{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,5]],"date-time":"2026-06-05T05:00:54Z","timestamp":1780635654744,"version":"3.54.1"},"reference-count":55,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"11","license":[{"start":{"date-parts":[[2022,11,1]],"date-time":"2022-11-01T00:00:00Z","timestamp":1667260800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2022,11,1]],"date-time":"2022-11-01T00:00:00Z","timestamp":1667260800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,11,1]],"date-time":"2022-11-01T00:00:00Z","timestamp":1667260800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100012166","name":"National Key Research and Development Program of China","doi-asserted-by":"publisher","award":["2020YFB2206001"],"award-info":[{"award-number":["2020YFB2206001"]}],"id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"NSFC","doi-asserted-by":"publisher","award":["62004002"],"award-info":[{"award-number":["62004002"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"NSFC","doi-asserted-by":"publisher","award":["92064004"],"award-info":[{"award-number":["92064004"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"NSFC","doi-asserted-by":"publisher","award":["61927901"],"award-info":[{"award-number":["61927901"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100013314","name":"111 Project","doi-asserted-by":"publisher","award":["B18001"],"award-info":[{"award-number":["B18001"]}],"id":[{"id":"10.13039\/501100013314","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Circuits Syst. I"],"published-print":{"date-parts":[[2022,11]]},"DOI":"10.1109\/tcsi.2022.3199453","type":"journal-article","created":{"date-parts":[[2022,8,23]],"date-time":"2022-08-23T19:42:31Z","timestamp":1661283751000},"page":"4367-4380","source":"Crossref","is-referenced-by-count":26,"title":["Modeling and Mitigating the Interconnect Resistance Issue in Analog RRAM Matrix Computing Circuits"],"prefix":"10.1109","volume":"69","author":[{"given":"Yubiao","family":"Luo","sequence":"first","affiliation":[{"name":"School of Integrated Circuits, Peking University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Shiqing","family":"Wang","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Institute for Artificial Intelligence, Peking University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Pushen","family":"Zuo","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits, Institute for Artificial Intelligence, Peking University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1856-0279","authenticated-orcid":false,"given":"Zhong","family":"Sun","sequence":"additional","affiliation":[{"name":"Beijing Advanced Innovation Center for Integrated Circuits, School of Integrated Circuits, Institute for Artificial Intelligence, Peking University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Ru","family":"Huang","sequence":"additional","affiliation":[{"name":"Beijing Advanced Innovation Center for Integrated Circuits, School of Integrated Circuits, Institute for Artificial Intelligence, Peking University, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2018.2871057"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1002\/aisy.202000040"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1145\/2897937.2898010"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1073\/pnas.1815682116"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1126\/sciadv.aay2378"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2020.2992435"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1002\/aisy.202000042"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2021.3068764"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2021.3122327"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2021.3122278"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1038\/s41928-018-0092-2"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1038\/s41928-017-0002-z"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1038\/s41586-020-1942-4"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2020.2966908"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2021.3095430"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2018.8310400"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2019.8662395"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC19947.2020.9062979"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2020.3000185"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/DAC18072.2020.9218688"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2018.2789723"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/IMW.2012.6213650"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1145\/2333660.2333712"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2015.7409718"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TCS.1975.1084079"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2013.2246791"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/TNANO.2017.2784364"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.3390\/mi10100671"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2020.3021309"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1038\/s41928-018-0054-8"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1038\/s41928-018-0100-6"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/ISCA.2016.13"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2020.2998456"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/picmet.2001.951917"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2012.2190369"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2019.2961505"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1137\/1.9780898718003"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1002\/aelm.201800876"},{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2018.8310392"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42613.2021.9365769"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.56021\/9781421407944"},{"key":"ref42","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2016.2573140"},{"key":"ref43","doi-asserted-by":"publisher","DOI":"10.1109\/TNANO.2016.2635583"},{"key":"ref44","doi-asserted-by":"publisher","DOI":"10.1007\/s10470-018-1303-5"},{"key":"ref45","doi-asserted-by":"publisher","DOI":"10.5573\/JSTS.2014.14.3.356"},{"key":"ref46","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM19573.2019.8993598"},{"key":"ref47","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS51556.2021.9401275"},{"key":"ref48","doi-asserted-by":"publisher","DOI":"10.1016\/j.mattod.2015.11.009"},{"key":"ref49","doi-asserted-by":"publisher","DOI":"10.1002\/adma.201801187"},{"key":"ref50","doi-asserted-by":"publisher","DOI":"10.1063\/1.5124915"},{"key":"ref51","first-page":"854","article-title":"Technology-design co-optimization of resistive cross-point array for accelerating learning algorithms on chip","volume-title":"Proc. Design, Autom. Test Eur. Conf. Exhib.","author":"Chen"},{"key":"ref52","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2014.7001330"},{"key":"ref53","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2021.3097299"},{"key":"ref54","article-title":"X-CHANGR: Changing memristive crossbar mapping for mitigating line-resistance induced accuracy degradation in deep neural networks","author":"Agrawal","year":"2019","journal-title":"arXiv:1907.00285"},{"key":"ref55","doi-asserted-by":"publisher","DOI":"10.1145\/3362035"}],"container-title":["IEEE Transactions on Circuits and Systems I: Regular Papers"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8919\/9929246\/09865136.pdf?arnumber=9865136","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,2,1]],"date-time":"2024-02-01T12:22:43Z","timestamp":1706790163000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9865136\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,11]]},"references-count":55,"journal-issue":{"issue":"11"},"URL":"https:\/\/doi.org\/10.1109\/tcsi.2022.3199453","relation":{},"ISSN":["1549-8328","1558-0806"],"issn-type":[{"value":"1549-8328","type":"print"},{"value":"1558-0806","type":"electronic"}],"subject":[],"published":{"date-parts":[[2022,11]]}}}