{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,2,21]],"date-time":"2025-02-21T19:58:46Z","timestamp":1740167926863,"version":"3.37.3"},"reference-count":15,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"9","license":[{"start":{"date-parts":[[2024,9,1]],"date-time":"2024-09-01T00:00:00Z","timestamp":1725148800000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2024,9,1]],"date-time":"2024-09-01T00:00:00Z","timestamp":1725148800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,9,1]],"date-time":"2024-09-01T00:00:00Z","timestamp":1725148800000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"National Key Research and Development Program of China","award":["2023YFB4402204"],"award-info":[{"award-number":["2023YFB4402204"]}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["T2293700","T2293704"],"award-info":[{"award-number":["T2293700","T2293704"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Circuits Syst. II"],"published-print":{"date-parts":[[2024,9]]},"DOI":"10.1109\/tcsii.2024.3393475","type":"journal-article","created":{"date-parts":[[2024,4,25]],"date-time":"2024-04-25T17:51:39Z","timestamp":1714067499000},"page":"4041-4045","source":"Crossref","is-referenced-by-count":0,"title":["High-Throughput Addressable Test Structure Design for Nano-Scaled CMOS Device Characterization"],"prefix":"10.1109","volume":"71","author":[{"ORCID":"https:\/\/orcid.org\/0009-0004-4567-8154","authenticated-orcid":false,"given":"Xiaolin","family":"Wang","sequence":"first","affiliation":[{"name":"National Key Laboratory of Advanced Micro and Nano Manufacture Technology, Shanghai Jiao Tong University, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0365-5673","authenticated-orcid":false,"given":"Da","family":"Wang","sequence":"additional","affiliation":[{"name":"National Key Laboratory of Advanced Micro and Nano Manufacture Technology, Shanghai Jiao Tong University, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Lei","family":"Guo","sequence":"additional","affiliation":[{"name":"National Key Laboratory of Advanced Micro and Nano Manufacture Technology, Shanghai Jiao Tong University, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0009-0001-2986-9231","authenticated-orcid":false,"given":"Pengpeng","family":"Ren","sequence":"additional","affiliation":[{"name":"National Key Laboratory of Advanced Micro and Nano Manufacture Technology, Shanghai Jiao Tong University, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1138-804X","authenticated-orcid":false,"given":"Zhigang","family":"Ji","sequence":"additional","affiliation":[{"name":"National Key Laboratory of Advanced Micro and Nano Manufacture Technology, Shanghai Jiao Tong University, Shanghai, China"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/iedm.2015.7409787"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/ted.2018.2790083"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/icmts.2014.6841497"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/irps.2015.7112702"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/iedm19573.2019.8993548"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/irps.2017.7936265"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS45951.2020.9128316"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/irps.2019.8720592"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/essderc.2015.7324754"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/TED.2011.2121913"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/IRPS48203.2023.10118108"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ICMTS.2012.6190604"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/icmts.2019.8730948"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/irps48203.2023.10118334"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/laedc51812.2021.9437920"}],"container-title":["IEEE Transactions on Circuits and Systems II: Express Briefs"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx7\/8920\/10666887\/10508592.pdf?arnumber=10508592","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,9,7]],"date-time":"2024-09-07T04:53:27Z","timestamp":1725684807000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10508592\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,9]]},"references-count":15,"journal-issue":{"issue":"9"},"URL":"https:\/\/doi.org\/10.1109\/tcsii.2024.3393475","relation":{},"ISSN":["1549-7747","1558-3791"],"issn-type":[{"type":"print","value":"1549-7747"},{"type":"electronic","value":"1558-3791"}],"subject":[],"published":{"date-parts":[[2024,9]]}}}