{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,1,9]],"date-time":"2026-01-09T17:08:24Z","timestamp":1767978504223,"version":"3.49.0"},"reference-count":18,"publisher":"Institute of Electrical and Electronics Engineers (IEEE)","issue":"5","license":[{"start":{"date-parts":[[2025,5,1]],"date-time":"2025-05-01T00:00:00Z","timestamp":1746057600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/ieeexplore.ieee.org\/Xplorehelp\/downloads\/license-information\/IEEE.html"},{"start":{"date-parts":[[2025,5,1]],"date-time":"2025-05-01T00:00:00Z","timestamp":1746057600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-029"},{"start":{"date-parts":[[2025,5,1]],"date-time":"2025-05-01T00:00:00Z","timestamp":1746057600000},"content-version":"stm-asf","delay-in-days":0,"URL":"https:\/\/doi.org\/10.15223\/policy-037"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["IEEE Trans. Circuits Syst. II"],"published-print":{"date-parts":[[2025,5]]},"DOI":"10.1109\/tcsii.2025.3543672","type":"journal-article","created":{"date-parts":[[2025,2,19]],"date-time":"2025-02-19T19:12:56Z","timestamp":1739992376000},"page":"753-757","source":"Crossref","is-referenced-by-count":2,"title":["ITP-PAD: A Timing Monitoring Mechanism for AVS Systems Using Intersection Timing Prediction and Path Activation Detection"],"prefix":"10.1109","volume":"72","author":[{"ORCID":"https:\/\/orcid.org\/0009-0004-5356-5299","authenticated-orcid":false,"given":"Kangning","family":"Wang","sequence":"first","affiliation":[{"name":"Smart Sensing Chip and System R&D Center, Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China"}]},{"ORCID":"https:\/\/orcid.org\/0009-0005-1688-6373","authenticated-orcid":false,"given":"Huidong","family":"Zhao","sequence":"additional","affiliation":[{"name":"Smart Sensing Chip and System R&D Center, Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China"}]},{"ORCID":"https:\/\/orcid.org\/0009-0000-5529-1421","authenticated-orcid":false,"given":"Zhi","family":"Li","sequence":"additional","affiliation":[{"name":"Smart Sensing Chip and System R&D Center, Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0942-864X","authenticated-orcid":false,"given":"Jiliang","family":"Liu","sequence":"additional","affiliation":[{"name":"Smart Sensing Chip and System R&D Center, Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9102-2111","authenticated-orcid":false,"given":"Shushan","family":"Qiao","sequence":"additional","affiliation":[{"name":"Smart Sensing Chip and System R&D Center, Institute of Microelectronics of the Chinese Academy of Sciences, Beijing, China"}]}],"member":"263","reference":[{"key":"ref1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2012.2220912"},{"key":"ref2","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2014.2328658"},{"key":"ref3","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2015.2418713"},{"key":"ref4","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2018.2821121"},{"key":"ref5","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2948164"},{"key":"ref6","doi-asserted-by":"publisher","DOI":"10.1109\/LPE.2005.195479"},{"key":"ref7","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2012.2185340"},{"key":"ref8","doi-asserted-by":"publisher","DOI":"10.1109\/ESSCIRC.2018.8494312"},{"key":"ref9","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2018.2888866"},{"key":"ref10","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2017.2749423"},{"key":"ref11","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2019.2951692"},{"key":"ref12","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2020.3023157"},{"key":"ref13","doi-asserted-by":"publisher","DOI":"10.1109\/A-SSCC58667.2023.10348009"},{"key":"ref14","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2018.2857836"},{"key":"ref15","doi-asserted-by":"publisher","DOI":"10.1109\/tvlsi.2024.3466132"},{"key":"ref16","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2019.2893294"},{"key":"ref17","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2021.3106245"},{"key":"ref18","doi-asserted-by":"publisher","DOI":"10.1109\/TVLSI.2024.3409315"}],"container-title":["IEEE Transactions on Circuits and Systems II: Express Briefs"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/8920\/10981830\/10892271.pdf?arnumber=10892271","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,5,5]],"date-time":"2025-05-05T18:01:03Z","timestamp":1746468063000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10892271\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,5]]},"references-count":18,"journal-issue":{"issue":"5"},"URL":"https:\/\/doi.org\/10.1109\/tcsii.2025.3543672","relation":{},"ISSN":["1549-7747","1558-3791"],"issn-type":[{"value":"1549-7747","type":"print"},{"value":"1558-3791","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025,5]]}}}