{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,5]],"date-time":"2026-06-05T15:57:15Z","timestamp":1780675035136,"version":"3.54.1"},"reference-count":28,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"2","license":[{"start":{"date-parts":[[2020,2,1]],"date-time":"2020-02-01T00:00:00Z","timestamp":1580515200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2020,2,1]],"date-time":"2020-02-01T00:00:00Z","timestamp":1580515200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2020,2,1]],"date-time":"2020-02-01T00:00:00Z","timestamp":1580515200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["91648116"],"award-info":[{"award-number":["91648116"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["41871245"],"award-info":[{"award-number":["41871245"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100012166","name":"National Key Research and Development Program of China","doi-asserted-by":"publisher","award":["2018YFB1702501"],"award-info":[{"award-number":["2018YFB1702501"]}],"id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100012166","name":"National Key Research and Development Program of China","doi-asserted-by":"publisher","award":["2017YFC1500601"],"award-info":[{"award-number":["2017YFC1500601"]}],"id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100012282","name":"Beijing Innovation Center for Future Chip","doi-asserted-by":"publisher","id":[{"id":"10.13039\/501100012282","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Circuits Syst. I"],"published-print":{"date-parts":[[2020,2]]},"DOI":"10.1109\/tcsi.2019.2937227","type":"journal-article","created":{"date-parts":[[2019,9,12]],"date-time":"2019-09-12T19:59:35Z","timestamp":1568318375000},"page":"389-400","source":"Crossref","is-referenced-by-count":54,"title":["Processing Near Sensor Architecture in Mixed-Signal Domain With CMOS Image Sensor of Convolutional-Kernel-Readout Method"],"prefix":"10.1109","volume":"67","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-0458-5205","authenticated-orcid":false,"given":"Zhe","family":"Chen","sequence":"first","affiliation":[{"name":"School of Electronic and Information Engineering, Beijing Jiaotong University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0099-1911","authenticated-orcid":false,"given":"Huifeng","family":"Zhu","sequence":"additional","affiliation":[{"name":"Department of Electrical and System Engineering, Washington University in St. Louis, St. Louis, MO, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Erxiang","family":"Ren","sequence":"additional","affiliation":[{"name":"School of Electronic and Information Engineering, Beijing Jiaotong University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-1696-6980","authenticated-orcid":false,"given":"Zheyu","family":"Liu","sequence":"additional","affiliation":[{"name":"Department of Electronic Engineering and BNRist, Tsinghua University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Kaige","family":"Jia","sequence":"additional","affiliation":[{"name":"Department of Electronic Engineering and BNRist, Tsinghua University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Li","family":"Luo","sequence":"additional","affiliation":[{"name":"School of Electronic and Information Engineering, Beijing Jiaotong University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0482-5435","authenticated-orcid":false,"given":"Xuan","family":"Zhang","sequence":"additional","affiliation":[{"name":"Department of Electrical and System Engineering, Washington University in St. Louis, St. Louis, MO, USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3189-7562","authenticated-orcid":false,"given":"Qi","family":"Wei","sequence":"additional","affiliation":[{"name":"Department of Precision Instrument, Tsinghua University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5054-9590","authenticated-orcid":false,"given":"Fei","family":"Qiao","sequence":"additional","affiliation":[{"name":"Department of Electronic Engineering and BNRist, Tsinghua University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8252-8367","authenticated-orcid":false,"given":"Xinjun","family":"Liu","sequence":"additional","affiliation":[{"name":"Department of Mechanical Engineering, Tsinghua University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2421-353X","authenticated-orcid":false,"given":"Huazhong","family":"Yang","sequence":"additional","affiliation":[{"name":"Department of Electronic Engineering and BNRist, Tsinghua University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1145\/3007787.3001164"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.23919\/DATE.2017.7926951"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2014.2332134"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2012.6271563"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2008.926983"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2015.2397874"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2011.2178126"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/4.871332"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2014.2356197"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/HPCA.2016.7446049"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2017.2757036"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1145\/3079856.3080246"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2016.2603519"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2616357"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/MICRO.2014.58"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1145\/2541940.2541967"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.1974.1050511"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1145\/2749469.2750389"},{"key":"ref2","article-title":"Very deep convolutional networks for large-scale image recognition","author":"simonyan","year":"2014","journal-title":"arXiv 1409 1556"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2010.2085910"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/CVPR.2015.7298594"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1145\/3007787.3001139"},{"key":"ref22","first-page":"1477","article-title":"NeuADC: Neural network-inspired RRAM-based synthesizable analog-to-digital conversion with reconfigurable quantization support","author":"cao","year":"2019","journal-title":"Proc Design Automat Test Europe Conf Exhib"},{"key":"ref21","article-title":"NeuADC: Neural network-inspired synthesizable analog-to-digital conversion","author":"cao","year":"0","journal-title":"IEEE Trans Comput -Aided Des Integr Circuits Syst"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1049\/el:19940510"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/APCCAS.2018.8605660"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2018.8350945"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2015.2483898"}],"container-title":["IEEE Transactions on Circuits and Systems I: Regular Papers"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8919\/8972641\/08835152.pdf?arnumber=8835152","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,3,6]],"date-time":"2024-03-06T19:06:41Z","timestamp":1709752001000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/8835152\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2020,2]]},"references-count":28,"journal-issue":{"issue":"2"},"URL":"https:\/\/doi.org\/10.1109\/tcsi.2019.2937227","relation":{},"ISSN":["1549-8328","1558-0806"],"issn-type":[{"value":"1549-8328","type":"print"},{"value":"1558-0806","type":"electronic"}],"subject":[],"published":{"date-parts":[[2020,2]]}}}