{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,20]],"date-time":"2026-02-20T18:43:54Z","timestamp":1771613034814,"version":"3.50.1"},"reference-count":9,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"6","license":[{"start":{"date-parts":[[2023,6,1]],"date-time":"2023-06-01T00:00:00Z","timestamp":1685577600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2023,6,1]],"date-time":"2023-06-01T00:00:00Z","timestamp":1685577600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,6,1]],"date-time":"2023-06-01T00:00:00Z","timestamp":1685577600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100003725","name":"National Research Foundation of Korea (NRF) Grant funded by the Korea Government","doi-asserted-by":"publisher","award":["NRF-2019R1A2C1004805"],"award-info":[{"award-number":["NRF-2019R1A2C1004805"]}],"id":[{"id":"10.13039\/501100003725","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003725","name":"National Research Foundation of Korea (NRF) Grant funded by the Korea Government","doi-asserted-by":"publisher","award":["NRF-2021R1A4A1032580"],"award-info":[{"award-number":["NRF-2021R1A4A1032580"]}],"id":[{"id":"10.13039\/501100003725","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Circuits Syst. II"],"published-print":{"date-parts":[[2023,6]]},"DOI":"10.1109\/tcsii.2022.3233537","type":"journal-article","created":{"date-parts":[[2023,1,2]],"date-time":"2023-01-02T18:55:31Z","timestamp":1672685731000},"page":"1866-1870","source":"Crossref","is-referenced-by-count":10,"title":["Bulk CMOS Low Noise Amplifier With Two Stage HPF Noise Matching Structure"],"prefix":"10.1109","volume":"70","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-2698-6942","authenticated-orcid":false,"given":"Jeong-Taek","family":"Lim","sequence":"first","affiliation":[{"name":"Department of Electronics Engineering, Chungnam National University, Daejeon, South Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5960-4309","authenticated-orcid":false,"given":"Han-Woong","family":"Choi","sequence":"additional","affiliation":[{"name":"Department of Electronics Engineering, Chungnam National University, Daejeon, South Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Sunkyu","family":"Choi","sequence":"additional","affiliation":[{"name":"Department of Electronics Engineering, Chungnam National University, Daejeon, South Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Ki-Jin","family":"Kim","sequence":"additional","affiliation":[{"name":"ICT Device and Packaging Research Center, Korea Electronics Technology Institute, Seongnam, South Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-4840-5336","authenticated-orcid":false,"given":"Hi-Deok","family":"Lee","sequence":"additional","affiliation":[{"name":"Department of Electronics Engineering, Chungnam National University, Daejeon, South Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5348-3585","authenticated-orcid":false,"given":"Hyoungho","family":"Ko","sequence":"additional","affiliation":[{"name":"Department of Electronics Engineering, Chungnam National University, Daejeon, South Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5532-7399","authenticated-orcid":false,"given":"Choul-Young","family":"Kim","sequence":"additional","affiliation":[{"name":"Department of Electronics Engineering, Chungnam National University, Daejeon, South Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1080\/00207217.2012.692635"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2004.827014"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2017.2679203"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2021.3092742"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/APMC46564.2019.9038409"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/MWSYM.2017.8058688"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2020.3037296"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/MWSYM.2018.8439539"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2004.842510"}],"container-title":["IEEE Transactions on Circuits and Systems II: Express Briefs"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8920\/10138208\/10004984.pdf?arnumber=10004984","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,6,19]],"date-time":"2023-06-19T18:33:53Z","timestamp":1687199633000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10004984\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,6]]},"references-count":9,"journal-issue":{"issue":"6"},"URL":"https:\/\/doi.org\/10.1109\/tcsii.2022.3233537","relation":{},"ISSN":["1549-7747","1558-3791"],"issn-type":[{"value":"1549-7747","type":"print"},{"value":"1558-3791","type":"electronic"}],"subject":[],"published":{"date-parts":[[2023,6]]}}}