{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,2]],"date-time":"2026-07-02T05:24:20Z","timestamp":1782969860023,"version":"3.54.5"},"reference-count":15,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"1","license":[{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"funder":[{"DOI":"10.13039\/100016692","name":"Key Research and Development Program of Guangdong","doi-asserted-by":"publisher","award":["2024B0101020001"],"award-info":[{"award-number":["2024B0101020001"]}],"id":[{"id":"10.13039\/100016692","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["62401208"],"award-info":[{"award-number":["62401208"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Circuits Syst. II"],"published-print":{"date-parts":[[2025,1]]},"DOI":"10.1109\/tcsii.2024.3480706","type":"journal-article","created":{"date-parts":[[2024,10,14]],"date-time":"2024-10-14T17:29:30Z","timestamp":1728926970000},"page":"58-62","source":"Crossref","is-referenced-by-count":4,"title":["A Balanced Power Amplifier With Complementary Adaptive Bias in 28-nm Bulk CMOS for 5G Millimeter-Wave Systems"],"prefix":"10.1109","volume":"72","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-6268-276X","authenticated-orcid":false,"given":"Ning-Zheng","family":"Sun","sequence":"first","affiliation":[{"name":"School of Electronic and Information Engineering, South China University of Technology, Guangzhou, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-4643-1917","authenticated-orcid":false,"given":"Li","family":"Gao","sequence":"additional","affiliation":[{"name":"School of Microelectronics, South China University of Technology, Guangzhou, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0009-6438-9645","authenticated-orcid":false,"given":"Weisen","family":"Zeng","sequence":"additional","affiliation":[{"name":"School of Electronic and Information Engineering, South China University of Technology, Guangzhou, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jie","family":"Hu","sequence":"additional","affiliation":[{"name":"Sanechips Technology Company Ltd., Shenzhen, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Xinyang","family":"Liu","sequence":"additional","affiliation":[{"name":"Sanechips Technology Company Ltd., Shenzhen, China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3659-0586","authenticated-orcid":false,"given":"Xiu","family":"Yin Zhang","sequence":"additional","affiliation":[{"name":"School of Electronic and Information Engineering, South China University of Technology, Guangzhou, China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC.2019.8662316"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/COMST.2022.3203578"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/mwsym.2018.8439272"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/LMWC.2020.3040786"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2021.3095379"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/RFIC.2018.8429030"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2016.2563698"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/TCSII.2021.3068473"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2021.3101232"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/iws55252.2022.9977973"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/a-sscc58667.2023.10347979"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC49657.2024.10454540"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.23919\/EuMIC54520.2022.9923540"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/ISSCC49657.2024.10454427"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2022.3224439"}],"container-title":["IEEE Transactions on Circuits and Systems II: Express Briefs"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/8920\/10814916\/10716542.pdf?arnumber=10716542","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,12,25]],"date-time":"2024-12-25T06:32:57Z","timestamp":1735108377000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10716542\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,1]]},"references-count":15,"journal-issue":{"issue":"1"},"URL":"https:\/\/doi.org\/10.1109\/tcsii.2024.3480706","relation":{},"ISSN":["1549-7747","1558-3791"],"issn-type":[{"value":"1549-7747","type":"print"},{"value":"1558-3791","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025,1]]}}}