{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,10]],"date-time":"2026-04-10T15:25:42Z","timestamp":1775834742464,"version":"3.50.1"},"reference-count":18,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"3","license":[{"start":{"date-parts":[[2024,3,1]],"date-time":"2024-03-01T00:00:00Z","timestamp":1709251200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2024,3,1]],"date-time":"2024-03-01T00:00:00Z","timestamp":1709251200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,3,1]],"date-time":"2024-03-01T00:00:00Z","timestamp":1709251200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62201617"],"award-info":[{"award-number":["62201617"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Youth Talent Recruitment Project","award":["2023-JCJQ-QT-018"],"award-info":[{"award-number":["2023-JCJQ-QT-018"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Circuits Syst. II"],"published-print":{"date-parts":[[2024,3]]},"DOI":"10.1109\/tcsii.2023.3320194","type":"journal-article","created":{"date-parts":[[2023,9,28]],"date-time":"2023-09-28T17:56:54Z","timestamp":1695923814000},"page":"1121-1125","source":"Crossref","is-referenced-by-count":6,"title":["Size-Reduced Highly Selective Bandpass Filters Based on Dual-Mode Slow-Wave Patch Resonators"],"prefix":"10.1109","volume":"71","author":[{"ORCID":"https:\/\/orcid.org\/0009-0004-1747-3696","authenticated-orcid":false,"given":"Hang","family":"Qian","sequence":"first","affiliation":[{"name":"PLA Strategic Support Information Engineering University, Zhengzhou, China"}]},{"given":"Dewei","family":"Zhang","sequence":"additional","affiliation":[{"name":"PLA Strategic Support Information Engineering University, Zhengzhou, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-1833-2949","authenticated-orcid":false,"given":"Qing","family":"Liu","sequence":"additional","affiliation":[{"name":"PLA Strategic Support Information Engineering University, Zhengzhou, China"}]},{"given":"Benhua","family":"Ma","sequence":"additional","affiliation":[{"name":"PLA Strategic Support Information Engineering University, Zhengzhou, China"}]},{"given":"Hang","family":"Wang","sequence":"additional","affiliation":[{"name":"Henan Transportation Research Institute Company Ltd., Zhengzhou, China"}]},{"ORCID":"https:\/\/orcid.org\/0009-0000-1304-908X","authenticated-orcid":false,"given":"Dongfang","family":"Zhou","sequence":"additional","affiliation":[{"name":"PLA Strategic Support Information Engineering University, Zhengzhou, China"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2020.3037497"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2021.3074617"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2021.3111860"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/tmtt.2023.3284253"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2022.3195738"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2021.3055904"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2022.3161619"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2019.2957207"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2012.2192419"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2021.3106128"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2014.2328974"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2022.3162610"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2018.2854969"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2021.3110107"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2018.2842678"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TASC.2016.2636568"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2004.825653"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1049\/el.2016.1517"}],"container-title":["IEEE Transactions on Circuits and Systems II: Express Briefs"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8920\/10460332\/10266727.pdf?arnumber=10266727","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,3,8]],"date-time":"2024-03-08T19:08:25Z","timestamp":1709924905000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10266727\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,3]]},"references-count":18,"journal-issue":{"issue":"3"},"URL":"https:\/\/doi.org\/10.1109\/tcsii.2023.3320194","relation":{},"ISSN":["1549-7747","1558-3791"],"issn-type":[{"value":"1549-7747","type":"print"},{"value":"1558-3791","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024,3]]}}}