{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,31]],"date-time":"2026-03-31T21:08:28Z","timestamp":1774991308568,"version":"3.50.1"},"reference-count":44,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"4","license":[{"start":{"date-parts":[[2026,4,1]],"date-time":"2026-04-01T00:00:00Z","timestamp":1775001600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2026,4,1]],"date-time":"2026-04-01T00:00:00Z","timestamp":1775001600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2026,4,1]],"date-time":"2026-04-01T00:00:00Z","timestamp":1775001600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"National Key Research and Development Program of China","award":["2023YFB2904900"],"award-info":[{"award-number":["2023YFB2904900"]}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62171065"],"award-info":[{"award-number":["62171065"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62201100"],"award-info":[{"award-number":["62201100"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62371077"],"award-info":[{"award-number":["62371077"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Circuits Syst. I"],"published-print":{"date-parts":[[2026,4]]},"DOI":"10.1109\/tcsi.2025.3619952","type":"journal-article","created":{"date-parts":[[2025,10,14]],"date-time":"2025-10-14T17:42:55Z","timestamp":1760463775000},"page":"2510-2521","source":"Crossref","is-referenced-by-count":0,"title":["Broadband GaAs HBT Doherty Power Amplifier Using Lumped Compensation Network and Input Phase Correction for 5G Applications"],"prefix":"10.1109","volume":"73","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-7470-4359","authenticated-orcid":false,"given":"Ruibin","family":"Gao","sequence":"first","affiliation":[{"name":"School of Microelectronics and Communication Engineering, Chongqing University, Chongqing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8384-2809","authenticated-orcid":false,"given":"Shuang","family":"Liu","sequence":"additional","affiliation":[{"name":"School of Microelectronics and Communication Engineering, Chongqing University, Chongqing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-8744-395X","authenticated-orcid":false,"given":"Weimin","family":"Shi","sequence":"additional","affiliation":[{"name":"School of Microelectronics and Communication Engineering, Chongqing University, Chongqing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4914-1464","authenticated-orcid":false,"given":"Zhijiang","family":"Dai","sequence":"additional","affiliation":[{"name":"School of Microelectronics and Communication Engineering, Chongqing University, Chongqing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9893-3284","authenticated-orcid":false,"given":"Mingyu","family":"Li","sequence":"additional","affiliation":[{"name":"School of Microelectronics and Communication Engineering, Chongqing University, Chongqing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1628-5429","authenticated-orcid":false,"given":"Shichang","family":"Chen","sequence":"additional","affiliation":[{"name":"Shaoxing Integrated Circuit Institute, Hangzhou Dianzi University, Hangzhou, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3781-3219","authenticated-orcid":false,"given":"Jingzhou","family":"Pang","sequence":"additional","affiliation":[{"name":"School of Microelectronics and Communication Engineering, Chongqing University, Chongqing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/MCAS.2020.3027221"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/MMM.2019.2963607"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2017.2658689"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2020.2972163"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2018.2870830"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2015.2495201"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2020.3026064"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2016.2623705"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2021.3051734"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3145349"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2019.2932977"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2023.3263478"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2024.3355295"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ims30576.2020.9223999"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2014.2333713"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2018.2884415"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2016.2615004"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2018.2884404"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2021.3129166"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2019.2963868"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2017.2766066"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2023.3282731"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/JETCAS.2024.3351075"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2019.2938167"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2018.2867426"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2021.3067034"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2023.3277098"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2024.3501312"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2021.3124302"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2023.3291528"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2025.3549058"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.23919\/APMC55665.2022.9999751"},{"key":"ref33","doi-asserted-by":"publisher","DOI":"10.1109\/ims40175.2024.10600295"},{"key":"ref34","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2023.3256079"},{"key":"ref35","doi-asserted-by":"publisher","DOI":"10.1109\/IMWS-5G.2018.8484553"},{"key":"ref36","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3048715"},{"key":"ref37","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2023.3246042"},{"key":"ref38","doi-asserted-by":"publisher","DOI":"10.1109\/LMWT.2023.3266764"},{"key":"ref39","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2002.801169"},{"key":"ref40","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2020.3002161"},{"key":"ref41","doi-asserted-by":"publisher","DOI":"10.1109\/IMS19712.2021.9574882"},{"key":"ref42","doi-asserted-by":"publisher","DOI":"10.1109\/LSSC.2024.3471855"},{"key":"ref43","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2024.3434572"},{"key":"ref44","first-page":"114","article-title":"A 3.5-GHz SiGe 0.35 \u03bcm HBT flip-chip assembled on ceramics integrated passive device Doherty power amplifier for SiP integration","volume-title":"Proc. Asia Pacific Microw. Conf.","author":"Kuo"}],"container-title":["IEEE Transactions on Circuits and Systems I: Regular Papers"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/8919\/11458063\/11202985.pdf?arnumber=11202985","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,3,31]],"date-time":"2026-03-31T19:54:39Z","timestamp":1774986879000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/11202985\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,4]]},"references-count":44,"journal-issue":{"issue":"4"},"URL":"https:\/\/doi.org\/10.1109\/tcsi.2025.3619952","relation":{},"ISSN":["1549-8328","1558-0806"],"issn-type":[{"value":"1549-8328","type":"print"},{"value":"1558-0806","type":"electronic"}],"subject":[],"published":{"date-parts":[[2026,4]]}}}