{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,14]],"date-time":"2026-04-14T00:27:23Z","timestamp":1776126443020,"version":"3.50.1"},"reference-count":25,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"8","license":[{"start":{"date-parts":[[2024,8,1]],"date-time":"2024-08-01T00:00:00Z","timestamp":1722470400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2024,8,1]],"date-time":"2024-08-01T00:00:00Z","timestamp":1722470400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,8,1]],"date-time":"2024-08-01T00:00:00Z","timestamp":1722470400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"National Key Research and Development Program of China","award":["2023YFB4404500"],"award-info":[{"award-number":["2023YFB4404500"]}]},{"name":"National Key Research and Development Program of China","award":["2023YFB4400079"],"award-info":[{"award-number":["2023YFB4400079"]}]},{"name":"National Key Research and Development Program of China","award":["2022ZD0117602"],"award-info":[{"award-number":["2022ZD0117602"]}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["92164302"],"award-info":[{"award-number":["92164302"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62274170"],"award-info":[{"award-number":["62274170"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62204251"],"award-info":[{"award-number":["62204251"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62174168"],"award-info":[{"award-number":["62174168"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"Youth Innovation Promotion Association CAS","doi-asserted-by":"publisher","award":["2022233"],"award-info":[{"award-number":["2022233"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Strategic Priority Research Program of the Chinese Academy of Sciences","award":["XDB44010200"],"award-info":[{"award-number":["XDB44010200"]}]},{"name":"Science and Technology Council of Shanghai","award":["22DZ2229009"],"award-info":[{"award-number":["22DZ2229009"]}]},{"name":"Science and Technology Council of Shanghai","award":["23XD1404700"],"award-info":[{"award-number":["23XD1404700"]}]},{"name":"Autonomous Deployment Project of the State Key Laboratory of Materials for Integrated Circuits","award":["NKLJC-Z2023-B04"],"award-info":[{"award-number":["NKLJC-Z2023-B04"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Circuits Syst. I"],"published-print":{"date-parts":[[2024,8]]},"DOI":"10.1109\/tcsi.2024.3412891","type":"journal-article","created":{"date-parts":[[2024,6,24]],"date-time":"2024-06-24T20:16:43Z","timestamp":1719260203000},"page":"3636-3646","source":"Crossref","is-referenced-by-count":1,"title":["A Subthreshold Adaptive-Reference Leakage- Compensation Sensing Scheme for 3D PCM With Enhanced Sensing Margin and Endurance"],"prefix":"10.1109","volume":"71","author":[{"ORCID":"https:\/\/orcid.org\/0009-0003-0581-3035","authenticated-orcid":false,"given":"Qiuyao","family":"Yu","sequence":"first","affiliation":[{"name":"State Key Laboratory of Materials for Integrated Circuits, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4321-0385","authenticated-orcid":false,"given":"Yu","family":"Lei","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Materials for Integrated Circuits, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Qian","family":"Wang","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Materials for Integrated Circuits, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5766-5746","authenticated-orcid":false,"given":"Houpeng","family":"Chen","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Materials for Integrated Circuits, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7859-9429","authenticated-orcid":false,"given":"Zhitang","family":"Song","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Materials for Integrated Circuits, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/iedm.2009.5424263"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM13553.2020.9371976"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1088\/1361-6463\/ab39a0"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.23919\/VLSIT.2017.7998208"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2014.2368259"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2012.2235013"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/VLSI-SoC53125.2021.9606969"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2018.2868460"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.2019.8702296"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2018.8310392"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2019.8662393"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2018.2816246"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2021.3133945"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/4.272096"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2019.2918235"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/NVMTS.2015.7457426"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TNANO.2014.2363352"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS46773.2023.10182196"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2010.2042768"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/LED.2012.2214472"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2010.5703445"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS45731.2020.9181075"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/irps48227.2022.9764489"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIT.2018.8510621"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2017.2729665"}],"container-title":["IEEE Transactions on Circuits and Systems I: Regular Papers"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/8919\/10618913\/10568983.pdf?arnumber=10568983","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,1,15]],"date-time":"2025-01-15T20:29:31Z","timestamp":1736972971000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10568983\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,8]]},"references-count":25,"journal-issue":{"issue":"8"},"URL":"https:\/\/doi.org\/10.1109\/tcsi.2024.3412891","relation":{},"ISSN":["1549-8328","1558-0806"],"issn-type":[{"value":"1549-8328","type":"print"},{"value":"1558-0806","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024,8]]}}}