{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,8]],"date-time":"2026-05-08T16:49:16Z","timestamp":1778258956494,"version":"3.51.4"},"reference-count":18,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"12","license":[{"start":{"date-parts":[[2024,12,1]],"date-time":"2024-12-01T00:00:00Z","timestamp":1733011200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2024,12,1]],"date-time":"2024-12-01T00:00:00Z","timestamp":1733011200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2024,12,1]],"date-time":"2024-12-01T00:00:00Z","timestamp":1733011200000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"name":"Technology Innovation Program"},{"name":"Ministry of Trade, Industry & Energy (MOTIE), South Korea","award":["RS-2024-00410244"],"award-info":[{"award-number":["RS-2024-00410244"]}]},{"DOI":"10.13039\/501100003725","name":"National Research Foundation of Korea","doi-asserted-by":"crossref","id":[{"id":"10.13039\/501100003725","id-type":"DOI","asserted-by":"crossref"}]},{"DOI":"10.13039\/501100003725","name":"Korea Government","doi-asserted-by":"publisher","award":["RS-2024-00352784"],"award-info":[{"award-number":["RS-2024-00352784"]}],"id":[{"id":"10.13039\/501100003725","id-type":"DOI","asserted-by":"publisher"}]},{"name":"DGIST International Collaboration R&D Program"},{"DOI":"10.13039\/501100003725","name":"National Research Foundation of Korea","doi-asserted-by":"crossref","id":[{"id":"10.13039\/501100003725","id-type":"DOI","asserted-by":"crossref"}]},{"name":"Korea Government","award":["RS-2024-00409692"],"award-info":[{"award-number":["RS-2024-00409692"]}]},{"name":"IC Design Education Center(IDEC), South Korea"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Circuits Syst. II"],"published-print":{"date-parts":[[2024,12]]},"DOI":"10.1109\/tcsii.2024.3450695","type":"journal-article","created":{"date-parts":[[2024,8,27]],"date-time":"2024-08-27T17:29:11Z","timestamp":1724779751000},"page":"4889-4893","source":"Crossref","is-referenced-by-count":8,"title":["A Discrete Multitone Wireline Transceiver Datapath With On-Chip Sign-Sign LMS Adaptation and Loading Profile Optimization on RFSoC"],"prefix":"10.1109","volume":"71","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-3222-5020","authenticated-orcid":false,"given":"Jaewon","family":"Lee","sequence":"first","affiliation":[{"name":"Department of Electrical Engineering and Computer Science, Daegu Gyeongbuk Institute of Science and Technology, Daegu, South Korea"}]},{"ORCID":"https:\/\/orcid.org\/0009-0008-1056-0470","authenticated-orcid":false,"given":"Seoyoung","family":"Jang","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering and Computer Science, Daegu Gyeongbuk Institute of Science and Technology, Daegu, South Korea"}]},{"ORCID":"https:\/\/orcid.org\/0009-0008-9512-7915","authenticated-orcid":false,"given":"Donggeon","family":"Kim","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering and Computer Science, Daegu Gyeongbuk Institute of Science and Technology, Daegu, South Korea"}]},{"ORCID":"https:\/\/orcid.org\/0009-0006-2364-8768","authenticated-orcid":false,"given":"Yujin","family":"Choi","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering and Computer Science, Daegu Gyeongbuk Institute of Science and Technology, Daegu, South Korea"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7373-7028","authenticated-orcid":false,"given":"Jong-Hyeok","family":"Yoon","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering and Computer Science, Daegu Gyeongbuk Institute of Science and Technology, Daegu, South Korea"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1995-7593","authenticated-orcid":false,"given":"Matthias","family":"Braendli","sequence":"additional","affiliation":[{"name":"IBM Research Europe Zurich Laboratory, IBM Research Zurich, Rüeschlikon, Switzerland"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-2712-6653","authenticated-orcid":false,"given":"Thomas","family":"Morf","sequence":"additional","affiliation":[{"name":"IBM Research Europe Zurich Laboratory, IBM Research Zurich, Rüeschlikon, Switzerland"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3053-2422","authenticated-orcid":false,"given":"Marcel","family":"Kossel","sequence":"additional","affiliation":[{"name":"IBM Research Europe Zurich Laboratory, IBM Research Zurich, Rüeschlikon, Switzerland"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2944-9058","authenticated-orcid":false,"given":"Pier-Andrea","family":"Francese","sequence":"additional","affiliation":[{"name":"IBM Research Europe Zurich Laboratory, IBM Research Zurich, Rüeschlikon, Switzerland"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3680-8816","authenticated-orcid":false,"given":"Gain","family":"Kim","sequence":"additional","affiliation":[{"name":"Department of Electrical Engineering and Computer Science, Daegu Gyeongbuk Institute of Science and Technology, Daegu, South Korea"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2016.2632300"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2018.2878850"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2019.8662523"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC19947.2020.9063081"},{"key":"ref5","first-page":"116","article-title":"A 112.5 Gb\/s ADC-DSP-based PAM-4 long-reach transceiver with >50dB channel loss in 5nm FinFET","volume-title":"Proc. IEEE ISSCC","author":"Guo"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/isscc42614.2022.9731794"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2938414"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/tcsii.2022.3205246"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/OJCAS.2022.3189550"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/OJCAS.2020.3040947"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2023.3234920"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2024.3362596"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/tcsii.2024.3410688"},{"key":"ref14","volume-title":"ZYNQ UltraScale+ RFSoC data sheet: Overview","year":"2023"},{"key":"ref15","volume-title":"ZCU111 evaluation board user guide","year":"2023"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2783679"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/JLT.2008.2010061"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/ISIT.1998.708791"}],"container-title":["IEEE Transactions on Circuits and Systems II: Express Briefs"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/8920\/10767315\/10649015.pdf?arnumber=10649015","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,11,27]],"date-time":"2024-11-27T19:06:43Z","timestamp":1732734403000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10649015\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,12]]},"references-count":18,"journal-issue":{"issue":"12"},"URL":"https:\/\/doi.org\/10.1109\/tcsii.2024.3450695","relation":{},"ISSN":["1549-7747","1558-3791"],"issn-type":[{"value":"1549-7747","type":"print"},{"value":"1558-3791","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024,12]]}}}