{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,4,18]],"date-time":"2025-04-18T05:10:42Z","timestamp":1744953042483},"reference-count":22,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"9","license":[{"start":{"date-parts":[[2014,9,1]],"date-time":"2014-09-01T00:00:00Z","timestamp":1409529600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"funder":[{"name":"Panasonic Industrial Devices, Singapore"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Circuits Syst. II"],"published-print":{"date-parts":[[2014,9]]},"DOI":"10.1109\/tcsii.2014.2335426","type":"journal-article","created":{"date-parts":[[2014,9,1]],"date-time":"2014-09-01T18:16:02Z","timestamp":1409595362000},"page":"706-710","source":"Crossref","is-referenced-by-count":12,"title":["A 3-Gb\/s\/ch Simultaneous Bidirectional Capacitive Coupling Transceiver for 3DICs"],"prefix":"10.1109","volume":"61","author":[{"given":"Myat Thu Linn","family":"Aung","sequence":"first","affiliation":[]},{"given":"Eric","family":"Lim","sequence":"additional","affiliation":[]},{"given":"Takefumi","family":"Yoshikawa","sequence":"additional","affiliation":[]},{"given":"Tony Tae-Hyoung","family":"Kim","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ASSCC.2009.5357251"},{"key":"ref11","first-page":"142","article-title":"A 1.2 Gb\/s\/pin wireless superconnect based on inductive inter-chip signaling (IIS)","volume":"1","author":"mizoguchi","year":"0","journal-title":"Proc IEEE Int Solid-State Circuits Conf Dig Tech Papers"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2010.2040310"},{"key":"ref13","first-page":"264","article-title":"A 195 Gb\/s 1.2W 3D-stacked inductive inter-chip wireless superconnect with transmit power control scheme","volume":"1","author":"miura","year":"0","journal-title":"Proc IEEE Int Solid-State Circuits Conf Dig Tech Papers"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIC.2006.1705314"},{"key":"ref15","first-page":"358","article-title":"A 0.14 pJ\/b inductive-coupling inter-chip data transceiver with digitally-controlled precise pulse shaping","author":"miura","year":"0","journal-title":"Proc IEEE Int Solid-State Circuits Conf Dig Tech Papers"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2005.845560"},{"key":"ref17","first-page":"448","article-title":"Two 10 Gb\/s\/pin low-power interconnect methods for 3D ICs","author":"gu","year":"0","journal-title":"Proc IEEE Int Solid-State Circuits Conf Dig Tech Papers"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/ISCAS.1995.521445"},{"key":"ref19","first-page":"368","article-title":"Circuit techniques to enable 430 Gb\/s\/ $\\hbox{mm}^{2}$ proximity communication","author":"hopkins","year":"0","journal-title":"Proc IEEE Int Solid-State Circuits Conf Dig Tech Papers"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/MDT.2005.136"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2008.2007463"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2007.914762"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2003.1234260"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2004.831448"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2007.905230"},{"key":"ref2","first-page":"140","article-title":"A 160 Gb\/s interface design configuration for multichip LSI","volume":"1","author":"ezaki","year":"0","journal-title":"Proc IEEE Int Solid-State Circuits Conf Dig Tech Papers"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/DTIP.2008.4752966"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/ICCAD.2006.320124"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/JETCAS.2012.2193839"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2011.2164709"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2009.2031527"}],"container-title":["IEEE Transactions on Circuits and Systems II: Express Briefs"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8920\/6889058\/06848764.pdf?arnumber=6848764","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,12]],"date-time":"2022-01-12T16:50:51Z","timestamp":1642006251000},"score":1,"resource":{"primary":{"URL":"http:\/\/ieeexplore.ieee.org\/document\/6848764\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2014,9]]},"references-count":22,"journal-issue":{"issue":"9"},"URL":"https:\/\/doi.org\/10.1109\/tcsii.2014.2335426","relation":{},"ISSN":["1549-7747","1558-3791"],"issn-type":[{"value":"1549-7747","type":"print"},{"value":"1558-3791","type":"electronic"}],"subject":[],"published":{"date-parts":[[2014,9]]}}}