{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,31]],"date-time":"2026-03-31T13:40:49Z","timestamp":1774964449953,"version":"3.50.1"},"reference-count":12,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"3","license":[{"start":{"date-parts":[[2024,3,1]],"date-time":"2024-03-01T00:00:00Z","timestamp":1709251200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2024,3,1]],"date-time":"2024-03-01T00:00:00Z","timestamp":1709251200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,3,1]],"date-time":"2024-03-01T00:00:00Z","timestamp":1709251200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100018058","name":"SK Hynix Inc","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100018058","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Circuits Syst. II"],"published-print":{"date-parts":[[2024,3]]},"DOI":"10.1109\/tcsii.2023.3324254","type":"journal-article","created":{"date-parts":[[2023,10,12]],"date-time":"2023-10-12T17:55:24Z","timestamp":1697133324000},"page":"1012-1016","source":"Crossref","is-referenced-by-count":5,"title":["A 28-Gb\/s Single-Ended PAM-4 Receiver With T-Coil-Integrated Continuous-Time Linear Equalizer in 40-nm CMOS Technology"],"prefix":"10.1109","volume":"71","author":[{"given":"Taeyang","family":"Sim","sequence":"first","affiliation":[{"name":"Department of Electronic Engineering, Hanyang University, Seoul, South Korea"}]},{"given":"Sunoh","family":"Yeom","sequence":"additional","affiliation":[{"name":"Department of Electronic Engineering, Hanyang University, Seoul, South Korea"}]},{"given":"Hyunwoo","family":"Im","sequence":"additional","affiliation":[{"name":"Department of Electronic Engineering, Hanyang University, Seoul, South Korea"}]},{"given":"Youngmin","family":"Oh","sequence":"additional","affiliation":[{"name":"Department of Electronic Engineering, Hanyang University, Seoul, South Korea"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3934-9707","authenticated-orcid":false,"given":"Hyeongmin","family":"Seo","sequence":"additional","affiliation":[{"name":"Department of Electronic Engineering, Hanyang University, Seoul, South Korea"}]},{"given":"Hyeongjun","family":"Ko","sequence":"additional","affiliation":[{"name":"SK Hynix Inc., Icheon, South Korea"}]},{"given":"Hankyu","family":"Chi","sequence":"additional","affiliation":[{"name":"SK Hynix Inc., Icheon, South Korea"}]},{"given":"Hae-Kang","family":"Jung","sequence":"additional","affiliation":[{"name":"SK Hynix Inc., Icheon, South Korea"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-2292-7670","authenticated-orcid":false,"given":"Jaeduk","family":"Han","sequence":"additional","affiliation":[{"name":"Department of Electronic Engineering, Hanyang University, Seoul, South Korea"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3104093"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/VLSITechnologyandCir46769.2022.9830507"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2014.2349992"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/LSSC.2019.2894933"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2003.818568"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42615.2023.10067613"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC42613.2021.9365752"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1049\/piee.1963.0050"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2936307"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2022.3199429"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.3006864"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3170439"}],"container-title":["IEEE Transactions on Circuits and Systems II: Express Briefs"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8920\/10460332\/10283955.pdf?arnumber=10283955","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,3,8]],"date-time":"2024-03-08T01:54:47Z","timestamp":1709862887000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10283955\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,3]]},"references-count":12,"journal-issue":{"issue":"3"},"URL":"https:\/\/doi.org\/10.1109\/tcsii.2023.3324254","relation":{},"ISSN":["1549-7747","1558-3791"],"issn-type":[{"value":"1549-7747","type":"print"},{"value":"1558-3791","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024,3]]}}}