{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,20]],"date-time":"2026-05-20T16:24:41Z","timestamp":1779294281159,"version":"3.51.4"},"reference-count":20,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"4","license":[{"start":{"date-parts":[[2024,4,1]],"date-time":"2024-04-01T00:00:00Z","timestamp":1711929600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2024,4,1]],"date-time":"2024-04-01T00:00:00Z","timestamp":1711929600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,4,1]],"date-time":"2024-04-01T00:00:00Z","timestamp":1711929600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100003725","name":"National Research Foundation of Korea (NRF) through the Korea Government","doi-asserted-by":"publisher","award":["NRF-2021R1A2C1013666"],"award-info":[{"award-number":["NRF-2021R1A2C1013666"]}],"id":[{"id":"10.13039\/501100003725","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Circuits Syst. II"],"published-print":{"date-parts":[[2024,4]]},"DOI":"10.1109\/tcsii.2023.3330134","type":"journal-article","created":{"date-parts":[[2023,11,3]],"date-time":"2023-11-03T18:19:38Z","timestamp":1699035578000},"page":"1949-1953","source":"Crossref","is-referenced-by-count":12,"title":["Ka-Band CMOS Power Amplifier Using Stacked Structure With Cascode-Like Operation"],"prefix":"10.1109","volume":"71","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-6260-0640","authenticated-orcid":false,"given":"Taehun","family":"Kim","sequence":"first","affiliation":[{"name":"Department of Electronic Engineering, Soongsil University, Seoul, Republic of Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-4794-0062","authenticated-orcid":false,"given":"Hayeon","family":"Jeong","sequence":"additional","affiliation":[{"name":"Department of Electronic Engineering, Soongsil University, Seoul, Republic of Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0009-0003-5702-8274","authenticated-orcid":false,"given":"Seongjin","family":"Jang","sequence":"additional","affiliation":[{"name":"Department of Electronic Engineering, Soongsil University, Seoul, Republic of Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0073-2733","authenticated-orcid":false,"given":"Jaeyong","family":"Lee","sequence":"additional","affiliation":[{"name":"Department of Electronic Engineering, Soongsil University, Seoul, Republic of Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-4699-9935","authenticated-orcid":false,"given":"Changkun","family":"Park","sequence":"additional","affiliation":[{"name":"Department of Electronic Engineering and the Department of Intelligent Semiconductors, Soongsil University, Seoul, Republic of Korea"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/LSSC.2021.3108486"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2021.3097017"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/tcsii.2020.3035936"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/LSSC.2020.3009973"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/tcsii.2020.3046512"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2013.2247698"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2022.3185301"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/esscirc55480.2022.9911231"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2019.2936563"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2014.2308292"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/MWSYM.2018.8439649"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.3390\/app12094432"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.3390\/electronics12020432"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2606584"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2020.3036645"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2021.3083284"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2019.2922507"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.3390\/app112411691"},{"key":"ref19","doi-asserted-by":"publisher","DOI":"10.1109\/esscirc55480.2022.9911289"},{"key":"ref20","doi-asserted-by":"publisher","DOI":"10.23919\/EuMC54642.2022.9924479"}],"container-title":["IEEE Transactions on Circuits and Systems II: Express Briefs"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8920\/10480869\/10306258.pdf?arnumber=10306258","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,3,28]],"date-time":"2024-03-28T20:50:31Z","timestamp":1711659031000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10306258\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,4]]},"references-count":20,"journal-issue":{"issue":"4"},"URL":"https:\/\/doi.org\/10.1109\/tcsii.2023.3330134","relation":{},"ISSN":["1549-7747","1558-3791"],"issn-type":[{"value":"1549-7747","type":"print"},{"value":"1558-3791","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024,4]]}}}