{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T15:57:02Z","timestamp":1781884622842,"version":"3.54.5"},"reference-count":34,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"1","license":[{"start":{"date-parts":[[2023,1,1]],"date-time":"2023-01-01T00:00:00Z","timestamp":1672531200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2023,1,1]],"date-time":"2023-01-01T00:00:00Z","timestamp":1672531200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,1,1]],"date-time":"2023-01-01T00:00:00Z","timestamp":1672531200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62021004"],"award-info":[{"award-number":["62021004"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["61834004"],"award-info":[{"award-number":["61834004"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62134005"],"award-info":[{"award-number":["62134005"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Circuits Syst. I"],"published-print":{"date-parts":[[2023,1]]},"DOI":"10.1109\/tcsi.2022.3211677","type":"journal-article","created":{"date-parts":[[2022,10,10]],"date-time":"2022-10-10T20:10:28Z","timestamp":1665432628000},"page":"88-100","source":"Crossref","is-referenced-by-count":15,"title":["An Analog SiPM Based Receiver With On-Chip Wideband Amplifier Module for Direct ToF LiDAR Applications"],"prefix":"10.1109","volume":"70","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-1421-6745","authenticated-orcid":false,"given":"Xiayu","family":"Wang","sequence":"first","affiliation":[{"name":"School of Microelectronics, Xidian University, Xi’an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6981-0974","authenticated-orcid":false,"given":"Yang","family":"Liu","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Xidian University, Xi’an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9012-5648","authenticated-orcid":false,"given":"Jin","family":"Hu","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Xidian University, Xi’an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0368-3017","authenticated-orcid":false,"given":"Dong","family":"Li","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Xidian University, Xi’an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5015-4989","authenticated-orcid":false,"given":"Rui","family":"Ma","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Xidian University, Xi’an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7764-1928","authenticated-orcid":false,"given":"Zhangming","family":"Zhu","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Xidian University, Xi’an, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TMM.2014.2374357"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1117\/12.850611"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2020.2983834"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2014.2327282"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3020812"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1016\/S0168-9002(03)00749-6"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.23919\/AEIT.2016.7892802"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2013.2284352"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TNS.2016.2582686"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2905163"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2015.2475355"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2012.2222639"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2011.5746333"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2010.2077290"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/NSSMIC.2011.6154110"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2015.7168962"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2623635"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1071\/CH9792111"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/NSSMIC.2018.8824662"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/JEDS.2019.2893802"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2022.3160265"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2020.3001168"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1364\/AO.42.005388"},{"key":"ref24","first-page":"133","article-title":"A 1\u00d716 SIPM array for automotive 3d imaging LiDAR systems","volume-title":"Proc. Int. Image Sensor Workshop","author":"Gnecchi"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2018.2835762"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/ICECS.2018.8617962"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2017.2755989"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2019.2918372"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2020.3022714"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2006.874059"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2015.2475355"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/JPHOT.2015.2402129"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2005.848022"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2021.3089098"}],"container-title":["IEEE Transactions on Circuits and Systems I: Regular Papers"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8919\/10025563\/09913786.pdf?arnumber=9913786","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,1,22]],"date-time":"2024-01-22T22:16:14Z","timestamp":1705961774000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9913786\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,1]]},"references-count":34,"journal-issue":{"issue":"1"},"URL":"https:\/\/doi.org\/10.1109\/tcsi.2022.3211677","relation":{},"ISSN":["1549-8328","1558-0806"],"issn-type":[{"value":"1549-8328","type":"print"},{"value":"1558-0806","type":"electronic"}],"subject":[],"published":{"date-parts":[[2023,1]]}}}