{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,6]],"date-time":"2026-06-06T16:52:02Z","timestamp":1780764722376,"version":"3.54.1"},"reference-count":25,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"12","license":[{"start":{"date-parts":[[2018,12,1]],"date-time":"2018-12-01T00:00:00Z","timestamp":1543622400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"funder":[{"DOI":"10.13039\/501100003725","name":"National Research Foundation of Korea","doi-asserted-by":"publisher","award":["NRF-2017R1E1A1A01076992"],"award-info":[{"award-number":["NRF-2017R1E1A1A01076992"]}],"id":[{"id":"10.13039\/501100003725","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003836","name":"IC Design Education Center","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100003836","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Circuits Syst. I"],"published-print":{"date-parts":[[2018,12]]},"DOI":"10.1109\/tcsi.2018.2840092","type":"journal-article","created":{"date-parts":[[2018,6,7]],"date-time":"2018-06-07T15:02:21Z","timestamp":1528383741000},"page":"4196-4207","source":"Crossref","is-referenced-by-count":54,"title":["Energy-Efficient Convolution Architecture Based on Rescheduled Dataflow"],"prefix":"10.1109","volume":"65","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-7456-5002","authenticated-orcid":false,"given":"Jihyuck","family":"Jo","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Suchang","family":"Kim","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3524-2838","authenticated-orcid":false,"given":"In-Cheol","family":"Park","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1145\/2749469.2750389"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TCSVT.2016.2592330"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1145\/3007787.3001179"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1145\/3007787.3001138"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.23919\/DATE.2017.7927142"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.23919\/DATE.2017.7927222"},{"key":"ref16","first-page":"248","article-title":"A 0.62 mW ultra-low-power convolutional-neural-network face-recognition processor and a CIS integrated with always-on Haar-like face detector","author":"bong","year":"2017","journal-title":"IEEE Int Solid-State Circuits Conf (ISSCC) Dig Tech Papers"},{"key":"ref17","first-page":"246","article-title":"ENVISION: A 0.26-to-10 TOPS\/W subword-parallel dynamic-voltage-accuracy-frequency-scalable convolutional neural network processor in 28 nm FDSOI","author":"moons","year":"2017","journal-title":"IEEE Int Solid-State Circuits Conf (ISSCC) Dig Tech Papers"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2636225"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2017.2698019"},{"key":"ref4","first-page":"1337","article-title":"Deep learning with COTS HPC systems","author":"coates","year":"2013","journal-title":"Proc Int Conf Mach Learn (ICML)"},{"key":"ref3","year":"2015","journal-title":"GPU-Based Deep Learning Inference A Performance and Power Analysis"},{"key":"ref6","first-page":"238","article-title":"A 1.93 TOPS\/W scalable deep learning\/inference processor with tetra-parallel MIMD architecture for big-data applications","author":"park","year":"2017","journal-title":"IEEE Int Solid-State Circuits Conf (ISSCC) Dig Tech Papers"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TCSVT.2016.2589879"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2616357"},{"key":"ref7","first-page":"238","article-title":"A 2.9TOPS\/W deep convolutional neural network SoC in FD-SOI 28nm for intelligent embedded systems","author":"desoli","year":"2017","journal-title":"IEEE Int Solid-State Circuits Conf (ISSCC) Dig Tech Papers"},{"key":"ref2","first-page":"1","article-title":"Very deep convolutional networks for large-scale image recognition","author":"simonyan","year":"2015","journal-title":"Proc of the Int Conf on Learning Representations (ICLR)"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1145\/2541940.2541967"},{"key":"ref1","first-page":"1097","article-title":"ImageNet classification with deep convolutional neural networks","author":"krizhevsky","year":"2012","journal-title":"Proc Adv Neural Inf Process Syst (NIPS)"},{"key":"ref20","article-title":"A heterogeneous multi-core system-on-chip for energy efficient brain inspired computing","author":"pullini","year":"0","journal-title":"IEEE Trans Circuits Syst II Exp Briefs"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1145\/3079856.3080246"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2764045"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/ISVLSI.2017.124"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.23919\/DATE.2018.8342120"},{"key":"ref25","first-page":"8","article-title":"Migrating to LPDDR3: An overview of LPDDR3 commands, operations, and functions","author":"ross","year":"2012","journal-title":"JEDEC LPDDR3 Symp"}],"container-title":["IEEE Transactions on Circuits and Systems I: Regular Papers"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8919\/8511082\/08374840.pdf?arnumber=8374840","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,12]],"date-time":"2022-01-12T11:44:00Z","timestamp":1641987840000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8374840\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,12]]},"references-count":25,"journal-issue":{"issue":"12"},"URL":"https:\/\/doi.org\/10.1109\/tcsi.2018.2840092","relation":{},"ISSN":["1549-8328","1558-0806"],"issn-type":[{"value":"1549-8328","type":"print"},{"value":"1558-0806","type":"electronic"}],"subject":[],"published":{"date-parts":[[2018,12]]}}}