{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T15:53:08Z","timestamp":1781884388610,"version":"3.54.5"},"reference-count":24,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"1","license":[{"start":{"date-parts":[[2023,1,1]],"date-time":"2023-01-01T00:00:00Z","timestamp":1672531200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2023,1,1]],"date-time":"2023-01-01T00:00:00Z","timestamp":1672531200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,1,1]],"date-time":"2023-01-01T00:00:00Z","timestamp":1672531200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100012166","name":"National Key Research and Development Program of China","doi-asserted-by":"publisher","award":["2021YFA1200700"],"award-info":[{"award-number":["2021YFA1200700"]}],"id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62235009"],"award-info":[{"award-number":["62235009"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Shanghai Committee of Science and Technology","award":["21TS1401400"],"award-info":[{"award-number":["21TS1401400"]}]},{"name":"Young Scientist Project of the Ministry of Education (MOE) Innovation Platform"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Circuits Syst. I"],"published-print":{"date-parts":[[2023,1]]},"DOI":"10.1109\/tcsi.2022.3217273","type":"journal-article","created":{"date-parts":[[2022,11,4]],"date-time":"2022-11-04T20:23:48Z","timestamp":1667593428000},"page":"142-153","source":"Crossref","is-referenced-by-count":4,"title":["Noise Model of Large-Format Readout Integrated Circuit for Infrared Focal Plane Array"],"prefix":"10.1109","volume":"70","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-2551-7044","authenticated-orcid":false,"given":"Zhangcheng","family":"Huang","sequence":"first","affiliation":[{"name":"State Key Laboratory of ASIC and System, Frontier Institute of Chip and System, and the Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2015.2388834"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2009.2030646"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2016.2593991"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2015.2464672"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2017.8050414"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/NEWCAS.2018.8585674"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1016\/0375-9601(69)90076-0"},{"key":"ref17","first-page":"1","article-title":"A 0.7e?rms-temporal-readout-noise CMOS image sensor for low-light-level imaging","author":"chen","year":"2012","journal-title":"Proc IEEE Int Solid-State Circuits Conf"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1007\/s11664-010-1084-9"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/ASICON52560.2021.9620446"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM19573.2019.8993432"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1117\/12.2300779"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1117\/12.921232"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1117\/12.551062"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1117\/12.55996"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2021.3068595"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1117\/12.2533015"},{"key":"ref1","first-page":"90","article-title":"Review of the development of 2k2 IR FPAs for astronomy and space in Europe","author":"badano","year":"2018","journal-title":"Proc SPIE"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/16.737447"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2016.2537824"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2018.2878580"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2014.2332264"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/LSSC.2020.3017705"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2737549"}],"container-title":["IEEE Transactions on Circuits and Systems I: Regular Papers"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8919\/10025563\/09939172.pdf?arnumber=9939172","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,2,21]],"date-time":"2023-02-21T00:04:00Z","timestamp":1676937840000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9939172\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,1]]},"references-count":24,"journal-issue":{"issue":"1"},"URL":"https:\/\/doi.org\/10.1109\/tcsi.2022.3217273","relation":{},"ISSN":["1549-8328","1558-0806"],"issn-type":[{"value":"1549-8328","type":"print"},{"value":"1558-0806","type":"electronic"}],"subject":[],"published":{"date-parts":[[2023,1]]}}}