{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,16]],"date-time":"2026-05-16T01:03:57Z","timestamp":1778893437680,"version":"3.51.4"},"reference-count":16,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"9","license":[{"start":{"date-parts":[[2024,9,1]],"date-time":"2024-09-01T00:00:00Z","timestamp":1725148800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2024,9,1]],"date-time":"2024-09-01T00:00:00Z","timestamp":1725148800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,9,1]],"date-time":"2024-09-01T00:00:00Z","timestamp":1725148800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/501100012166","name":"National Key Research and Development Program of China","doi-asserted-by":"publisher","award":["2023YFB2904900"],"award-info":[{"award-number":["2023YFB2904900"]}],"id":[{"id":"10.13039\/501100012166","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62171065"],"award-info":[{"award-number":["62171065"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62201100"],"award-info":[{"award-number":["62201100"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62371077"],"award-info":[{"award-number":["62371077"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62171068"],"award-info":[{"award-number":["62171068"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100005230","name":"Natural Science Foundation of Chongqing Municipality","doi-asserted-by":"publisher","award":["cstc2021jcyjmsxmX0769"],"award-info":[{"award-number":["cstc2021jcyjmsxmX0769"]}],"id":[{"id":"10.13039\/501100005230","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Circuits Syst. II"],"published-print":{"date-parts":[[2024,9]]},"DOI":"10.1109\/tcsii.2024.3379992","type":"journal-article","created":{"date-parts":[[2024,3,21]],"date-time":"2024-03-21T19:02:41Z","timestamp":1711047761000},"page":"4176-4180","source":"Crossref","is-referenced-by-count":9,"title":["Design of Wideband Doherty Power Amplifier Using Inverse Continuous Class-F Mode"],"prefix":"10.1109","volume":"71","author":[{"ORCID":"https:\/\/orcid.org\/0009-0008-1906-6583","authenticated-orcid":false,"given":"Meng","family":"Ren","sequence":"first","affiliation":[{"name":"School of Microelectronics and Communication Engineering, Chongqing University, Chongqing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7470-4359","authenticated-orcid":false,"given":"Ruibin","family":"Gao","sequence":"additional","affiliation":[{"name":"School of Microelectronics and Communication Engineering, Chongqing University, Chongqing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8384-2809","authenticated-orcid":false,"given":"Shuang","family":"Liu","sequence":"additional","affiliation":[{"name":"School of Microelectronics and Communication Engineering, Chongqing University, Chongqing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9893-3284","authenticated-orcid":false,"given":"Mingyu","family":"Li","sequence":"additional","affiliation":[{"name":"School of Microelectronics and Communication Engineering, Chongqing University, Chongqing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-8744-395X","authenticated-orcid":false,"given":"Weimin","family":"Shi","sequence":"additional","affiliation":[{"name":"School of Microelectronics and Communication Engineering, Chongqing University, Chongqing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4914-1464","authenticated-orcid":false,"given":"Zhijiang","family":"Dai","sequence":"additional","affiliation":[{"name":"School of Microelectronics and Communication Engineering, Chongqing University, Chongqing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1628-5429","authenticated-orcid":false,"given":"Shichang","family":"Chen","sequence":"additional","affiliation":[{"name":"Shaoxing Integrated Circuit Institute, Hangzhou Dianzi University, Hangzhou, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3781-3219","authenticated-orcid":false,"given":"Jingzhou","family":"Pang","sequence":"additional","affiliation":[{"name":"School of Microelectronics and Communication Engineering, Chongqing University, Chongqing, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2009.2029754"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2012.2221142"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2012.2187534"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/MCAS.2020.3027221"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2018.2870443"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2017.2784811"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2016.2623705"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2017.2749224"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2021.3051734"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2020.3043790"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2023.3263478"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2022.3145349"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2021.3129166"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2022.3226440"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2020.2971481"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2012.2189228"}],"container-title":["IEEE Transactions on Circuits and Systems II: Express Briefs"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8920\/10666887\/10477556.pdf?arnumber=10477556","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,9,7]],"date-time":"2024-09-07T05:29:39Z","timestamp":1725686979000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10477556\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,9]]},"references-count":16,"journal-issue":{"issue":"9"},"URL":"https:\/\/doi.org\/10.1109\/tcsii.2024.3379992","relation":{},"ISSN":["1549-7747","1558-3791"],"issn-type":[{"value":"1549-7747","type":"print"},{"value":"1558-3791","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024,9]]}}}