date-time":"2026-06-01T00:00:00Z","timestamp":1780272000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,6,1]],"date-time":"2026-06-01T00:00:00Z","timestamp":1780272000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62472155"],"award-info":[{"award-number":["62472155"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst."],"published-print":{"date-parts":[[2026,6]]},"DOI":"10.1109\/tcad.2025.3620248","type":"journal-article","created":{"date-parts":[[2025,10,10]],"date-time":"2025-10-10T17:37:14Z","timestamp":1760117834000},"page":"2546-2558","source":"Crossref","is-referenced-by-count":0,"title":["LightPlace: A Lightweight and Connectivity-Aware Macro Placement Framework for Mixed-Size 3-D ICs"],"prefix":"10.1109","volume":"45","author":[{"ORCID":"https:\/\/orcid.org\/0009-0001-3263-4310","authenticated-orcid":false,"given":"Junqi","family":"Chen","sequence":"first","affiliation":[{"name":"College of Computer Science and Electronic Engineering, Hunan University, Changsha, Hunan, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-2372-6715","authenticated-orcid":false,"given":"Chubo","family":"Liu","sequence":"additional","affiliation":[{"name":"College of Computer Science and Electronic Engineering, Hunan University, Changsha, Hunan, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Peiying","family":"Lin","sequence":"additional","affiliation":[{"name":"School of Computer Science and the School of Cyberspace Science, Xiangtan University, Xiangtan, Hunan, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1144-7599","authenticated-orcid":false,"given":"Zheng","family":"Xiao","sequence":"additional","affiliation":[{"name":"College of Computer Science and Electronic Engineering, Hunan University, Changsha, Hunan, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0008-8719-3197","authenticated-orcid":false,"given":"Youquan","family":"Chang","sequence":"additional","affiliation":[{"name":"Hunan Mobile Communications Corporation, Changsha, Hunan, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9081-8153","authenticated-orcid":false,"given":"Zhuo","family":"Tang","sequence":"additional","affiliation":[{"name":"College of Computer Science and Electronic Engineering, Hunan University, Changsha, Hunan, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-2635-7716","authenticated-orcid":false,"given":"Kenli","family":"Li","sequence":"additional","affiliation":[{"name":"College of Computer Science and Electronic Engineering, Hunan University, Changsha, Hunan, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2010.2062811"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/S3S.2016.7804405"},{"key":"ref3","first-page":"1","article-title":"Pin-3D: A physical synthesis and post-layout optimization flow for heterogeneous monolithic 3D ICs","volume-title":"Proc. 39th Int. Conf. Comput.-Aided Design","author":"Pentapati"},{"key":"ref4","first-page":"1","article-title":"2022 ICCAD CAD contest problem B: 3D placement with D2D vertical connections","volume-title":"Proc. 41st IEEE\/ACM Int. Conf. Comput.-Aided Design","author":"Hu"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1145\/3439706.3446884"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/DAC.1999.781339"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/3DIC.2010.5751451"},{"key":"ref8","first-page":"674","article-title":"A study of through-silicon-via impact on the 3D stacked IC layout","volume-title":"Proc. Int. Conf. Comput.-Aided Design","author":"Kim"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2017.2648839"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1145\/3177540.3178244"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1145\/2699873"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1145\/2872334.2872361"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1145\/3316781.3317803"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/DAC.1986.1586125"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1145\/1055137.1055161"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1145\/299996.300032"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2007.357975"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1145\/2160916.2160958"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2015.2391263"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1038\/s41586-021-03544-w"},{"key":"ref21","first-page":"16508","article-title":"On joint learning for solving placement and routing in chip design","volume-title":"Proc. Adv. Neural Inf. Process. Syst.","author":"Cheng"},{"key":"ref22","first-page":"1","article-title":"DREAMPlace 3.0: Multi-electrostatics based robust VLSI placement with region constraints","volume-title":"Proc. 39th Int. Conf. Computer-Aided Design","author":"Gu"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1145\/3569052.3578923"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1145\/3569052.3572993"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/ASP-DAC52403.2022.9712562"},{"key":"ref26","first-page":"1309","article-title":"Xplace: An extremely fast and extensible global placement framework","volume-title":"Proc. 59th ACM\/IEEE Design Autom. Conf.","author":"Liu"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1145\/3287624.3287677"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1145\/3505170.3506731"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1145\/1044111.1044116"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2008.923063"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1007\/978-0-387-68739-1_10"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1145\/1629911.1630028"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2008.4681577"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/ASPDAC.2007.358084"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1145\/2560519.2560531"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2012.2226584"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2023.3347293"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1137\/1.9781611974317.5"}],"container-title":["IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/43\/11527413\/11199908.pdf?arnumber=11199908","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,5,21]],"date-time":"2026-05-21T19:43:29Z","timestamp":1779392609000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11199908\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,6]]},"references-count":38,"journal-issue":{"issue":"6"},"URL":"https:\/\/doi.org\/10.1109\/tcad.2025.3620248","relation":{},"ISSN":["0278-0070","1937-4151"],"issn-type":[{"value":"0278-0070","type":"print"},{"value":"1937-4151","type":"electronic"}],"subject":[],"published":{"date-parts":[[2026,6]]}}}