{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,7]],"date-time":"2026-07-07T15:33:17Z","timestamp":1783438397600,"version":"3.54.6"},"reference-count":32,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"6","license":[{"start":{"date-parts":[[2022,6,1]],"date-time":"2022-06-01T00:00:00Z","timestamp":1654041600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2022,6,1]],"date-time":"2022-06-01T00:00:00Z","timestamp":1654041600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2022,6,1]],"date-time":"2022-06-01T00:00:00Z","timestamp":1654041600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100012166","name":"National Key Research and Development Program of China","doi-asserted-by":"publisher","award":["2018YFB2202500"],"award-info":[{"award-number":["2018YFB2202500"]}],"id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Circuits Syst. II"],"published-print":{"date-parts":[[2022,6]]},"DOI":"10.1109\/tcsii.2022.3173667","type":"journal-article","created":{"date-parts":[[2022,5,9]],"date-time":"2022-05-09T19:48:32Z","timestamp":1652125712000},"page":"2667-2671","source":"Crossref","is-referenced-by-count":20,"title":["Recent Progress of Silicon-Based Millimeter-Wave SoCs for Short-Range Radar Imaging and Sensing"],"prefix":"10.1109","volume":"69","author":[{"given":"Bing","family":"Liu","sequence":"first","affiliation":[{"name":"School of Microelectronics, Tianjin University, Tianjin, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8657-2920","authenticated-orcid":false,"given":"Kaixue","family":"Ma","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Tianjin University, Tianjin, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9809-1830","authenticated-orcid":false,"given":"Haipeng","family":"Fu","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Tianjin University, Tianjin, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Keping","family":"Wang","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Tianjin University, Tianjin, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Fanyi","family":"Meng","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Tianjin University, Tianjin, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2011.2178427"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2006.884817"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2018.8310232"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9365838"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2723499"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2019.8662386"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2675907"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2585621"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1145\/2897824.2925953"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9365835"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.2964150"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/RFIC.2012.6242318"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2016.2536600"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.23919\/VLSICircuits52068.2021.9492460"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3041153"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2021.3121746"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2725963"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TTHZ.2016.2602539"},{"key":"ref19","first-page":"1","article-title":"3D FMCW SAR imaging based on a 240 GHz SiGe transceiver chip with integrated antennas","volume-title":"Proc. German Microw. Conf.","author":"Jaeschke"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2018.2874666"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3020291"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2014.2385758"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2013.2239004"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2704602"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2020.2998801"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2021.3091878"},{"key":"ref27","doi-asserted-by":"publisher","DOI":"10.1109\/JERM.2017.2735241"},{"key":"ref28","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2020.2981613"},{"key":"ref29","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2012.2185570"},{"key":"ref30","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9365759"},{"key":"ref31","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2012.6177009"},{"key":"ref32","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3111152"}],"container-title":["IEEE Transactions on Circuits and Systems II: Express Briefs"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8920\/9786589\/09771229.pdf?arnumber=9771229","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,9,17]],"date-time":"2024-09-17T18:57:13Z","timestamp":1726599433000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9771229\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2022,6]]},"references-count":32,"journal-issue":{"issue":"6"},"URL":"https:\/\/doi.org\/10.1109\/tcsii.2022.3173667","relation":{},"ISSN":["1549-7747","1558-3791"],"issn-type":[{"value":"1549-7747","type":"print"},{"value":"1558-3791","type":"electronic"}],"subject":[],"published":{"date-parts":[[2022,6]]}}}