{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,23]],"date-time":"2026-01-23T12:29:36Z","timestamp":1769171376977,"version":"3.49.0"},"reference-count":24,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"2","license":[{"start":{"date-parts":[[2023,2,1]],"date-time":"2023-02-01T00:00:00Z","timestamp":1675209600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2023,2,1]],"date-time":"2023-02-01T00:00:00Z","timestamp":1675209600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,2,1]],"date-time":"2023-02-01T00:00:00Z","timestamp":1675209600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100010877","name":"Shenzhen Science and Technology Innovation Commission","doi-asserted-by":"publisher","award":["JSGG20200102162401765"],"award-info":[{"award-number":["JSGG20200102162401765"]}],"id":[{"id":"10.13039\/501100010877","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100010877","name":"Shenzhen Science and Technology Innovation Commission","doi-asserted-by":"publisher","award":["K2021390006"],"award-info":[{"award-number":["K2021390006"]}],"id":[{"id":"10.13039\/501100010877","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100010877","name":"Shenzhen Science and Technology Innovation Commission","doi-asserted-by":"publisher","award":["K2021390007"],"award-info":[{"award-number":["K2021390007"]}],"id":[{"id":"10.13039\/501100010877","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Circuits Syst. II"],"published-print":{"date-parts":[[2023,2]]},"DOI":"10.1109\/tcsii.2022.3176278","type":"journal-article","created":{"date-parts":[[2022,5,19]],"date-time":"2022-05-19T20:23:46Z","timestamp":1652991826000},"page":"391-395","source":"Crossref","is-referenced-by-count":3,"title":["An 11.6aF\/kPa Mechanical Stress Sensor With 0.808% Temperature-Drift Oscillator for Flip-Chip Packaging"],"prefix":"10.1109","volume":"70","author":[{"given":"Lanxiang","family":"Xiao","sequence":"first","affiliation":[{"name":"School of Mechatronics Engineering, Harbin Institute of Technology, Harbin, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Lei","family":"Chen","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Southern University of Science and Technology, Shenzhen, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7554-7938","authenticated-orcid":false,"given":"Fengwei","family":"An","sequence":"additional","affiliation":[{"name":"School of Microelectronics and the Engineering Research Center of Integrated Circuits for Next-Generation Communications, Ministry of Education, Southern University of Science and Technology, Shenzhen, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3005779"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1016\/j.jallcom.2019.152825"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1016\/j.sna.2009.03.011"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2001.954835"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1088\/1361-6439\/ab9581"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2020.3033813"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.3390\/s20061727"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1007\/s00542-020-05175-z"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2001.923584"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2008.4544339"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2015.2498183"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2017.2651073"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.3390\/mi11010007"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/SENSOR.2009.5285808"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1186\/s13634-021-00760-4"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1007\/s00542-020-04768-y"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1016\/j.sna.2021.113188"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1016\/S0924-4247(01)00532-5"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2014.2345754"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2930140"},{"key":"ref21","first-page":"96","article-title":"5.6 A 0.68nW\/kHz supply-independent relaxation oscillator with $\\mathrm{\\pm}0.49$\n%\/V and 96ppm\/C stability","volume-title":"Proc. ISSCC","author":"Savanth"},{"key":"ref22","first-page":"184","article-title":"A 120nW 18.5kHz RC oscillator with comparator offset cancellation for $\\mathrm{\\pm}0.25$\n% temperature stability","volume-title":"Proc. ISSCC","author":"Paidimarri"},{"issue":"1","key":"ref23","doi-asserted-by":"crossref","first-page":"1","DOI":"10.1023\/A:1007472709175","article-title":"Bending of an elastic rectangular clamped plate: Exact versus \u2018engineering\u2019 solutions","volume":"48","author":"Meleshko","year":"1997","journal-title":"J. Elasticity"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1016\/j.aml.2009.07.003"}],"container-title":["IEEE Transactions on Circuits and Systems II: Express Briefs"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8920\/10032206\/09778190.pdf?arnumber=9778190","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,1,22]],"date-time":"2024-01-22T22:21:02Z","timestamp":1705962062000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/9778190\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,2]]},"references-count":24,"journal-issue":{"issue":"2"},"URL":"https:\/\/doi.org\/10.1109\/tcsii.2022.3176278","relation":{},"ISSN":["1549-7747","1558-3791"],"issn-type":[{"value":"1549-7747","type":"print"},{"value":"1558-3791","type":"electronic"}],"subject":[],"published":{"date-parts":[[2023,2]]}}}