{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,25]],"date-time":"2025-10-25T12:44:49Z","timestamp":1761396289616,"version":"3.37.3"},"reference-count":29,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"8","license":[{"start":{"date-parts":[[2022,8,1]],"date-time":"2022-08-01T00:00:00Z","timestamp":1659312000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2022,8,1]],"date-time":"2022-08-01T00:00:00Z","timestamp":1659312000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,8,1]],"date-time":"2022-08-01T00:00:00Z","timestamp":1659312000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"Institute of Information & communications Technology Planning & Evaluation (IITP) grant"},{"DOI":"10.13039\/501100003621","name":"Korea government (MSIT)","doi-asserted-by":"publisher","award":["2022-0-01171"],"award-info":[{"award-number":["2022-0-01171"]}],"id":[{"id":"10.13039\/501100003621","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Circuits Syst. I"],"published-print":{"date-parts":[[2022,8]]},"DOI":"10.1109\/tcsi.2022.3171796","type":"journal-article","created":{"date-parts":[[2022,5,25]],"date-time":"2022-05-25T19:37:32Z","timestamp":1653507452000},"page":"3416-3427","source":"Crossref","is-referenced-by-count":6,"title":["Analysis of a Multiwire, Multilevel, and Symbol Correlation Combination Scheme"],"prefix":"10.1109","volume":"69","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-9545-9196","authenticated-orcid":false,"given":"Jonghyuck","family":"Choi","sequence":"first","affiliation":[{"name":"Department of Electrical Engineering, Korea University, Seoul, South Korea"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-0594-4206","authenticated-orcid":false,"given":"Yoonjae","family":"Choi","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, Korea University, Seoul, South Korea"}]},{"given":"Hyunsu","family":"Park","sequence":"additional","affiliation":[{"name":"Department of Semiconductor System Engineering, Korea University, Seoul, South Korea"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-8247-6277","authenticated-orcid":false,"given":"Jincheol","family":"Sim","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, Korea University, Seoul, South Korea"}]},{"given":"Youngwook","family":"Kwon","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, Korea University, Seoul, South Korea"}]},{"given":"Seungwoo","family":"Park","sequence":"additional","affiliation":[{"name":"Department of Semiconductor System Engineering, Korea University, Seoul, South Korea"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4379-7905","authenticated-orcid":false,"given":"Chulwoo","family":"Kim","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering, Korea University, Seoul, South Korea"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2018.2873602"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/LSSC.2019.2953840"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2018.2831226"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2006.879094"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2022.3147774"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ESSCIRC53450.2021.9567818"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3098821"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2017.7870431"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2019.2962839"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2014.2359665"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2017.2735548"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2017.2707535"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2019.8662462"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3006864"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2014.6757505"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/vlsic.2016.7573524"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2559512"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2017.7870475"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2018.2878814"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2016.7417967"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2962655"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2016.2528480"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2020.2969472"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2020.3038865"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2018.2855692"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2012.2215779"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2014.6757332"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2011.5746393"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2009.2031024"}],"container-title":["IEEE Transactions on Circuits and Systems I: Regular Papers"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8919\/9841618\/09782072.pdf?arnumber=9782072","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,1,24]],"date-time":"2024-01-24T02:18:01Z","timestamp":1706062681000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9782072\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,8]]},"references-count":29,"journal-issue":{"issue":"8"},"URL":"https:\/\/doi.org\/10.1109\/tcsi.2022.3171796","relation":{},"ISSN":["1549-8328","1558-0806"],"issn-type":[{"type":"print","value":"1549-8328"},{"type":"electronic","value":"1558-0806"}],"subject":[],"published":{"date-parts":[[2022,8]]}}}