{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,1]],"date-time":"2026-06-01T12:44:06Z","timestamp":1780317846507,"version":"3.54.1"},"reference-count":39,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"2","license":[{"start":{"date-parts":[[2018,4,1]],"date-time":"2018-04-01T00:00:00Z","timestamp":1522540800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2018,4,1]],"date-time":"2018-04-01T00:00:00Z","timestamp":1522540800000},"content-version":"am","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2018,4,1]],"date-time":"2018-04-01T00:00:00Z","timestamp":1522540800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2018,4,1]],"date-time":"2018-04-01T00:00:00Z","timestamp":1522540800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"National Science Foundation","award":["CNS-0855091"],"award-info":[{"award-number":["CNS-0855091"]}]},{"name":"National Science Foundation","award":["IIP-0758566"],"award-info":[{"award-number":["IIP-0758566"]}]},{"name":"National Science Foundation","award":["CNS-1117263"],"award-info":[{"award-number":["CNS-1117263"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Cloud Comput."],"published-print":{"date-parts":[[2018,4,1]]},"DOI":"10.1109\/tcc.2015.2481423","type":"journal-article","created":{"date-parts":[[2015,9,23]],"date-time":"2015-09-23T20:01:42Z","timestamp":1443038502000},"page":"330-343","source":"Crossref","is-referenced-by-count":25,"title":["Model-Based Thermal Anomaly Detection in Cloud Datacenters Using Thermal Imaging"],"prefix":"10.1109","volume":"6","author":[{"given":"Eun Kyung","family":"Lee","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Hariharasudhan","family":"Viswanathan","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Dario","family":"Pompili","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1109\/LGRS.2008.915928"},{"key":"ref38","doi-asserted-by":"crossref","first-page":"1105","DOI":"10.1016\/S0743-7315(03)00108-4","article-title":"The workload on parallel supercomputers: Modeling the characteristics of rigid\n jobs","volume":"63","author":"lublin","year":"2003","journal-title":"J Parallel Distrib Comput"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1145\/1408654.1408659"},{"key":"ref32","first-page":"1","article-title":"Co-occurrence matrices for volumetric\n data","author":"kurani","year":"0","journal-title":"Proc IASTED Int Conf Comput Graph Imag"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/TSMC.1973.4309314"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/GREENCOMP.2010.5598283"},{"key":"ref37","author":"feitelson","year":"0"},{"key":"ref36","year":"0"},{"key":"ref35","year":"0"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1145\/2479871.2479932"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/MNET.2011.5958006"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1007\/s11227-010-0453-8"},{"key":"ref12","year":"0"},{"key":"ref13","year":"0"},{"key":"ref14","year":"0"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ISIAS.2010.5604069"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/CCGrid.2012.81"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1145\/1555228.1555245"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1016\/j.peva.2012.09.002"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/CloudNet.2013.6710561"},{"key":"ref28","first-page":"1","article-title":"Measurements and predictions of the flow distribution through\n perforated tiles in raised floor data centers","author":"schmidt","year":"0","journal-title":"Proc Pacific Rim\/ASME Int Electron Packaging Tech Conf"},{"key":"ref4","article-title":"Report to congress on server and data center energy efficiency: Public law 109-431","author":"brown","year":"2007","journal-title":"U S Environmental Protection Agency"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2010.5501330"},{"key":"ref3","year":"0"},{"key":"ref6","year":"0"},{"key":"ref29","first-page":"635","article-title":"Thermal profile of a high-density data center-methodology to\n thermally characterize a data center","volume":"110","author":"schmidt","year":"2004","journal-title":"Trans Amer Soc Heating Refrigeration Air-Conditioning Eng"},{"key":"ref5","year":"0"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/HiPC.2012.6507478"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/IPDPS.2006.1639600"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1115\/HT2012-58403"},{"key":"ref9","article-title":"The impact of technology scaling on lifetime reliability","author":"adve","year":"0","journal-title":"Proc Int Conf Depend Syst Netw"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1145\/511483.511485"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/GCC.2010.29"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/ICC.2014.6883908"},{"key":"ref21","first-page":"19","article-title":"Dynamic virtual machine scheduling in clouds for architectural shared resources","author":"ahn","year":"0","journal-title":"Proc Conf Hot Topics Cloud Comput"},{"key":"ref24","first-page":"363","article-title":"Cool job allocation: Measuring the power savings of placing jobs at cooling-efficient locations\n in the data center","author":"bash","year":"0","journal-title":"Proc USENIX Annu Tech Conf"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/ICAC.2006.1662394"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/TPDS.2008.111"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1007\/s11227-014-1140-y"}],"container-title":["IEEE Transactions on Cloud Computing"],"original-title":[],"link":[{"URL":"https:\/\/ieeexplore.ieee.org\/ielaam\/6245519\/8372844\/7274707-aam.pdf","content-type":"application\/pdf","content-version":"am","intended-application":"syndication"},{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6245519\/8372844\/07274707.pdf?arnumber=7274707","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,4,8]],"date-time":"2022-04-08T18:53:30Z","timestamp":1649444010000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/7274707\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,4,1]]},"references-count":39,"journal-issue":{"issue":"2"},"URL":"https:\/\/doi.org\/10.1109\/tcc.2015.2481423","relation":{},"ISSN":["2168-7161"],"issn-type":[{"value":"2168-7161","type":"electronic"}],"subject":[],"published":{"date-parts":[[2018,4,1]]}}}