{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,7]],"date-time":"2026-07-07T23:47:34Z","timestamp":1783468054745,"version":"3.55.0"},"reference-count":53,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"1","license":[{"start":{"date-parts":[[2019,3,1]],"date-time":"2019-03-01T00:00:00Z","timestamp":1551398400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2019,3,1]],"date-time":"2019-03-01T00:00:00Z","timestamp":1551398400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2019,3,1]],"date-time":"2019-03-01T00:00:00Z","timestamp":1551398400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100004826","name":"Natural Science Foundation of Beijing Municipality","doi-asserted-by":"publisher","award":["4173078"],"award-info":[{"award-number":["4173078"]}],"id":[{"id":"10.13039\/501100004826","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["61675021"],"award-info":[{"award-number":["61675021"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["61675026"],"award-info":[{"award-number":["61675026"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"name":"National Science and Technology Major Project"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Comput. Imaging"],"published-print":{"date-parts":[[2019,3]]},"DOI":"10.1109\/tci.2018.2880342","type":"journal-article","created":{"date-parts":[[2018,11,9]],"date-time":"2018-11-09T21:22:11Z","timestamp":1541798531000},"page":"120-135","source":"Crossref","is-referenced-by-count":32,"title":["Gradient-Based Source Mask Optimization for Extreme Ultraviolet Lithography"],"prefix":"10.1109","volume":"5","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-2012-9808","authenticated-orcid":false,"given":"Xu","family":"Ma","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Zhiqiang","family":"Wang","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Xuanbo","family":"Chen","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8228-610X","authenticated-orcid":false,"given":"Yanqiu","family":"Li","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Gonzalo R.","family":"Arce","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1109\/TIP.2006.891332"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1117\/12.879766"},{"key":"ref33","article-title":"Application of EUV resolution enhancement techniques (RET) to optimize and extend single exposure bidirectional patterning for 7\ufffdnm and beyond logic designs","volume":"9776","author":"kim","year":"0","journal-title":"Proc SPIE"},{"key":"ref32","article-title":"EUV resolution enhancement techniques (RETs) for k$_1$ 0.4 and below","volume":"9422","author":"hsu","year":"0","journal-title":"Proc SPIE"},{"key":"ref31","article-title":"EUV source-mask optimization for 7 nm node and beyond","volume":"9048","author":"liu","year":"0","journal-title":"Proc SPIE"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1117\/12.863102"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1117\/12.389012"},{"key":"ref36","article-title":"Toward a consistent and accurate approach to modeling projection optics","volume":"7640","author":"peng","year":"0","journal-title":"Proc SPIE"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1364\/AO.52.003351"},{"key":"ref34","article-title":"Design intent optimization at the beyond 7\ufffdnm node: The intersection of DTCO and EUVL stochastic mitigation techniques","volume":"10148","author":"crouse","year":"0","journal-title":"Proc SPIE"},{"key":"ref28","article-title":"Design of freeform illumination sources with arbitrary polarization for immersion lithography","volume":"9272","author":"wei","year":"0","journal-title":"Proc SPIE"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1364\/AO.53.006861"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1117\/12.801436"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1117\/12.896813"},{"key":"ref1","year":"0"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1364\/OE.20.021792"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1364\/AO.52.004200"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1016\/j.optlastec.2012.06.033"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijleo.2014.06.116"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1364\/OE.21.008076"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1117\/1.JMM.14.2.023504"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1117\/1.3607424"},{"key":"ref50","doi-asserted-by":"publisher","DOI":"10.1364\/OE.26.014479"},{"key":"ref51","doi-asserted-by":"publisher","DOI":"10.1364\/AO.56.005903"},{"key":"ref53","article-title":"A cost-driven fracture heuristics to minimize external sliver length","volume":"7973","author":"ma","year":"0","journal-title":"Proc SPIE"},{"key":"ref52","doi-asserted-by":"publisher","DOI":"10.1016\/j.mee.2016.10.006"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1364\/JOSAA.30.000112"},{"key":"ref11","doi-asserted-by":"crossref","first-page":"13","DOI":"10.1117\/1.1448500","article-title":"Optimum mask and source patterns to print a given shape","volume":"1","author":"rosenbluth","year":"2002","journal-title":"J Micro\/Nanolithogr MEMS MOEMS"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1364\/JOSAA.29.001300"},{"key":"ref12","doi-asserted-by":"crossref","first-page":"646","DOI":"10.1117\/12.533215","article-title":"Towards automatic mask and source optimization for optical lithography","volume":"5377","author":"erdmann","year":"0","journal-title":"Proc SPIE"},{"key":"ref13","first-page":"315","article-title":"Layout and source dependent phase mask transmission tuning","volume":"5454","author":"progler","year":"0","journal-title":"Proc SPIE"},{"key":"ref14","first-page":"180","article-title":"Simultaneous source mask optimization (SMO)","volume":"5853","author":"robert","year":"0","journal-title":"Proc SPIE"},{"key":"ref15","article-title":"An innovative source-mask co-optimization (SMO) method for extending low k$_1$ imaging","volume":"7140","author":"hsu","year":"0","journal-title":"Proc SPIE"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1364\/OE.17.005783"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TIP.2011.2131668"},{"key":"ref18","article-title":"Gradient-based fast source mask optimization (SMO)","volume":"7973","author":"yu","year":"0","journal-title":"Proc SPIE"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1364\/OE.19.019384"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1117\/12.600439"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1116\/1.2794048"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1117\/12.881713"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1364\/AO.54.007284"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1002\/9780470618943"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1117\/3.401208"},{"key":"ref49","doi-asserted-by":"publisher","DOI":"10.1364\/OE.25.007131"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1117\/2.1201409.005461"},{"key":"ref46","article-title":"Impact of mask topography and multilayer stack on high NA imaging of EUV masks","volume":"7823","author":"ruoff","year":"0","journal-title":"Proc SPIE"},{"key":"ref45","doi-asserted-by":"publisher","DOI":"10.1117\/12.468103"},{"key":"ref48","author":"nocedal","year":"2006","journal-title":"Numerical Optimization"},{"key":"ref47","doi-asserted-by":"publisher","DOI":"10.1117\/1.JMM.13.4.043013"},{"key":"ref42","article-title":"Modeling and experiments of nontelecentric thick mask effects for EUV lithography","volume":"7271","author":"mcintyre","year":"0","journal-title":"Proc SPIE"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1117\/12.899591"},{"key":"ref44","doi-asserted-by":"publisher","DOI":"10.1117\/12.436666"},{"key":"ref43","article-title":"EUV telecentricity and shadowing errors impact on process margins","volume":"9422","author":"civay","year":"0","journal-title":"Proc SPIE"}],"container-title":["IEEE Transactions on Computational Imaging"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/6745852\/8637781\/08528871.pdf?arnumber=8528871","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,7,13]],"date-time":"2022-07-13T21:07:38Z","timestamp":1657746458000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8528871\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019,3]]},"references-count":53,"journal-issue":{"issue":"1"},"URL":"https:\/\/doi.org\/10.1109\/tci.2018.2880342","relation":{},"ISSN":["2333-9403","2334-0118","2573-0436"],"issn-type":[{"value":"2333-9403","type":"electronic"},{"value":"2334-0118","type":"electronic"},{"value":"2573-0436","type":"print"}],"subject":[],"published":{"date-parts":[[2019,3]]}}}