{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,21]],"date-time":"2026-07-21T14:42:42Z","timestamp":1784644962465,"version":"3.55.0"},"reference-count":45,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"12","license":[{"start":{"date-parts":[[2022,12,1]],"date-time":"2022-12-01T00:00:00Z","timestamp":1669852800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2022,12,1]],"date-time":"2022-12-01T00:00:00Z","timestamp":1669852800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,12,1]],"date-time":"2022-12-01T00:00:00Z","timestamp":1669852800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62021004"],"award-info":[{"award-number":["62021004"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["61934006"],"award-info":[{"award-number":["61934006"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["61574106"],"award-info":[{"award-number":["61574106"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100005320","name":"Industry University Research Project of Chongqing Integrated Circuit (IC) Innovation Research Institute, Xidian University","doi-asserted-by":"publisher","award":["CQIRI-2022CXY-05"],"award-info":[{"award-number":["CQIRI-2022CXY-05"]}],"id":[{"id":"10.13039\/501100005320","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Circuits Syst. I"],"published-print":{"date-parts":[[2022,12]]},"DOI":"10.1109\/tcsi.2022.3200410","type":"journal-article","created":{"date-parts":[[2022,9,1]],"date-time":"2022-09-01T19:37:02Z","timestamp":1662061022000},"page":"5247-5258","source":"Crossref","is-referenced-by-count":14,"title":["Trade-Off-Oriented Impedance Optimization of Chiplet-Based 2.5-D Integrated Circuits With a Hybrid MDP Algorithm for Noise Elimination"],"prefix":"10.1109","volume":"69","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-3156-0564","authenticated-orcid":false,"given":"Changle","family":"Zhi","sequence":"first","affiliation":[{"name":"School of Microelectronics, Xidian University, Xi’an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6557-2286","authenticated-orcid":false,"given":"Gang","family":"Dong","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Xidian University, Xi’an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6882-4637","authenticated-orcid":false,"given":"Yang","family":"Wang","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Xidian University, Xi’an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7764-1928","authenticated-orcid":false,"given":"Zhangming","family":"Zhu","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Xidian University, Xi’an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9745-5404","authenticated-orcid":false,"given":"Yintang","family":"Yang","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Xidian University, Xi’an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2014.6865148"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2021.3113918"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2005.861352"},{"key":"ref32","doi-asserted-by":"crossref","first-page":"181","DOI":"10.1109\/TCPMT.2010.2101890","article-title":"High-frequency scalable electrical model and analysis of a through silicon via (TSV)","volume":"1","author":"kim","year":"2011","journal-title":"IEEE Trans Compon Packag Manuf Technol"},{"key":"ref31","doi-asserted-by":"crossref","first-page":"647","DOI":"10.1109\/TADVP.2010.2043673","article-title":"Chip-package hierarchical power distribution network modeling and analysis based on a segmentation method","volume":"33","author":"kim","year":"2010","journal-title":"IEEE Trans Adv Packag"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2013.2276050"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/6040.784476"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2014.6897341"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/ECTC.2016.84"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/ISEMC.2016.7571620"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2017.2770089"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1145\/2463209.2488767"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2019.2930565"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/EPEPS.2018.8534195"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2021.3057236"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2021.3113664"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TCAD.2020.2970019"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.23919\/DATE51398.2021.9474011"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1145\/2966986.2980095"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/JIOT.2020.3024223"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2013.2256211"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.5515\/JKIEES.2011.11.3.192"},{"key":"ref4","year":"2022","journal-title":"NVIDIA NVIDIA Tesla H100"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2020.2975202"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42614.2022.9731678"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1145\/3316781.3317775"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2012.2214482"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1145\/3520197"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2022.3169953"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2021.3059228"},{"key":"ref2","doi-asserted-by":"crossref","first-page":"2202","DOI":"10.1109\/TCSI.2008.920153","article-title":"Wire optimization for multimedia SoC and SiP designs","volume":"55","author":"lee","year":"2008","journal-title":"IEEE Trans Circuits Syst I Reg Papers"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2020.2972019"},{"key":"ref1","article-title":"Analysis of microbump overheads for 2.5 D disintegrated design","author":"ehrett","year":"2017"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS51556.2021.9401546"},{"key":"ref45","doi-asserted-by":"publisher","DOI":"10.1109\/EPEPS.2016.7835405"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijepes.2012.06.059"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijepes.2014.07.069"},{"key":"ref42","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2021.3061547"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1145\/2968446"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1145\/3240765.3240768"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/SaPIW.2017.7944040"},{"key":"ref44","doi-asserted-by":"publisher","DOI":"10.1109\/EDAPS.2015.7383675"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2016.2611009"},{"key":"ref43","first-page":"445","article-title":"Improved target impedance and IC transient current measurement for power distribution network design","author":"kim","year":"2010","journal-title":"Proc IEEE Int Symp Electromagn Compat"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/ISEMC.2016.7571668"}],"container-title":["IEEE Transactions on Circuits and Systems I: Regular Papers"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8919\/9985434\/09874384.pdf?arnumber=9874384","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,1,9]],"date-time":"2023-01-09T21:25:31Z","timestamp":1673299531000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9874384\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,12]]},"references-count":45,"journal-issue":{"issue":"12"},"URL":"https:\/\/doi.org\/10.1109\/tcsi.2022.3200410","relation":{},"ISSN":["1549-8328","1558-0806"],"issn-type":[{"value":"1549-8328","type":"print"},{"value":"1558-0806","type":"electronic"}],"subject":[],"published":{"date-parts":[[2022,12]]}}}