{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T16:01:36Z","timestamp":1781884896823,"version":"3.54.5"},"reference-count":35,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"3","license":[{"start":{"date-parts":[[2017,3,1]],"date-time":"2017-03-01T00:00:00Z","timestamp":1488326400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Circuits Syst. I"],"published-print":{"date-parts":[[2017,3]]},"DOI":"10.1109\/tcsi.2016.2616907","type":"journal-article","created":{"date-parts":[[2016,10,31]],"date-time":"2016-10-31T18:08:26Z","timestamp":1477937306000},"page":"505-515","source":"Crossref","is-referenced-by-count":6,"title":["Printed Electronics: Effects of Bending and a Self-Compensation Means"],"prefix":"10.1109","volume":"64","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-9383-6389","authenticated-orcid":false,"given":"Jia","family":"Zhou","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0284-4069","authenticated-orcid":false,"given":"Tong","family":"Ge","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Joseph S.","family":"Chang","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/IMS3TW.2011.39"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1016\/j.orgel.2012.06.038"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1063\/1.3077025"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1038\/nature07110"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/4.179201"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2015.2415175"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1021\/nl401934a"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1016\/j.orgel.2012.12.022"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2012.2223971"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1063\/1.2948862"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1021\/nl301335q"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1038\/srep02048"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2011.2181678"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1038\/nature12314"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TRO.2009.2033627"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1007\/978-94-007-0579-1"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1021\/nl2043375"},{"key":"ref4","article-title":"OE-A roadmap for organic and printed electronics","year":"2015"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1021\/nl104488z"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1016\/j.orgel.2013.12.027"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2013.6487657"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1038\/nmat2896"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1016\/j.orgel.2015.07.058"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1002\/adma.201401520"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2010.2048083"},{"key":"ref2","article-title":"Digital printed electronics on flexible substrate: Challenges and applications","author":"chang","year":"2014","journal-title":"Proc IEEE Int Symp Asynchron Circuits Syst"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1002\/adma.201404133"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2015.2508484"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1038\/nature10489"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1002\/adfm.201101418"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1126\/science.aaa9306"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2011.2143416"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1016\/j.orgel.2012.10.033"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1021\/nn401429w"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1039\/c3tc32460e"}],"container-title":["IEEE Transactions on Circuits and Systems I: Regular Papers"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8919\/7862955\/07726003.pdf?arnumber=7726003","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,12]],"date-time":"2022-01-12T16:19:57Z","timestamp":1642004397000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/7726003\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017,3]]},"references-count":35,"journal-issue":{"issue":"3"},"URL":"https:\/\/doi.org\/10.1109\/tcsi.2016.2616907","relation":{},"ISSN":["1549-8328","1558-0806"],"issn-type":[{"value":"1549-8328","type":"print"},{"value":"1558-0806","type":"electronic"}],"subject":[],"published":{"date-parts":[[2017,3]]}}}