{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,6,5]],"date-time":"2026-06-05T05:23:30Z","timestamp":1780637010677,"version":"3.54.1"},"reference-count":17,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"8","license":[{"start":{"date-parts":[[2024,8,1]],"date-time":"2024-08-01T00:00:00Z","timestamp":1722470400000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2024,8,1]],"date-time":"2024-08-01T00:00:00Z","timestamp":1722470400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,8,1]],"date-time":"2024-08-01T00:00:00Z","timestamp":1722470400000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Circuits Syst. II"],"published-print":{"date-parts":[[2024,8]]},"DOI":"10.1109\/tcsii.2024.3370183","type":"journal-article","created":{"date-parts":[[2024,2,26]],"date-time":"2024-02-26T20:17:07Z","timestamp":1708978627000},"page":"3675-3679","source":"Crossref","is-referenced-by-count":5,"title":["A 700nW Compact Temperature Sensor With a One-Point Trimmed Inaccuracy of +1.2\/\u22121.0 \u00b0C for On-Chip Thermal Monitoring"],"prefix":"10.1109","volume":"71","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-9218-0517","authenticated-orcid":false,"given":"Tianyi","family":"Zhang","sequence":"first","affiliation":[{"name":"Laboratory of Solid State Optoelectronic Information Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6011-6764","authenticated-orcid":false,"given":"Wenchang","family":"Li","sequence":"additional","affiliation":[{"name":"Laboratory of Solid State Optoelectronic Information Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jiapeng","family":"Li","sequence":"additional","affiliation":[{"name":"Laboratory of Solid State Optoelectronic Information Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0008-1725-2251","authenticated-orcid":false,"given":"Linfeng","family":"Wei","sequence":"additional","affiliation":[{"name":"Laboratory of Solid State Optoelectronic Information Technology, Institute of Semiconductors, Chinese Academy of Sciences, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8057-2444","authenticated-orcid":false,"given":"Jian","family":"Liu","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Superlattices and Microstructures, Institute of Semiconductors, Chinese Academy of Sciences, Beijing, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2014.2333741"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2020.3029852"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TC.2015.2395423"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2020.3042825"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2952855"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2019.2921889"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2015.2478792"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/LSSC.2021.3072989"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2020.3010501"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2017.2786735"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2017.7870310"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/IranianCEE.2019.8786613"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1016\/0250-6874(89)87018-0"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2023.3276196"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1145\/1283780.1283827"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/9780470547182.app7"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/TIM.2023.3276016"}],"container-title":["IEEE Transactions on Circuits and Systems II: Express Briefs"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8920\/10617442\/10445479.pdf?arnumber=10445479","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,8,2]],"date-time":"2024-08-02T05:17:46Z","timestamp":1722575866000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10445479\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,8]]},"references-count":17,"journal-issue":{"issue":"8"},"URL":"https:\/\/doi.org\/10.1109\/tcsii.2024.3370183","relation":{},"ISSN":["1549-7747","1558-3791"],"issn-type":[{"value":"1549-7747","type":"print"},{"value":"1558-3791","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024,8]]}}}