{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,2,21]],"date-time":"2025-02-21T19:58:35Z","timestamp":1740167915898,"version":"3.37.3"},"reference-count":16,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"11","license":[{"start":{"date-parts":[[2024,11,1]],"date-time":"2024-11-01T00:00:00Z","timestamp":1730419200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2024,11,1]],"date-time":"2024-11-01T00:00:00Z","timestamp":1730419200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,11,1]],"date-time":"2024-11-01T00:00:00Z","timestamp":1730419200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100004358","name":"Samsung","doi-asserted-by":"publisher","id":[{"id":"10.13039\/100004358","id-type":"DOI","asserted-by":"publisher"}]},{"name":"Technology Innovation Program"},{"name":"Ministry of Trade, Industry & Energy (MOTIE), South Korea","award":["1415185992","RS-2022-00144300"],"award-info":[{"award-number":["1415185992","RS-2022-00144300"]}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Circuits Syst. II"],"published-print":{"date-parts":[[2024,11]]},"DOI":"10.1109\/tcsii.2024.3440584","type":"journal-article","created":{"date-parts":[[2024,8,7]],"date-time":"2024-08-07T18:08:46Z","timestamp":1723054126000},"page":"4618-4622","source":"Crossref","is-referenced-by-count":0,"title":["A 0.09-pJ\/b\/dB 28-Gb\/s Digital CDR With ISI-Resistant Phase Detector"],"prefix":"10.1109","volume":"71","author":[{"ORCID":"https:\/\/orcid.org\/0009-0009-7245-5198","authenticated-orcid":false,"given":"Suil","family":"Kang","sequence":"first","affiliation":[{"name":"Department of Electrical and Electronic Engineering, Yonsei University, Seoul, South Korea"}]},{"given":"Dongwoo","family":"Kang","sequence":"additional","affiliation":[{"name":"Department of Electrical and Electronic Engineering, Yonsei University, Seoul, South Korea"}]},{"ORCID":"https:\/\/orcid.org\/0009-0007-7921-5766","authenticated-orcid":false,"given":"Sinho","family":"Lee","sequence":"additional","affiliation":[{"name":"Department of Electrical and Electronic Engineering, Yonsei University, Seoul, South Korea"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5345-6261","authenticated-orcid":false,"given":"Minkyo","family":"Shim","sequence":"additional","affiliation":[{"name":"Samsung Electronics, Hwaseong, South Korea"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5429-4812","authenticated-orcid":false,"given":"Seungha","family":"Roh","sequence":"additional","affiliation":[{"name":"SK Hynix, Icheon, South Korea"}]},{"ORCID":"https:\/\/orcid.org\/0009-0001-2230-8546","authenticated-orcid":false,"given":"Sunjin","family":"Choi","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering and Computer Sciences, University of California at Berkeley, Berkeley, CA, USA"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-4727-9868","authenticated-orcid":false,"given":"Kwanseo","family":"Park","sequence":"additional","affiliation":[{"name":"Department of System Semiconductor Engineering, the Department of Electrical and Electronic Engineering, BK21 Graduate Program in Intelligent Semiconductor Technology, Yonsei University, Seoul, South Korea"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/LSSC.2019.2936768"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2020.2987690"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2020.3029079"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2021.3073697"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2022.3200979"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2022.3212082"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1049\/el:19750415"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2006.880629"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TCOM.1976.1093326"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/isscc.2015.7062987"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/VLSIC.2007.4342687"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2013.2274904"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2008.2001871"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2016.2614349"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC19947.2020.9063010"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3113773"}],"container-title":["IEEE Transactions on Circuits and Systems II: Express Briefs"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/8920\/10738122\/10630666.pdf?arnumber=10630666","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,11,27]],"date-time":"2024-11-27T00:18:11Z","timestamp":1732666691000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10630666\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,11]]},"references-count":16,"journal-issue":{"issue":"11"},"URL":"https:\/\/doi.org\/10.1109\/tcsii.2024.3440584","relation":{},"ISSN":["1549-7747","1558-3791"],"issn-type":[{"type":"print","value":"1549-7747"},{"type":"electronic","value":"1558-3791"}],"subject":[],"published":{"date-parts":[[2024,11]]}}}