{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,2,21]],"date-time":"2025-02-21T19:58:37Z","timestamp":1740167917756,"version":"3.37.3"},"reference-count":20,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"2","license":[{"start":{"date-parts":[[2024,2,1]],"date-time":"2024-02-01T00:00:00Z","timestamp":1706745600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2024,2,1]],"date-time":"2024-02-01T00:00:00Z","timestamp":1706745600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,2,1]],"date-time":"2024-02-01T00:00:00Z","timestamp":1706745600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62274170","92164302","91964204"],"award-info":[{"award-number":["62274170","92164302","91964204"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100002367","name":"Youth Innovation Promotion Association CAS","doi-asserted-by":"publisher","award":["2022233"],"award-info":[{"award-number":["2022233"]}],"id":[{"id":"10.13039\/501100002367","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100002367","name":"Strategic Priority Research Program of the Chinese Academy of Sciences","doi-asserted-by":"publisher","award":["XDB44010200"],"award-info":[{"award-number":["XDB44010200"]}],"id":[{"id":"10.13039\/501100002367","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Science and Technology Council of Shanghai","award":["2DZ2229009"],"award-info":[{"award-number":["2DZ2229009"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Circuits Syst. II"],"published-print":{"date-parts":[[2024,2]]},"DOI":"10.1109\/tcsii.2023.3311463","type":"journal-article","created":{"date-parts":[[2023,9,4]],"date-time":"2023-09-04T18:29:44Z","timestamp":1693852184000},"page":"857-861","source":"Crossref","is-referenced-by-count":0,"title":["Auto-Configuration Write Scheme With Enhanced Reliability for 3-D Cross-Point PCM"],"prefix":"10.1109","volume":"71","author":[{"given":"Guangming","family":"Zhang","sequence":"first","affiliation":[{"name":"State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4321-0385","authenticated-orcid":false,"given":"Yu","family":"Lei","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7859-9429","authenticated-orcid":false,"given":"Zhitang","family":"Song","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0009-0003-0581-3035","authenticated-orcid":false,"given":"Qiuyao","family":"Yu","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5766-5746","authenticated-orcid":false,"given":"Houpeng","family":"Chen","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Functional Materials for Informatics, Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2021.3049716"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2016.7838026"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2017.2729665"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/VLSITechnology18217.2020.9265020"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM13553.2020.9371976"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2020.2984268"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2018.8614680"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.23919\/VLSITechnologyandCir57934.2023.10185210"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM45625.2022.10019415"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/IEDM.2011.6131478"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2012.6176872"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2019.2945058"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42615.2023.10067837"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2020.2990884"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/DSN.2014.32"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2019.2960444"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2021.3058150"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/VLSITechnology18217.2020.9265039"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIT.2015.7223716"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.1109\/ISLPED.2011.5993624"}],"container-title":["IEEE Transactions on Circuits and Systems II: Express Briefs"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8920\/10423416\/10238841.pdf?arnumber=10238841","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,3,1]],"date-time":"2024-03-01T23:39:19Z","timestamp":1709336359000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10238841\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,2]]},"references-count":20,"journal-issue":{"issue":"2"},"URL":"https:\/\/doi.org\/10.1109\/tcsii.2023.3311463","relation":{},"ISSN":["1549-7747","1558-3791"],"issn-type":[{"type":"print","value":"1549-7747"},{"type":"electronic","value":"1558-3791"}],"subject":[],"published":{"date-parts":[[2024,2]]}}}