{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,6]],"date-time":"2026-06-06T17:12:16Z","timestamp":1780765936484,"version":"3.54.1"},"reference-count":26,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"8","license":[{"start":{"date-parts":[[2023,8,1]],"date-time":"2023-08-01T00:00:00Z","timestamp":1690848000000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2023,8,1]],"date-time":"2023-08-01T00:00:00Z","timestamp":1690848000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,8,1]],"date-time":"2023-08-01T00:00:00Z","timestamp":1690848000000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["61601246"],"award-info":[{"award-number":["61601246"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62001081"],"award-info":[{"award-number":["62001081"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Open Research Fund of the National and Local Joint Engineering Laboratory of RF Integration and Micro-Assembly Technology","award":["KFJJ20210203"],"award-info":[{"award-number":["KFJJ20210203"]}]},{"DOI":"10.13039\/501100005374","name":"Natural Science Foundation of Nanjing University of Posts and Telecommunications","doi-asserted-by":"publisher","award":["NY221061"],"award-info":[{"award-number":["NY221061"]}],"id":[{"id":"10.13039\/501100005374","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Circuits Syst. II"],"published-print":{"date-parts":[[2023,8]]},"DOI":"10.1109\/tcsii.2023.3248095","type":"journal-article","created":{"date-parts":[[2023,2,23]],"date-time":"2023-02-23T18:55:05Z","timestamp":1677178505000},"page":"2744-2748","source":"Crossref","is-referenced-by-count":21,"title":["Using Mixed Coupling to Realize Wide Stopband Multilayer Substrate Integrated Waveguide Filter"],"prefix":"10.1109","volume":"70","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-7557-4146","authenticated-orcid":false,"given":"Peng","family":"Chu","sequence":"first","affiliation":[{"name":"College of Electronic and Optical Engineering and the National and Local Joint Engineering Laboratory of RF Integration and Micro-Assembly Technology, Nanjing University of Posts and Telecommunications, Nanjing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jianguo","family":"Feng","sequence":"additional","affiliation":[{"name":"College of Electronic and Optical Engineering and the National and Local Joint Engineering Laboratory of RF Integration and Micro-Assembly Technology, Nanjing University of Posts and Telecommunications, Nanjing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2802-498X","authenticated-orcid":false,"given":"Lei","family":"Guo","sequence":"additional","affiliation":[{"name":"School of Information and Communication Engineering, Dalian University of Technology, Dalian, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-0646-6699","authenticated-orcid":false,"given":"Long","family":"Zhang","sequence":"additional","affiliation":[{"name":"College of Electronics and Information Engineering, Shenzhen University, Shenzhen, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0492-5508","authenticated-orcid":false,"given":"Wen-Wen","family":"Yang","sequence":"additional","affiliation":[{"name":"School of Information Science and Technology, Nantong University, Nantong, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5584-5746","authenticated-orcid":false,"given":"Leilei","family":"Liu","sequence":"additional","affiliation":[{"name":"College of Electronic and Optical Engineering and the National and Local Joint Engineering Laboratory of RF Integration and Micro-Assembly Technology, Nanjing University of Posts and Telecommunications, Nanjing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9396-341X","authenticated-orcid":false,"given":"Feng","family":"Xu","sequence":"additional","affiliation":[{"name":"College of Electronic and Optical Engineering and the National and Local Joint Engineering Laboratory of RF Integration and Micro-Assembly Technology, Nanjing University of Posts and Telecommunications, Nanjing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7442-1017","authenticated-orcid":false,"given":"Ke","family":"Wu","sequence":"additional","affiliation":[{"name":"Poly-Grames Research Center, Polytechnique Montreal, Montreal, Canada"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2013.2294861"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1049\/el.2012.3826"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2018.2844103"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1017\/S1759078718000843"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2012.2209437"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2009.2032007"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2002.807820"},{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/7260.914305"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2019.2916609"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2016.2597222"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1002\/0471221619"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2019.2903388"},{"key":"ref24","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2016.2645156"},{"key":"ref23","doi-asserted-by":"publisher","DOI":"10.1049\/el.2012.3891"},{"key":"ref26","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2022.3200065"},{"key":"ref25","doi-asserted-by":"publisher","DOI":"10.1049\/el.2019.2322"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2019.2947894"},{"key":"ref22","doi-asserted-by":"publisher","DOI":"10.1002\/mop.23114"},{"key":"ref21","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2020.2982449"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2007.914642"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2005.864118"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2022.3188528"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2021.3092973"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1049\/iet-map.2010.0463"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2007.912222"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2008.2002454"}],"container-title":["IEEE Transactions on Circuits and Systems II: Express Briefs"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8920\/10198497\/10050519.pdf?arnumber=10050519","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,8,21]],"date-time":"2023-08-21T18:18:49Z","timestamp":1692641929000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10050519\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,8]]},"references-count":26,"journal-issue":{"issue":"8"},"URL":"https:\/\/doi.org\/10.1109\/tcsii.2023.3248095","relation":{},"ISSN":["1549-7747","1558-3791"],"issn-type":[{"value":"1549-7747","type":"print"},{"value":"1558-3791","type":"electronic"}],"subject":[],"published":{"date-parts":[[2023,8]]}}}