{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T16:30:17Z","timestamp":1781886617693,"version":"3.54.5"},"reference-count":43,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"2","license":[{"start":{"date-parts":[[2026,2,1]],"date-time":"2026-02-01T00:00:00Z","timestamp":1769904000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/creativecommons.org\/licenses\/by\/4.0\/legalcode"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Circuits Syst. I"],"published-print":{"date-parts":[[2026,2]]},"DOI":"10.1109\/tcsi.2025.3612452","type":"journal-article","created":{"date-parts":[[2025,9,24]],"date-time":"2025-09-24T17:36:09Z","timestamp":1758735369000},"page":"800-813","source":"Crossref","is-referenced-by-count":1,"title":["Ferroelectric Digital In-Memory Computing for Scalable, Reliable, and Efficient Similarity Computation"],"prefix":"10.1109","volume":"73","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-0727-6192","authenticated-orcid":false,"given":"Anirban","family":"Kar","sequence":"first","affiliation":[{"name":"Chair of AI Processor Design, Technical University of Munich (TUM), Munich, Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7841-1975","authenticated-orcid":false,"given":"Albi","family":"Mema","sequence":"additional","affiliation":[{"name":"Chair of AI Processor Design, Technical University of Munich (TUM), Munich, Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Thorgund","family":"Nemec","sequence":"additional","affiliation":[{"name":"GlobalFoundries Dresden Module One LLC & Co. KG, Dresden, Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Stefan","family":"D\u00fcnkel","sequence":"additional","affiliation":[{"name":"GlobalFoundries Dresden Module One LLC & Co. KG, Dresden, Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9524-5112","authenticated-orcid":false,"given":"Halid","family":"Mulaosmanovic","sequence":"additional","affiliation":[{"name":"GlobalFoundries Dresden Module One LLC & Co. KG, Dresden, Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Sven","family":"Beyer","sequence":"additional","affiliation":[{"name":"GlobalFoundries Dresden Module One LLC & Co. KG, Dresden, Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3356-8917","authenticated-orcid":false,"given":"Yogesh Singh","family":"Chauhan","sequence":"additional","affiliation":[{"name":"Indian Institute of Technology Kanpur, Kanpur, India"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5649-3102","authenticated-orcid":false,"given":"Hussam","family":"Amrouch","sequence":"additional","affiliation":[{"name":"Chair of AI Processor Design, Technical University of Munich (TUM), Munich, Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1038\/nature14539"},{"key":"ref2","first-page":"1","article-title":"ImageNet classification with deep convolutional neural networks","volume-title":"Proc. Adv. Neural Inf. Process. Syst.","volume":"25","author":"Krizhevsky"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/msp.2012.2205597"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/jproc.2017.2761740"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/twc.2019.2946140"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1023\/a:1019956318069"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1007\/s10462-013-9406-y"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/biocas.2018.8584751"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/tc.2023.3248286"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1038\/s41928-019-0321-3"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/jproc.2015.2434888"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.23919\/date.2019.8715198"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2005.864128"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1038\/s41467-020-15254-4"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ted.2021.3110464"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/jproc.2010.2070830"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1088\/0022-3727\/46\/7\/074001"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/tcsi.2018.2885343"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/vlsic.2012.6243781"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/ted.2020.2994896"},{"key":"ref21","first-page":"11.5.1","article-title":"A 28 nm HKMG super low power embedded NVM technology based on ferroelectric FETs","author":"Trentzsch","year":"2016","journal-title":"IEDM Tech. Dig."},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.23919\/date51398.2021.9474025"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/tcsii.2018.2889225"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/tmag.2020.3028045"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/irps46558.2021.9405092"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/irps45951.2020.9128323"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1038\/s41928-020-0410-3"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1145\/2966986.2967037"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/led.2022.3179385"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/tcsi.2013.2278332"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/ted.2023.3287941"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/iscas.2019.8702534"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/dtis53253.2021.9505078"},{"key":"ref34","doi-asserted-by":"crossref","DOI":"10.1016\/j.sse.2022.108554","article-title":"Ferroelectric FDSOI FET modeling for memory and logic applications","volume":"200","author":"Chatterjee","year":"2023","journal-title":"Solid-State Electron."},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/cicc.2019.8780155"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/ted.2013.2283084"},{"key":"ref37","volume-title":"Virtuoso Layout Suite","author":"Systems","year":"2024"},{"key":"ref38","first-page":"132","article-title":"Cross-layer design for computing-in-memory: From devices, circuits, to architectures and applications","volume-title":"Proc. 26th Asia South Pacific Design Autom. Conf. (ASP-DAC)","author":"Amrouch"},{"key":"ref39","first-page":"C104","article-title":"1Mb 0.41 \u03bcm2 2T-2R cell nonvolatile TCAM with two-bit encoding and clocked self-referenced sensing","volume-title":"Proc. Symp. VLSI Technol.","author":"Li"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2013.2292055"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1109\/tnano.2023.3271308"},{"key":"ref42","volume-title":"Design Compiler for Logic Synthesis","year":"2024"},{"key":"ref43","doi-asserted-by":"publisher","DOI":"10.1109\/mssc.2015.2418155"}],"container-title":["IEEE Transactions on Circuits and Systems I: Regular Papers"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/8919\/11368669\/11178075.pdf?arnumber=11178075","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,1,30]],"date-time":"2026-01-30T21:06:59Z","timestamp":1769807219000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11178075\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,2]]},"references-count":43,"journal-issue":{"issue":"2"},"URL":"https:\/\/doi.org\/10.1109\/tcsi.2025.3612452","relation":{},"ISSN":["1549-8328","1558-0806"],"issn-type":[{"value":"1549-8328","type":"print"},{"value":"1558-0806","type":"electronic"}],"subject":[],"published":{"date-parts":[[2026,2]]}}}