{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,12,9]],"date-time":"2025-12-09T08:28:16Z","timestamp":1765268896033,"version":"3.37.3"},"reference-count":20,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"12","license":[{"start":{"date-parts":[[2023,12,1]],"date-time":"2023-12-01T00:00:00Z","timestamp":1701388800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2023,12,1]],"date-time":"2023-12-01T00:00:00Z","timestamp":1701388800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2023,12,1]],"date-time":"2023-12-01T00:00:00Z","timestamp":1701388800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Circuits Syst. II"],"published-print":{"date-parts":[[2023,12]]},"DOI":"10.1109\/tcsii.2023.3291492","type":"journal-article","created":{"date-parts":[[2023,7,3]],"date-time":"2023-07-03T18:40:17Z","timestamp":1688409617000},"page":"4354-4358","source":"Crossref","is-referenced-by-count":7,"title":["A Resonant Magnetic Probe Capable of Simultaneously Measuring Two Orthogonal Magnetic-Field Components"],"prefix":"10.1109","volume":"70","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-9392-707X","authenticated-orcid":false,"given":"Lei","family":"Wang","sequence":"first","affiliation":[{"name":"School of Microelectronics, Xidian University, Xi’an, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-1798-7572","authenticated-orcid":false,"given":"Xiaoxian","family":"Liu","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Xidian University, Xi’an, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1833-5733","authenticated-orcid":false,"given":"Chengyang","family":"Luo","sequence":"additional","affiliation":[{"name":"Science and Technology on Reliability Physics and Application of Electronic Component Laboratory, CEPREI, Guangzhou, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7764-1928","authenticated-orcid":false,"given":"Zhangming","family":"Zhu","sequence":"additional","affiliation":[{"name":"School of Microelectronics, Xidian University, Xi’an, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2008.2008907"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/8.247775"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1002\/047164465X"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2018.2869908"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2013.2258334"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2007.902194"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2009.2023148"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/EPEP.2001.967673"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/EPEP.2005.1563712"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/lawp.2019.2942956"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2018.2857898"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2019.2920700"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2014.2354018"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TEMC.2013.2248011"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2014.2361433"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2022.3184987"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TAP.2019.2897476"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TAP.1964.1138213"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.3403\/02831727"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1002\/9780470290996"}],"container-title":["IEEE Transactions on Circuits and Systems II: Express Briefs"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8920\/10349118\/10171239.pdf?arnumber=10171239","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,12,20]],"date-time":"2023-12-20T00:28:29Z","timestamp":1703032109000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10171239\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,12]]},"references-count":20,"journal-issue":{"issue":"12"},"URL":"https:\/\/doi.org\/10.1109\/tcsii.2023.3291492","relation":{},"ISSN":["1549-7747","1558-3791"],"issn-type":[{"type":"print","value":"1549-7747"},{"type":"electronic","value":"1558-3791"}],"subject":[],"published":{"date-parts":[[2023,12]]}}}