{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,18]],"date-time":"2026-03-18T23:51:01Z","timestamp":1773877861879,"version":"3.50.1"},"reference-count":53,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"2","license":[{"start":{"date-parts":[[2024,2,1]],"date-time":"2024-02-01T00:00:00Z","timestamp":1706745600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2024,2,1]],"date-time":"2024-02-01T00:00:00Z","timestamp":1706745600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,2,1]],"date-time":"2024-02-01T00:00:00Z","timestamp":1706745600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100012166","name":"National Key Research and Development Program of China","doi-asserted-by":"publisher","award":["2019YFA0706100"],"award-info":[{"award-number":["2019YFA0706100"]}],"id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"NSFC","doi-asserted-by":"publisher","award":["U21B2030"],"award-info":[{"award-number":["U21B2030"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"NSFC","doi-asserted-by":"publisher","award":["92264204"],"award-info":[{"award-number":["92264204"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"NSFC","doi-asserted-by":"publisher","award":["82151305"],"award-info":[{"award-number":["82151305"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Circuits Syst. I"],"published-print":{"date-parts":[[2024,2]]},"DOI":"10.1109\/tcsi.2023.3340114","type":"journal-article","created":{"date-parts":[[2023,12,19]],"date-time":"2023-12-19T19:56:20Z","timestamp":1703015780000},"page":"620-633","source":"Crossref","is-referenced-by-count":8,"title":["TFT-Based Near-Sensor In-Memory Computing: Circuits and Architecture Perspectives of Large-Area eDRAM and ROM CiM Chips"],"prefix":"10.1109","volume":"71","author":[{"ORCID":"https:\/\/orcid.org\/0009-0006-7687-2982","authenticated-orcid":false,"given":"Jialong","family":"Liu","sequence":"first","affiliation":[{"name":"Department of Electronic Engineering, BNRist, Tsinghua University, Beijing, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9994-8736","authenticated-orcid":false,"given":"Wenjun","family":"Tang","sequence":"additional","affiliation":[{"name":"Department of Electronic Engineering, BNRist, Tsinghua University, Beijing, China"}]},{"given":"Hongtian","family":"Li","sequence":"additional","affiliation":[{"name":"Department of Electronic Engineering, BNRist, Tsinghua University, Beijing, China"}]},{"ORCID":"https:\/\/orcid.org\/0009-0005-6875-2721","authenticated-orcid":false,"given":"Deyun","family":"Chen","sequence":"additional","affiliation":[{"name":"Key Laboratory of Advanced Sensor and Integrated System, Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen, China"}]},{"given":"Weihang","family":"Long","sequence":"additional","affiliation":[{"name":"Department of Electronic Engineering, BNRist, Tsinghua University, Beijing, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-4892-2309","authenticated-orcid":false,"given":"Yongpan","family":"Liu","sequence":"additional","affiliation":[{"name":"Department of Electronic Engineering, BNRist, Tsinghua University, Beijing, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6806-5324","authenticated-orcid":false,"given":"Chen","family":"Jiang","sequence":"additional","affiliation":[{"name":"Department of Electronic Engineering, BNRist, Tsinghua University, Beijing, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2421-353X","authenticated-orcid":false,"given":"Huazhong","family":"Yang","sequence":"additional","affiliation":[{"name":"Department of Electronic Engineering, BNRist, Tsinghua University, Beijing, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-8051-3345","authenticated-orcid":false,"given":"Xueqing","family":"Li","sequence":"additional","affiliation":[{"name":"Department of Electronic Engineering, BNRist, Tsinghua University, Beijing, China"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1002\/adma.202004416"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM45625.2022.10019492"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2019.2907317"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42614.2022.9731630"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3034192"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42614.2022.9731675"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2021.3090668"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/A-SSCC53895.2021.9634759"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9365839"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2012.2190168"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1088\/2058-8585\/aba79a"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1063\/1.4953034"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1016\/j.mtadv.2019.100040"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2010.2088127"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1002\/jsid.963"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2017.7870359"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2015.7063042"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1038\/s41586-021-03625-w"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42614.2022.9731790"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1143\/JJAP.51.021201"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2015.7409641"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIT.2015.7223680"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2632303"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.23919\/VLSIC.2017.8008466"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2018.8310395"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM13553.2020.9371900"},{"key":"ref27","first-page":"1","article-title":"First demonstration of sub-12 nm Lg gate last IGZO-TFTs with oxygen tunnel architecture for front gate devices","volume-title":"Proc. Symp. VLSI Technol.","author":"Subhechha"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM45625.2022.10019435"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/VLSITechnologyandCir46769.2022.9830448"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2022.3154693"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/VLSITechnologyandCir46769.2022.9830271"},{"key":"ref32","first-page":"26.5.1","article-title":"Inter-layer dielectric engineering for monolithic stacking 4F2\u20132 T0C DRAM with channel-all-around (CAA) IGZO FET to achieve good reliability (>104 s bias stress, >1012 cycles Endurance)","volume-title":"IEDM Tech. Dig.","author":"Chen"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.7567\/1347-4065\/ab650c"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM19573.2019.8993599"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM13553.2020.9372006"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM19574.2021.9720576"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2015.2489842"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1109\/DAC18072.2020.9218570"},{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2016.2600498"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2019.8662442"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM19574.2021.9721312"},{"key":"ref42","first-page":"18.2.1","article-title":"A > 64 multiple states and > 210 TOPS\/W high efficient computing by monolithic Si\/CAAC-IGZO + super-lattice ZrO2\/Al2 O3\/ZrO2 for ultra-low power edge AI application","volume-title":"IEDM Tech. Dig.","author":"Chen"},{"key":"ref43","doi-asserted-by":"publisher","DOI":"10.1088\/2058-8585\/ac541d"},{"key":"ref44","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2019.2937227"},{"key":"ref45","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM45625.2022.10019454"},{"key":"ref46","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM19574.2021.9720666"},{"key":"ref47","doi-asserted-by":"publisher","DOI":"10.1109\/VLSITechnologyandCir46769.2022.9830482"},{"key":"ref48","doi-asserted-by":"publisher","DOI":"10.1145\/3489517.3530576"},{"key":"ref49","first-page":"1","article-title":"Hidden-ROM: A compute-in-ROM architecture to deploy large-scale neural networks on chip with flexible and scalable post-fabrication task transfer capability","volume-title":"Proc. 41st IEEE\/ACM Int. Conf. Comput. Aided Design (ICCAD)","author":"Chen"},{"key":"ref50","doi-asserted-by":"publisher","DOI":"10.1007\/s10462-023-10464-w"},{"key":"ref51","doi-asserted-by":"publisher","DOI":"10.1007\/978-3-319-46493-0_32"},{"key":"ref52","article-title":"Network in network","author":"Lin","year":"2013","journal-title":"arXiv:1312.4400"},{"key":"ref53","volume-title":"CACTI: An Integrated Cache and Memory Access Time, Cycle Time, Area, Leakage, and Dynamic Power Model","year":"2017"}],"container-title":["IEEE Transactions on Circuits and Systems I: Regular Papers"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8919\/10416295\/10365653.pdf?arnumber=10365653","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,3,6]],"date-time":"2024-03-06T23:33:57Z","timestamp":1709768037000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10365653\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,2]]},"references-count":53,"journal-issue":{"issue":"2"},"URL":"https:\/\/doi.org\/10.1109\/tcsi.2023.3340114","relation":{},"ISSN":["1549-8328","1558-0806"],"issn-type":[{"value":"1549-8328","type":"print"},{"value":"1558-0806","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024,2]]}}}