{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,19]],"date-time":"2026-02-19T08:04:43Z","timestamp":1771488283618,"version":"3.50.1"},"reference-count":34,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"12","license":[{"start":{"date-parts":[[2020,12,1]],"date-time":"2020-12-01T00:00:00Z","timestamp":1606780800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2020,12,1]],"date-time":"2020-12-01T00:00:00Z","timestamp":1606780800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2020,12,1]],"date-time":"2020-12-01T00:00:00Z","timestamp":1606780800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["61525401"],"award-info":[{"award-number":["61525401"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["61774049"],"award-info":[{"award-number":["61774049"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"name":"National Key Research and Development Programmes","award":["2018YFB2201000"],"award-info":[{"award-number":["2018YFB2201000"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Circuits Syst. I"],"published-print":{"date-parts":[[2020,12]]},"DOI":"10.1109\/tcsi.2020.3003457","type":"journal-article","created":{"date-parts":[[2020,6,27]],"date-time":"2020-06-27T00:55:25Z","timestamp":1593219325000},"page":"5429-5442","source":"Crossref","is-referenced-by-count":10,"title":["A High-Performance Stochastic LDPC Decoder Architecture Designed via Correlation Analysis"],"prefix":"10.1109","volume":"67","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-5486-5729","authenticated-orcid":false,"given":"Qichen","family":"Zhang","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3736-9456","authenticated-orcid":false,"given":"Yun","family":"Chen","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Shixian","family":"Li","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Xiaoyang","family":"Zeng","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6543-2793","authenticated-orcid":false,"given":"Keshab K.","family":"Parhi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2014.2360331"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/TCOMM.2013.112313.120917"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1145\/3316781.3317844"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/ICCD.2013.6657023"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2012.2194176"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2008.925402"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2012.2206461"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TSP.2013.2293116"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/JLT.2016.2598440"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2010.2046957"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2014.2312479"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1145\/1465482.1465505"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ACSSC.2005.1599845"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/ISIT.2005.1523513"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/SIPS.2007.4387554"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2019.2906385"},{"key":"ref4","first-page":"1","article-title":"IEEE Std 802.11-2007 (Revision of IEEE Std 802.11-1999) - Redline","year":"2007","journal-title":"IEEE Std 802 11-2007 (Revision of IEEE Std 802 11-1999) - Redline 802 11-2007"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/ISVLSI.2016.48"},{"key":"ref3","year":"2006"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TIT.1981.1056404"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/ICDSP.2015.7251868"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/IEEESTD.2009.5062485"},{"key":"ref8","doi-asserted-by":"crossref","first-page":"3697","DOI":"10.1109\/TCSI.2008.926995","article-title":"Sliced message passing: High throughput overlapped decoding of high-rate low-density parity-check codes","volume":"55","author":"liu","year":"2008","journal-title":"IEEE Trans Circuits Syst I Reg Papers"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/4234.1001666"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1049\/el:19970362"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2010.2042255"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TIT.1962.1057683"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TSP.2008.929671"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TSP.2010.2051434"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/ICASSP.2009.4959645"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TSP.2017.2725221"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2016.2535038"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/ICDSP.2015.7251915"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TSP.2011.2163630"}],"container-title":["IEEE Transactions on Circuits and Systems I: Regular Papers"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8919\/9275400\/09126828.pdf?arnumber=9126828","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,4,27]],"date-time":"2022-04-27T16:49:13Z","timestamp":1651078153000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9126828\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2020,12]]},"references-count":34,"journal-issue":{"issue":"12"},"URL":"https:\/\/doi.org\/10.1109\/tcsi.2020.3003457","relation":{},"ISSN":["1549-8328","1558-0806"],"issn-type":[{"value":"1549-8328","type":"print"},{"value":"1558-0806","type":"electronic"}],"subject":[],"published":{"date-parts":[[2020,12]]}}}