{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,5]],"date-time":"2026-02-05T11:16:47Z","timestamp":1770290207231,"version":"3.49.0"},"reference-count":21,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"6","license":[{"start":{"date-parts":[[2023,6,1]],"date-time":"2023-06-01T00:00:00Z","timestamp":1685577600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2023,6,1]],"date-time":"2023-06-01T00:00:00Z","timestamp":1685577600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,6,1]],"date-time":"2023-06-01T00:00:00Z","timestamp":1685577600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Circuits Syst. II"],"published-print":{"date-parts":[[2023,6]]},"DOI":"10.1109\/tcsii.2022.3233381","type":"journal-article","created":{"date-parts":[[2023,1,2]],"date-time":"2023-01-02T18:55:31Z","timestamp":1672685731000},"page":"1921-1925","source":"Crossref","is-referenced-by-count":10,"title":["Cost-Effective Broadband and Compact Patch Antenna Based on Ball Grid Array Packaging for 5G NR FR2 Band Applications"],"prefix":"10.1109","volume":"70","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-1086-9450","authenticated-orcid":false,"given":"Xiubo","family":"Liu","sequence":"first","affiliation":[{"name":"School of Microelectronics, Tianjin University, Tianjin, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-2601-3198","authenticated-orcid":false,"given":"Wei","family":"Zhang","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Tianjin University, Tianjin, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1451-0370","authenticated-orcid":false,"given":"Dongning","family":"Hao","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Tianjin University, Tianjin, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8488-5480","authenticated-orcid":false,"given":"Yanyan","family":"Liu","sequence":"additional","affiliation":[{"name":"Tianjin Key Laboratory of Photoelectronic Thin Film Devices and Technology, Nankai University, Tianjin, China"}]}],"member":"263","reference":[{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2021.3085860"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TVT.2020.2979636"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2022.3165595"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2022.3198396"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TAP.2007.893427"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/LAWP.2019.2905768"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2021.3075495"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TAP.2020.3044651"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2022.3197598"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2022.3201009"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/LAWP.2007.914122"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/LAWP.2010.2040061"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/LAWP.2014.2373823"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TAP.2005.851852"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TAP.2012.2214196"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2928694"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TAP.2012.2232635"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2766211"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JMW.2020.3032891"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/MWSYM.2018.8439632"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42614.2022.9731778"}],"container-title":["IEEE Transactions on Circuits and Systems II: Express Briefs"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8920\/10138208\/10004704.pdf?arnumber=10004704","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,6,19]],"date-time":"2023-06-19T18:30:21Z","timestamp":1687199421000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10004704\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,6]]},"references-count":21,"journal-issue":{"issue":"6"},"URL":"https:\/\/doi.org\/10.1109\/tcsii.2022.3233381","relation":{},"ISSN":["1549-7747","1558-3791"],"issn-type":[{"value":"1549-7747","type":"print"},{"value":"1558-3791","type":"electronic"}],"subject":[],"published":{"date-parts":[[2023,6]]}}}