{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,3,26]],"date-time":"2025-03-26T18:24:18Z","timestamp":1743013458404,"version":"3.37.3"},"reference-count":15,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"12","license":[{"start":{"date-parts":[[2023,12,1]],"date-time":"2023-12-01T00:00:00Z","timestamp":1701388800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2023,12,1]],"date-time":"2023-12-01T00:00:00Z","timestamp":1701388800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,12,1]],"date-time":"2023-12-01T00:00:00Z","timestamp":1701388800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100020950","name":"National Science and Technology Council","doi-asserted-by":"publisher","award":["112-2622-E-A49-010","112-2221-E-A49-145-MY3","112-2221-E-A49-016-MY3","112-2622-8-A49-014-SB"],"award-info":[{"award-number":["112-2622-E-A49-010","112-2221-E-A49-145-MY3","112-2221-E-A49-016-MY3","112-2622-8-A49-014-SB"]}],"id":[{"id":"10.13039\/501100020950","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Circuits Syst. I"],"published-print":{"date-parts":[[2023,12]]},"DOI":"10.1109\/tcsi.2023.3298795","type":"journal-article","created":{"date-parts":[[2023,8,9]],"date-time":"2023-08-09T17:39:29Z","timestamp":1691602769000},"page":"4999-5008","source":"Crossref","is-referenced-by-count":1,"title":["An Interleaved Hybrid-Module Step-Up Converter With Reduction of Switching Frequency and Output Ripple"],"prefix":"10.1109","volume":"70","author":[{"given":"Ya-Ting","family":"Hsu","sequence":"first","affiliation":[{"name":"Institute of Electrical and Computer Engineering, National Yang Ming Chiao Tung University, Hsinchu, Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5052-6869","authenticated-orcid":false,"given":"Jia-Rui","family":"Huang","sequence":"additional","affiliation":[{"name":"Institute of Electrical and Computer Engineering, National Yang Ming Chiao Tung University, Hsinchu, Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Kai-Syun","family":"Chang","sequence":"additional","affiliation":[{"name":"Institute of Electrical and Computer Engineering, National Yang Ming Chiao Tung University, Hsinchu, Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Chin-Hsiang","family":"Liang","sequence":"additional","affiliation":[{"name":"Institute of Electrical and Computer Engineering, National Yang Ming Chiao Tung University, Hsinchu, Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9589-6521","authenticated-orcid":false,"given":"Ke-Horng","family":"Chen","sequence":"additional","affiliation":[{"name":"Institute of Electrical and Computer Engineering, National Yang Ming Chiao Tung University, Hsinchu, Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ying-Hsi","family":"Lin","sequence":"additional","affiliation":[{"name":"Realtek Semiconductor Corporation, Hsinchu, Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Shian-Ru","family":"Lin","sequence":"additional","affiliation":[{"name":"Realtek Semiconductor Corporation, Hsinchu, Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Tsung-Yen","family":"Tsai","sequence":"additional","affiliation":[{"name":"Realtek Semiconductor Corporation, Hsinchu, Taiwan"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/vlsic.2014.6858438"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2017.7870398"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2019.8662530"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2013.6487770"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2013.2274826"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2017.2735491"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2013.2259044"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2012.6176892"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2011.2159054"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2015.2416315"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2018.2884351"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2018.8310368"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2679065"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2018.8310309"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42615.2023.10067756"}],"container-title":["IEEE Transactions on Circuits and Systems I: Regular Papers"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8919\/10363413\/10214191.pdf?arnumber=10214191","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,1,12]],"date-time":"2024-01-12T02:00:56Z","timestamp":1705024856000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10214191\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,12]]},"references-count":15,"journal-issue":{"issue":"12"},"URL":"https:\/\/doi.org\/10.1109\/tcsi.2023.3298795","relation":{},"ISSN":["1549-8328","1558-0806"],"issn-type":[{"type":"print","value":"1549-8328"},{"type":"electronic","value":"1558-0806"}],"subject":[],"published":{"date-parts":[[2023,12]]}}}