{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T15:51:04Z","timestamp":1781884264922,"version":"3.54.5"},"reference-count":34,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"9","license":[{"start":{"date-parts":[[2025,9,1]],"date-time":"2025-09-01T00:00:00Z","timestamp":1756684800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,9,1]],"date-time":"2025-09-01T00:00:00Z","timestamp":1756684800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,9,1]],"date-time":"2025-09-01T00:00:00Z","timestamp":1756684800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100020950","name":"National Science and Technology Council","doi-asserted-by":"publisher","award":["113-2640-E-006-003"],"award-info":[{"award-number":["113-2640-E-006-003"]}],"id":[{"id":"10.13039\/501100020950","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100020950","name":"National Science and Technology Council","doi-asserted-by":"publisher","award":["113-2640-E-007-003"],"award-info":[{"award-number":["113-2640-E-007-003"]}],"id":[{"id":"10.13039\/501100020950","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100020950","name":"National Science and Technology Council","doi-asserted-by":"publisher","award":["113-2622-E-A49-004"],"award-info":[{"award-number":["113-2622-E-A49-004"]}],"id":[{"id":"10.13039\/501100020950","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100020950","name":"National Science and Technology Council","doi-asserted-by":"publisher","award":["112-2622-E-A49-010"],"award-info":[{"award-number":["112-2622-E-A49-010"]}],"id":[{"id":"10.13039\/501100020950","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100020950","name":"National Science and Technology Council","doi-asserted-by":"publisher","award":["112-2221-E-A49-145-MY3"],"award-info":[{"award-number":["112-2221-E-A49-145-MY3"]}],"id":[{"id":"10.13039\/501100020950","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100020950","name":"National Science and Technology Council","doi-asserted-by":"publisher","award":["112-2221-E-A49-016-MY3"],"award-info":[{"award-number":["112-2221-E-A49-016-MY3"]}],"id":[{"id":"10.13039\/501100020950","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100020950","name":"National Science and Technology Council","doi-asserted-by":"publisher","award":["113-2640-E-007-003"],"award-info":[{"award-number":["113-2640-E-007-003"]}],"id":[{"id":"10.13039\/501100020950","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100020950","name":"National Science and Technology Council","doi-asserted-by":"publisher","award":["113-2640-E-006-003"],"award-info":[{"award-number":["113-2640-E-006-003"]}],"id":[{"id":"10.13039\/501100020950","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100020950","name":"National Science and Technology Council","doi-asserted-by":"publisher","award":["114-2640-E-007-008"],"award-info":[{"award-number":["114-2640-E-007-008"]}],"id":[{"id":"10.13039\/501100020950","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100020950","name":"National Science and Technology Council","doi-asserted-by":"publisher","award":["114-2640-E-006-008"],"award-info":[{"award-number":["114-2640-E-006-008"]}],"id":[{"id":"10.13039\/501100020950","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Circuits Syst. I"],"published-print":{"date-parts":[[2025,9]]},"DOI":"10.1109\/tcsi.2025.3567507","type":"journal-article","created":{"date-parts":[[2025,5,15]],"date-time":"2025-05-15T13:36:07Z","timestamp":1747316167000},"page":"4408-4419","source":"Crossref","is-referenced-by-count":1,"title":["A 94.2% Peak Efficiency Full Duty Range Flying-Capacitor Sharing Dynamic Four-Path Hybrid Converter With Reduced Body Diode Loss Technique"],"prefix":"10.1109","volume":"72","author":[{"ORCID":"https:\/\/orcid.org\/0009-0003-5596-4165","authenticated-orcid":false,"given":"Chi-Lung","family":"Lee","sequence":"first","affiliation":[{"name":"Institute of Electronics and Electrical Engineering, National Yang Ming Chiao Tung University, Hsinchu, Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0004-1773-8543","authenticated-orcid":false,"given":"Yu-Tse","family":"Shih","sequence":"additional","affiliation":[{"name":"Institute of Electronics and Electrical Engineering, National Yang Ming Chiao Tung University, Hsinchu, Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0009-0337-9152","authenticated-orcid":false,"given":"Yi-Ching","family":"Chiu","sequence":"additional","affiliation":[{"name":"Institute of Electronics and Electrical Engineering, National Yang Ming Chiao Tung University, Hsinchu, Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Chieh-Sheng","family":"Hung","sequence":"additional","affiliation":[{"name":"Institute of Electronics and Electrical Engineering, National Yang Ming Chiao Tung University, Hsinchu, Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Rong-Bin","family":"Guo","sequence":"additional","affiliation":[{"name":"Institute of Electronics and Electrical Engineering, National Yang Ming Chiao Tung University, Hsinchu, Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9589-6521","authenticated-orcid":false,"given":"Ke-Horng","family":"Chen","sequence":"additional","affiliation":[{"name":"Institute of Electronics and Electrical Engineering, National Yang Ming Chiao Tung University, Hsinchu, Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Kuo-Lin","family":"Zheng","sequence":"additional","affiliation":[{"name":"FitiPower Corporation, Hsinchu, Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Ying-Hsi","family":"Lin","sequence":"additional","affiliation":[{"name":"Realtek Semiconductor Corporation, Hsinchu, Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Shian-Ru","family":"Lin","sequence":"additional","affiliation":[{"name":"Realtek Semiconductor Corporation, Hsinchu, Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Tsung-Yen","family":"Tsai","sequence":"additional","affiliation":[{"name":"Realtek Semiconductor Corporation, Hsinchu, Taiwan"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2015.2464720"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/CICC.2014.6946134"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2018.2884912"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2022.3223680"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2014.2378216"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2776298"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/cicc48029.2020.9075926"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/esscirc.2015.7313859"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/cicc57935.2023.10121275"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/esscirc53450.2021.9567868"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/LSSC.2024.3410034"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/isscc49657.2024.10454539"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/LSSC.2023.3260952"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2024.3394804"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3206323"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/isscc19947.2020.9063087"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42614.2022.9731669"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42615.2023.10067710"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42615.2023.10067316"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/vlsitechnologyandcir46769.2022.9830419"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/vlsitechnologyandcir46769.2022.9830233"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9366005"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3162166"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42615.2023.10067843"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2957237"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42615.2023.10067463"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3228233"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2020.3003519"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/TPEL.2019.2930011"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2606581"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIC.2018.8502403"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/ESSCIRC.2018.8494303"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2017.7870323"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/ESSERC62670.2024.10719588"}],"container-title":["IEEE Transactions on Circuits and Systems I: Regular Papers"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/8919\/11143801\/11005406.pdf?arnumber=11005406","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,8,29]],"date-time":"2025-08-29T04:24:51Z","timestamp":1756441491000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11005406\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,9]]},"references-count":34,"journal-issue":{"issue":"9"},"URL":"https:\/\/doi.org\/10.1109\/tcsi.2025.3567507","relation":{},"ISSN":["1549-8328","1558-0806"],"issn-type":[{"value":"1549-8328","type":"print"},{"value":"1558-0806","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025,9]]}}}