{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,6]],"date-time":"2026-02-06T00:28:27Z","timestamp":1770337707105,"version":"3.49.0"},"reference-count":16,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"10","license":[{"start":{"date-parts":[[2017,10,1]],"date-time":"2017-10-01T00:00:00Z","timestamp":1506816000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Circuits Syst. II"],"published-print":{"date-parts":[[2017,10]]},"DOI":"10.1109\/tcsii.2016.2626151","type":"journal-article","created":{"date-parts":[[2016,11,7]],"date-time":"2016-11-07T14:06:42Z","timestamp":1478527602000},"page":"1137-1141","source":"Crossref","is-referenced-by-count":32,"title":["A Hybrid Inductive-Ultrasonic Link for Wireless Power Transmission to Millimeter-Sized Biomedical Implants"],"prefix":"10.1109","volume":"64","author":[{"given":"Miao","family":"Meng","sequence":"first","affiliation":[]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9310-8093","authenticated-orcid":false,"given":"Mehdi","family":"Kiani","sequence":"additional","affiliation":[]}],"member":"263","reference":[{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/BSN.2010.27"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2015.2427336"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TBME.2015.2444854"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1016\/j.neuron.2016.06.034"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2016.2583783"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2011.2175390"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2011.2158431"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TIE.2012.2227914"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2010.5434028"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1073\/pnas.1403002111"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2014.2364824"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2016.2515541"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2014.2370794"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2016.2530882"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1088\/1741-2560\/6\/5\/056003"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2013.2286000"}],"container-title":["IEEE Transactions on Circuits and Systems II: Express Briefs"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8920\/8048686\/07736989.pdf?arnumber=7736989","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2022,1,12]],"date-time":"2022-01-12T11:41:37Z","timestamp":1641987697000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/7736989\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017,10]]},"references-count":16,"journal-issue":{"issue":"10"},"URL":"https:\/\/doi.org\/10.1109\/tcsii.2016.2626151","relation":{},"ISSN":["1549-7747","1558-3791"],"issn-type":[{"value":"1549-7747","type":"print"},{"value":"1558-3791","type":"electronic"}],"subject":[],"published":{"date-parts":[[2017,10]]}}}