{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,19]],"date-time":"2026-06-19T16:04:59Z","timestamp":1781885099586,"version":"3.54.5"},"reference-count":16,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"4","license":[{"start":{"date-parts":[[2024,4,1]],"date-time":"2024-04-01T00:00:00Z","timestamp":1711929600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2024,4,1]],"date-time":"2024-04-01T00:00:00Z","timestamp":1711929600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,4,1]],"date-time":"2024-04-01T00:00:00Z","timestamp":1711929600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100010877","name":"Shenzhen Science and Technology Innovation Committee","doi-asserted-by":"publisher","award":["JCYJ20220818100814033"],"award-info":[{"award-number":["JCYJ20220818100814033"]}],"id":[{"id":"10.13039\/501100010877","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100010877","name":"Shenzhen Science and Technology Innovation Committee","doi-asserted-by":"publisher","award":["KQTD 20200820113105004"],"award-info":[{"award-number":["KQTD 20200820113105004"]}],"id":[{"id":"10.13039\/501100010877","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Key-Area Research and Development Program of Guangdong Province","award":["2019B010155002"],"award-info":[{"award-number":["2019B010155002"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Circuits Syst. II"],"published-print":{"date-parts":[[2024,4]]},"DOI":"10.1109\/tcsii.2023.3337119","type":"journal-article","created":{"date-parts":[[2023,11,28]],"date-time":"2023-11-28T19:37:33Z","timestamp":1701200253000},"page":"2329-2333","source":"Crossref","is-referenced-by-count":14,"title":["An 11T SRAM Cell for the Dual-Direction In-Array Logic\/CAM Operations"],"prefix":"10.1109","volume":"71","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-7676-7596","authenticated-orcid":false,"given":"Feng","family":"Wei","sequence":"first","affiliation":[{"name":"Key Laboratory of Integrated Microsystems, Peking University Shenzhen Graduate School, Shenzhen, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3382-3703","authenticated-orcid":false,"given":"Xiaole","family":"Cui","sequence":"additional","affiliation":[{"name":"Key Laboratory of Integrated Microsystems, Peking University Shenzhen Graduate School, Shenzhen, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0000-9539-1427","authenticated-orcid":false,"given":"Sunrui","family":"Zhang","sequence":"additional","affiliation":[{"name":"Key Laboratory of Integrated Microsystems, Peking University Shenzhen Graduate School, Shenzhen, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Xing","family":"Zhang","sequence":"additional","affiliation":[{"name":"Department of Networked Intelligence, Peng Cheng Laboratory, Shenzhen, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2016.2642198"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2018.2880918"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2019.2939682"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/tcsi.2019.2928043"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/tcsi.2021.3054972"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2018.8310398"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2018.8310401"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2021.3073254"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2019.8662392"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42613.2021.9365984"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2016.2515510"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/tcsi.2018.2848999"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/tvlsi.2020.2976099"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/jssc.2005.864128"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/tvlsi.2010.2042826"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.23919\/chicc.2018.8482628"}],"container-title":["IEEE Transactions on Circuits and Systems II: Express Briefs"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8920\/10480869\/10330703.pdf?arnumber=10330703","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,3,28]],"date-time":"2024-03-28T20:51:47Z","timestamp":1711659107000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10330703\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,4]]},"references-count":16,"journal-issue":{"issue":"4"},"URL":"https:\/\/doi.org\/10.1109\/tcsii.2023.3337119","relation":{},"ISSN":["1549-7747","1558-3791"],"issn-type":[{"value":"1549-7747","type":"print"},{"value":"1558-3791","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024,4]]}}}